JPS599191Y2 - heat siphon - Google Patents

Description

[Detailed explanation of the invention] This invention is installed in a heat pipe with different heights.
This invention relates to improvements to heat siphons that circulate refrigerant using gravity.

Conventional heat syphons require a certain slope along their entire length.

This causes a bend between the lower heat absorbing part and the upper heat dissipating part, and such bending partially creates peaks and valleys.

In particular, if the difference in height between the peaks and valleys becomes large and refrigerant liquid accumulates in the valleys, causing the liquid to block the pipe space, the gas evaporated in the lower heat absorbing section will flow to the upper heat dissipating section. The heat siphon will no longer be able to function properly.

Therefore, an object of the present invention is to provide a heat siphon having a structure that can still function completely even if the above-mentioned situation occurs.

According to the present invention, the above object is achieved by attaching an auxiliary pipe between the evaporated gas part and the heat radiation part in the heat absorption part to bypass the liquid reservoir part created by bending the heat siphon in the middle. Ru.

The invention will be explained below with reference to the drawings.

As shown in FIG. 1, when a bend is formed between the refrigerant reservoir D and the heat radiation section A in the heat absorption section of the heat syphon 1, an intermediate reservoir section B is created in the middle of the pipe.

If the liquid in the liquid reservoir part B blocks the pipe space as shown in the figure, the evaporative gas part C between the refrigerant reservoir D and the intermediate liquid reservoir part B
is no longer communicated with the heat radiation part A.

When this happens, the refrigerant stops circulating and the heat syphon stops functioning.

In order to avoid this, in the present invention, the evaporative gas part C
An auxiliary pipe E is attached to connect the heat dissipation section A and the heat dissipation section A.

With this structure, the refrigerant in the refrigerant reservoir D absorbs heat, evaporates, and enters the section C, but even if this space is blocked by the intermediate reservoir B, the evaporated gas is transferred to the heat radiation section A by the sub pipe E. can be reached.

The gas radiated heat in the heat radiation part A condenses and flows down to the intermediate liquid reservoir part B.
leading to.

As the number of refrigerant pipes gradually increases, it overflows from the liquid reservoir B and drips into the refrigerant reservoir D.

In this way, even if a situation occurs in which the circulation of the refrigerant stops in the past, according to the present invention, the circulation of the refrigerant, that is, the function of the heat syphon does not stop.

In addition, it is necessary to prevent the refrigerant liquid flowing in contact with the inner surface of the main pipe from entering the sub pipe, so to do this, the tip of the sub pipe must be positioned diametrically within the space from the inner surface of the main pipe. It is best to make it stick out enough.

Furthermore, the tip of the sub-pipe has a downward part 2 as shown in Fig. 2.
Alternatively, the downwardly directed portion may be expanded or converged.

Both the main pipe and the sub-pipe can be made flexible so that they can be installed in any way depending on the shape of the installation location, even if there are obstacles.In that case, even if there are multiple intermediate liquid reservoirs, the main pipe The design can be freely handled, and it is also possible to set multiple sub pipes.

As described above, the heat syphon of the present invention can still perform its function even if the heat absorption part and the heat radiation part are no longer in communication with each other due to the intermediate liquid reservoir part.

[Brief explanation of the drawing]

FIG. 1 is a diagrammatic sectional view of the heat siphon according to the present invention, and FIG. 2 is a sectional view of the tip of the sub-pipe. 1; Heat siphon, 2; Sub-pipe tip, A; Heat dissipation part, B; Intermediate liquid reservoir, C; Evaporated gas part, D; Refrigerant reservoir, E
; Vice pipe.

Claims (1)

[Scope of utility model registration request] A sub pipe is attached to the main pipe in which a bent part is formed such that cooling liquid is stored between the lower heat absorption part and the upper heat radiation part, and the evaporative gas generation part in the heat absorption part communicates with the heat radiation part. A heat syphon that is characterized by: