JPS5996271A - Continuous sputtering device - Google Patents

Abstract

PURPOSE:To perform continuous sputtering treatment of substrates without contaminating the inside of a vacuum chamber while enabling monitoring of a sputtering condition in the stage of subjecting the many substrates to a sputtering treatment by using cylindrical deposition preventing shields provided with glass windows. CONSTITUTION:A sputtering treatment device is constituted of a rotating member 3 combined radially with four pieces of cylindrical deposition preventing shields 2 each provided with a glass window 15 in a vacuum chamber 1. A substrate 4 to be sputtered is introduced through a pressure regulation chamber 8A into the part A in the chamber 1, where the substrate is held by a substrate holder 12. Gaseous Ar 10 is introduced from the central part in the chamber 1 and the substrate is subjected to ion cleaning by a reverse sputtering treatment in the position A and thereafter the member 3 is rotated by 90 deg. to the position B where the substrate 4 is subjected to a sputtering treatment. The member 3 is rotated 90 deg. in succession to the position C from which the substrate is removed through a pressure regulation chamber 8B. Since the sputtering treatment is performed by the shields 2 provided with the windows, the continuous sputtering treatment is accomplished without contaminating the inside wall of the chamber 1 while the sputtering condition is monitored.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a continuous sputtering apparatus capable of continuously sputtering a substrate, and particularly to an air-to-air sputtering apparatus.
This invention relates to a type of sputtering apparatus.

At present, a problem with vapor deposition apparatuses such as vacuum vapor deposition, ion blating, and -sputtering is that the inside of the vacuum chamber becomes extremely dirty. especially,
In a sputtering apparatus, since the attached atoms ejected from the target are non-directional, the inside of the chamber tends to become particularly dirty. Additionally, some conventional continuous sputtering devices use anti-fouling shields, but even if the Hofu shield is attached, that part is fine, but the part of the pond that is not shielded will still get dirty. Furthermore, since the anti-fouling shield is usually made of metal, it is inconvenient that the condition of the locusts inside cannot be seen.

In view of the above points, the present invention uses a jiVJ configuration in which sputtering is performed using a cylindrical anti-adhesion shield partially formed with a glass window, thereby preventing contamination in the vacuum chamber and making it possible to monitor the internal sputtering state. In addition, the present invention provides a continuous sputtering apparatus capable of continuously sputtering a substrate by having a structure in which a plurality of the cylindrical anti-adhesive shields are combined and rotated to have a function of transferring the substrate. That is.

Embodiments of a continuous sputtering apparatus according to the present invention will be described below with reference to the drawings.

FIG. 1 shows the overall structure of a continuous sputtering apparatus, and FIG. 2 shows the structure of a cylindrical anti-adhesion shield used in that case. In these figures, in a vacuum chamber 1, a rotary part 3, which is a combination of four cylindrical anti-adhesion shields 2 arranged in a radial manner, is rotatably arranged. A carry-in path 5 for carrying in the substrate 4 is connected to one side of the vacuum chamber 1, and a carry-in path 6 for carrying the substrate 4 out is connected to the same side. A pressure adjustment chamber 8A is defined in the middle of the carry-in path 5 by a shirt tough, and a pressure control chamber 8B is defined in the carry-out path 6 by a shutter 9. Here, surface pressure adjustment chambers 8A, 8B
is located on one side of the vacuum chamber 1 so as to take up as little space as possible. vacuum chamber 1
The pressure adjustment chambers 8A and 8B are each vacuum-suctioned by an independent vacuum system. An inlet 10 for blowing out an inert gas such as argon is provided in the center of the vacuum chamber 1. Then, at the end of each cylindrical anti-adhesion shield 2 near the inlet 10, a tarded 11 for emitting metal atoms for forming a desired thin film is arranged, and at the other end, a substrate holder 1 is placed.
2 are provided respectively. This substrate holder 1
2 has a low ability to hold the substrate 4 carried into the vacuum chamber 1. The material of the circular anti-adhesion shield 2 is preferably stainless steel or the like. However, if the entire circumference of the circular anti-adhesive shield 2 is made of stainless steel, the inside cannot be seen, so a glass window 15 made of hard glass is formed in a portion.

