JPS5998660U - 多色発光ダイオ−ド駆動回路 - Google Patents

多色発光ダイオ−ド駆動回路

Info

Publication number
JPS5998660U
JPS5998660U JP1982194681U JP19468182U JPS5998660U JP S5998660 U JPS5998660 U JP S5998660U JP 1982194681 U JP1982194681 U JP 1982194681U JP 19468182 U JP19468182 U JP 19468182U JP S5998660 U JPS5998660 U JP S5998660U
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
drive circuit
multicolor light
diode drive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982194681U
Other languages
English (en)
Inventor
正雄 田中
笹野　英二
山根　博
Original Assignee
三洋電機株式会社
鳥取三洋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三洋電機株式会社, 鳥取三洋電機株式会社 filed Critical 三洋電機株式会社
Priority to JP1982194681U priority Critical patent/JPS5998660U/ja
Publication of JPS5998660U publication Critical patent/JPS5998660U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Control Of Indicators Other Than Cathode Ray Tubes (AREA)
  • Audible And Visible Signals (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は本考案実施例の多色発光ダイオードの　　−駆
動回路の回路図、第２図は本考案に用いる発光ダイオー
ドの断面図である。　　　。 １・・・・・・発光ダイオード　２Ｚ３／・・・・・・
Ｐｎ接合、５，５・・・・・・駆動トランジスタ、６・
・・・・・発振回路、７．７−−−−−−インバータ、
１０．１０・・・・・・トランジスタ、１１・・・・・
・制御端子。　　　　　　　　。

Claims (2)

    【実用新案登録請求の範囲】
  1. （１）１つの表示面を有し異なる波長で発光する複数の
    Ｐｎ接合に電流を供給する手段と、電流を供給する手段
    に接続され直流電圧によりデユーティ比が変化する発振
    回路とを具備した事を特徴とする多色発光ダイオードの
    駆動回路。
  2. （２）前記発振回路は、ＰｎＰ　）ランジスタとｎＰｎ
    トランジスタを並列に接続し、そのコレクタ及びエミッ
    タを時定数を定める電流路に直列に接続シ、両トランジ
    スタのベース電圧をデユーティ比制御電圧とした回路で
    ある事を特徴とする前記実用新案登録請求の範囲第１項
    記載の多色発光ダイオードの駆動回路。
JP1982194681U 1982-12-21 1982-12-21 多色発光ダイオ−ド駆動回路 Pending JPS5998660U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982194681U JPS5998660U (ja) 1982-12-21 1982-12-21 多色発光ダイオ−ド駆動回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982194681U JPS5998660U (ja) 1982-12-21 1982-12-21 多色発光ダイオ−ド駆動回路

Publications (1)

Publication Number Publication Date
JPS5998660U true JPS5998660U (ja) 1984-07-04

Family

ID=30418379

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982194681U Pending JPS5998660U (ja) 1982-12-21 1982-12-21 多色発光ダイオ−ド駆動回路

Country Status (1)

Country Link
JP (1) JPS5998660U (ja)

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