JPS60103168A - Continuous hot dipping method - Google Patents

Abstract

PURPOSE:To perform clean, smooth and thick hot dipping without thickness deviation and ruggedness by allowing a molten metal or alloy to overflow from the outlet part of a plating bath for continuous hot dipping of a long-sized material and moving the long-sized material within the bath surface. CONSTITUTION:A long-sized material 1 to be plated such as a wire, rod or the like consisting of Cu, Al, etc. is passed continuously via a sinker roll 12 and a guide roll 13, etc. through a hot dipping bath 12 of Zn, Sn, etc. or the alloy, etc. thereof. An overflow tank 9 to enclose the material 1 is provided in the outlet part of the bath 2 of the above-mentioned material 1 and a molten metal or alloy 11 is allowed to overflow therefrom by a rotary vane 10. The guide roll 13 is moved at the same instant and while the material 1 is traveled, the material is moved circumferentially in the plating bath surface preferably at 0.5-100mm./ sec moving speed. The outlet part is thus cleaned and the sticking of the suspended material to the material 1 is prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION (Technical Field) The present invention relates to a method of continuously applying hot-dip plating of a metal or alloy around a long material.

(Spine) ;;Technology) Conventionally, long materials such as wires, strips, tapes, etc. were not continuously hot-dipped, but patterns as shown in Figure 1 (a) to (a) were used. Ta. In the figure, a long plating moon 1 immersed in a plating bath 2 is pulled vertically.

In the figure (A), a die 3 is used as the aperture, and in the figure (B), carbon powder, flux, etc. 4 deposited on the bath is used as the aperture. In the figure (c), a so-called gas throttle is shown in which propane gas or the like is flowed into a container 6 filled with round pebbles 5. 2) In the figure, a filling container 8 filled with asbestos, ceramic fiber, etc. 7 is used.

These apertures are mechanical contacts/! j! Since the drawing is performed by +t, there is a drawback that uneven thickness tends to occur. For example, electrons? 31
i! ! Due to the heat history during over-processing, the Sn in the semi-FJ and the underlying Cu diffuse in the thin part of the plating, causing Cu to form on the edge surface.
appears, and the half + U attachment impairs the quality, so uneven thickness is a fatal defect in these applications.

In addition, if a squeezer is not used, oxides on the surface of the plating bath and residual flux after the reaction are likely to be entrained, causing bumps and other irregularities on the plating surface, as well as non-adherence.

(Disclosure of the Invention) The present invention has been made to solve the above-mentioned problems, and is a continuous hot-dip plating method that can produce a smooth and thick plated material with a clean plated surface, no uneven thickness, and no unevenness. We aim to provide the following.

The present invention is based on a method of continuously applying hot-dip plating to a long piece of metal, and the method includes overflowing the molten metal or alloy at the outlet of a plating bath and moving the long piece within the bath surface. This is a continuous hot-dip plating method characterized by:

In the present invention, a long piece refers to a long piece such as a wire, strip, tape, plate, etc., such as Cu, A7', Fe, Ni or an alloy thereof, a metal such as Nb-Ti or an alloy thereof, or a metal such as Nb-Ti, or an alloy thereof. It is a composite material.

The metal to be hot-dipped around them is, for example, Zn,
Al, Sn, Cu, Pb or an alloy thereof. In particular, the present invention is suitable for products that require thick and uniform plating of 8M by suppressing the alloy layer, such as Sn for electronic parts.
Or solder plated wire, heat resistant Zn-AJ? Alloy plated copper wire,
It is effective in manufacturing Zn-plated steel wires, etc.

Hereinafter, the present invention will be explained in detail with reference to the drawings. FIG. 2 is a sectional view for explaining an embodiment of the method of the present invention. In the figure, an overflow tank 9 surrounding the plating material 1 is provided at the outlet of the elongated plating material 1 that is vertically pulled up from the plating bath 2 . The molten metal or alloy 1 is supplied to the overflow tank 9 by rotating a rotating blade 10 connected to a variable speed motor (not shown).
1 is sent and overflowed. The device for feeding this overflow into tank 9 rotates 4 as shown in the figure.
It is not limited to O, and other (&R) may be used, such as a pump.

