JPS5987136U - 金属細線用スプ−ル - Google Patents

金属細線用スプ−ル

Info

Publication number
JPS5987136U
JPS5987136U JP18357582U JP18357582U JPS5987136U JP S5987136 U JPS5987136 U JP S5987136U JP 18357582 U JP18357582 U JP 18357582U JP 18357582 U JP18357582 U JP 18357582U JP S5987136 U JPS5987136 U JP S5987136U
Authority
JP
Japan
Prior art keywords
spool
metal wire
thin metal
utility
carbon fiber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18357582U
Other languages
English (en)
Inventor
柏木　修
博 渡辺
Original Assignee
住友金属鉱山株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 住友金属鉱山株式会社 filed Critical 住友金属鉱山株式会社
Priority to JP18357582U priority Critical patent/JPS5987136U/ja
Publication of JPS5987136U publication Critical patent/JPS5987136U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Landscapes

  • Storage Of Web-Like Or Filamentary Materials (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は金属細線を巻き付けた片フランジのスプールの
説明図；第２図は断線検出装置を具えた　−ボングーの
説明図。

Claims (1)

    【実用新案登録請求の範囲】
  1. 少くともスプール胴部が体積固有抵抗１０５Ω・ｃｍ以
    下の炭素繊維含有ポリカーボネート樹脂で形成されてい
    ることを特徴とする金属細線用スプール。
JP18357582U 1982-12-03 1982-12-03 金属細線用スプ−ル Pending JPS5987136U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18357582U JPS5987136U (ja) 1982-12-03 1982-12-03 金属細線用スプ−ル

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18357582U JPS5987136U (ja) 1982-12-03 1982-12-03 金属細線用スプ−ル

Publications (1)

Publication Number Publication Date
JPS5987136U true JPS5987136U (ja) 1984-06-13

Family

ID=30397263

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18357582U Pending JPS5987136U (ja) 1982-12-03 1982-12-03 金属細線用スプ−ル

Country Status (1)

Country Link
JP (1) JPS5987136U (ja)

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