In the above configuration, the substrate 4 supplied from the atmosphere into the pressure adjustment chamber 8A is moved into the vacuum chamber by the opening/closing operation of the shirt tough after the pressure adjustment chamber 8A reaches a high vacuum state comparable to that of the vacuum chamber 1. Jll in '-1>
The substrate is first held by the substrate holder 12 of the cylindrical anti-corrosion shield 2 at position A. At this position A, the voltage relationship is such that the target 11 is grounded and the substrate holder 12 is negative. As a result, ion cleaning of the substrate is performed by reverse sputtering. Thereafter, the rotating member 3 rotates 90 degrees, and the substrate 4 also comes to position B accordingly. At this position B, the target 11 is in a negative voltage state and the subsullate holder 12 is in a grounded state, so that normal sputtering processing is performed. The substrate 4 after sputtering is the rotating member 3
is transferred to the discharge position at position C by a further rotation of 90 degrees.

Here, the substrate 4 is attached to the substrate holder 12.
By opening and closing the shutter 9, it is transferred into a pressure adjustment chamber 8B set to a high vacuum similar to that of the vacuum chamber 1, and then taken out into the atmosphere from there. Such operations are performed continuously and sequentially.

According to the above embodiment, the following effects can be achieved.

(1) Since the target 11 is placed at one end of the cylindrical adhesion prevention shield 2 and the substrate holder 12 is placed at the other end, and the sputtering process is performed within this cylindrical adhesion prevention shield 2,
This is achieved by preventing the inconvenience of sputtered atoms adhering to the vacuum chamber 1 and contaminating it.

(2) Since a plurality of cylindrical anti-adhesion shields 2 are combined radially to form a rotating member, the substrates 4 can be sequentially rotated and transferred, allowing continuous sputtering of the substrates 4.

(3) A glass window 1 is provided on a part of the circumferential surface of the circular anti-contamination shield 2.
5 is convenient for monitoring the internal sputtering state.

(4) Substrate delivery path 5 to vacuum chamber 1
and the unloading path 6 is pulled out from one side of the chamber 1,
Since pressure adjustment chambers 8A and 8B were provided for each of them,
It is not necessary to maintain the vacuum in the vacuum chamber 1 extremely every time the substrate is carried in and carried out, and the installation space can be reduced. Further, since the substrate 4 enters from one side of the chamber 1 and comes out from the same side, it is convenient for monitoring work operations.

In addition, although the above-mentioned example showed the case where sputtering processing is not performed at position C, it is also possible to perform sputtering processing at position C as needed. It is also possible to omit the reverse sputtering at position A and perform the reverse sputtering before the vacuum chamber is brought into the chamber.

As explained above, according to the present invention, a cylindrical anti-adhesion shield having a glass window is used to perform sputtering processing inside the shield, thereby preventing contamination in the vacuum chamber and making it possible to monitor the sputtering state. At the same time, a cylindrical anti-adhesion shield is combined to form a rotating part 44 to transport the substrate (by providing a geometrical function, a continuous sputtering device that enables continuous sputtering of the substrate can be obtained) It ends with.

[Brief explanation of the drawing]

FIG. 1 is a plan sectional view showing an embodiment of a continuous sputtering apparatus according to the present invention, and FIG. 2 is a perspective view showing the structure of a cylindrical anti-adhesion shield in the embodiment. DESCRIPTION OF SYMBOLS 1... Vacuum chamber, 2... Cylindrical anti-stick shield, 3... Rotating member, 4... Substrate, 5...
- Loading path, 6... Carrying out path, 7, 9... Shutter, 8
A, 8B...Pressure adjustment chamber, 11...Target,]
2...Substrate holder, 15...Glass window. Patent applicant Tokyo Denki Kagaku Kogyo Co., Ltd. Patent attorney Takashi Murai

Claims (2)

[Claims] (1) A rotary member that is a combination of a vacuum chamber, a pressure adjustment chamber that is provided so as to be able to communicate with the inlet and outlet sides of the vacuum chamber, and a cylindrical anti-adhesive shield partially formed with a glass window, and the cylindrical member. A target disposed on the end face of the center side of the cylindrical anti-fouling shield to emit atoms, and a substrate holder disposed on the end face of the cylindrical anti-adhesion shield, from the pressure adjustment chamber on the entry side. The substrate entering the vacuum chamber is held by the substrate holder to perform sputtering, and is transferred to a discharge position by rotation of the rotary part and sent to the pressure adjustment chamber on the exit side. Continuous type or grasshopper device. (2) The continuous sputtering apparatus according to claim 1, wherein the pressure adjustment chambers on the input side and the output side are arranged on one side of the vacuum chamber.