Due to this overflow μm, oxides or dross floating on the surface of the plating bath are overflowed and discharged, and the bath becomes considerably cleaner than the outlet No. 10, and the surface of the plated material becomes smooth. However, once oxides, dregs, etc. adhere to the bath surface around the object to be plated, they do not come off, and at some point they lift up together with the plating material and form lumps.

Therefore, in the present invention, while running the plating material l,
Move within the plating bath plane (in the plane perpendicular to the direction of movement).

This movement is carried out by moving the water-cooled guide roll I3 or guide die using the sinker roll 12 as a fulcrum. Traveling speed is 0.5-100 mm
7 seconds is preferable; if it is less than 0.5 ml/sec, the effect of cutting oxides, dross, etc. will be small, and if it exceeds 100 ml/sec, the variation in plating thickness will increase.

Further, the moving direction is preferably the circumferential direction as shown in the figure, so that the moving speed becomes uniform. On the other hand, in reciprocating motion, uneven thickness of the plating tends to occur during acceleration, deceleration, and stopping.

Due to this movement of the plating material, oxides, scum, etc. that adhere to the periphery of the plated object at the protruding part are cut off and removed by overflow, so that they do not land on the plating surface and do not cause bumps or other unevenness.

(Example) A 0.5 mrn f brass wire was hot-dipped with Zn-1%Aj' alloy by the method shown in FIG.

One overflow tank 9 has a diameter of 100 mm and a depth of 20 mm.
Using a cylindrical iron N with a back length of 0, the overflow speed is set to 0.
．． 71/'force.

The plated wire was either subjected to movement in the bath surface as shown in Table 1 or not. This was done by circumferentially moving the guide roll I3 directly above the water cooling device. While supplying brass wire at a line speed of 80 m/min, alkaline electrolytic degreasing, pickling, and Azonyl (manufactured by Imanishi Kagaku 1CIJ,
Zn-1%AI at a temperature of 450℃ after flux treatment with (trade name)! It was immersed in an alloy plating bath. The overflow at the outlet was carried out at a total length of t71.

The obtained Zn-Al! of 0,5 vuπf! Between alloy plated brass wires 110001 (0.49 at a wire speed of 200 m/min
Table 1 shows the results of investigating the number of wire breaks during wire drawing to mmf.

Table 1 From Table 1, it was found that A I and AL2 according to the present invention had no disconnection and no bumps in the longitudinal direction after plating. On the other hand, in the comparative example, a 1 line due to a bump was produced.

(Effects of the Invention) The continuous mt molten metal 1 (plating method) of the present invention configured as described above has the following effects.

By overflowing the molten metal or alloy at the outlet of the plating bath, the oxides or 1ζ loss floating in the bath are overflowed and discharged, and further moved within the long bath surface. Oxides, scum, etc. adhering to the area around the plating object on the bath surface are cut off and removed by the overflow, so the bath surface at the outlet is clean and free of any build-up caused by oxides, scum, etc. Since this does not occur, the plating surface is clean, the smooth thick plating with no uneven thickness is achieved, and defects such as bumps are eliminated.

[Brief explanation of drawings]

Figures 1 (a) to 1) do not show examples of conventional apertures.
1. This is a prayer drawing. FIG. 2 is a sectional view for explaining an embodiment of the method of the present invention. 1. Plating bath, 3. Dice, 4...
Carbon powder, flux, etc., 5 Pebbles, 6 Containers,
7 Asbestos, Ceramic Phino <41'7.8.
Page container, 9 Overflow cypress, IO rotating blade, II
- Molten gold h) ζ or alloy, I2 sinker roll, 1
3 Guide roll.

Claims (1)

[Claims] (+) J for a method of sequentially applying hot-dip plating to a long material,
- A continuous groove Mj, characterized in that the molten metal or alloy overflows at the outlet of the plating bath, and the continuous groove Mj is characterized by moving the 1JiJ long strip within the bath surface! Plating method. (2) The moving speed of the long length 44 in the bath concave is 0.5 to 100 m
m/second, and a continuous hot-dip plating method according to claim 1. (3) The continuous hot-dip plating method according to claim 1 or 2, wherein the movement of the long strip within the bath surface is circumferential movement.