JPS5983002U - Sealing structure of electronic components - Google Patents

Sealing structure of electronic components

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Publication number
JPS5983002U
JPS5983002U JP17823182U JP17823182U JPS5983002U JP S5983002 U JPS5983002 U JP S5983002U JP 17823182 U JP17823182 U JP 17823182U JP 17823182 U JP17823182 U JP 17823182U JP S5983002 U JPS5983002 U JP S5983002U
Authority
JP
Japan
Prior art keywords
sealing structure
electronic components
case
abstract
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17823182U
Other languages
Japanese (ja)
Inventor
三浦　信宏
Original Assignee
ティーディーケイ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ティーディーケイ株式会社 filed Critical ティーディーケイ株式会社
Priority to JP17823182U priority Critical patent/JPS5983002U/en
Publication of JPS5983002U publication Critical patent/JPS5983002U/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来例に係る電子部品の封止構造を示す説明図
、第２区は本考案に係る電子部品の封止構造を示す説明
図、第３図ａ、　　ｂ及び第４．５図はケースの成形方
法を示す説明図である。 Ａ（ｔ、　ｌ）・・・・・・動作部分、Ｂ１・・・・・
・ケース、Ｂ２・・・・・・埋込み樹脂。Fig. 1 is an explanatory diagram showing a sealing structure of an electronic component according to a conventional example, Section 2 is an explanatory diagram showing a sealing structure of an electronic component according to the present invention, Figs. 3a and b, and Figs. 4.5. FIG. 2 is an explanatory diagram showing a method of molding the case. A(t, l)...Moving part, B1...
・Case, B2...Embedded resin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 一端側を開放した所定形状のケース内に動作部分を嵌装
配置し、そのケース内を樹脂注入で埋込み固着してなる
ことを特徴とする電子部品の封止構造。A sealing structure for an electronic component, characterized in that a working part is fitted into a case of a predetermined shape with one end open, and the inside of the case is embedded and fixed by injection of resin.
JP17823182U 1982-11-25 1982-11-25 Sealing structure of electronic components Pending JPS5983002U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17823182U JPS5983002U (en) 1982-11-25 1982-11-25 Sealing structure of electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17823182U JPS5983002U (en) 1982-11-25 1982-11-25 Sealing structure of electronic components

Publications (1)

Publication Number Publication Date
JPS5983002U true JPS5983002U (en) 1984-06-05

Family

ID=30387012

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17823182U Pending JPS5983002U (en) 1982-11-25 1982-11-25 Sealing structure of electronic components

Country Status (1)

Country Link
JP (1) JPS5983002U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016066729A (en) * 2014-09-25 2016-04-28 Ｎｅｃネットワークプロダクツ株式会社 Packaging method of electronic components and electronic components

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016066729A (en) * 2014-09-25 2016-04-28 Ｎｅｃネットワークプロダクツ株式会社 Packaging method of electronic components and electronic components

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