JPS59784Y2 - Structure of printed board mounting frame - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a printed board mounting frame, particularly to the structure of a printed board mounting frame in which a large number of printed board mounting frames are stored in parallel in a shelf frame that is fixed in multiple stages in the vertical direction of an electronic device rack.

In general, communication equipment such as electronic exchanges is installed using printed board storage shelf frames (printed board storage shelf frames) that are fixed vertically in multiple stages between the left and right columns of the racking equipment.
consists of shelves).

In this case, the printed board is not directly stored in the shelf frame, but is mounted in a rectangular mounting frame 1 as shown by the two-dot chain line in Fig. 5 to facilitate handling. 1 are arranged in parallel within the shelf frame of the above-mentioned racking device.

That is, the upper and lower ends of the printed board are connected to mounting brackets 9 and 10, respectively.
and 7 and 8 to the upper frame 2 and lower frame 3, and the front and rear ends are respectively fixed to the front and rear side frames 4 and 5 via mounting brackets 14 and 15 and mounting brackets of the same shape as these (not shown). death,
The long grooves 6 and 11 formed on the upper and lower frames 2 and 3 connect to corresponding guide tracks (
(not shown).

However, in conventional printed board mounting, the frame is the upper and lower frame 2.3 above.
Since the width of the front and rear side frames 4 and 5 is equal to the width of the front and rear side frames 4 and 5, when a large number of boards are stored in parallel in the printed board storage shelf frame, the adjacent mounting frames are almost close to each other and only an extremely small gap is formed. do not have.

Therefore, it becomes difficult for the cooling air flowing in from below the rack to pass through this small gap, and the heat generated from the semiconductor elements mounted on the printed circuit board fills the shelf frame, causing the temperature of the entire electronic equipment rack to rise. This caused a rise in the properties of semiconductor devices.

The purpose of the present invention is to provide an improved printed board mounting frame to improve the convective heat dissipation effect of printed board mounted elements when a large number of the mounting frames are stored in parallel in a shelf frame of an electronic equipment rack; The purpose is to hold the printed board surface vertically within the shelf frame of the electronic equipment rack, and to horizontally move the multiple printed board mounting frames to which printed boards are attached. In the rack device configured to be stored in parallel, the printed board mounting frame is formed in a rectangular shape by rectangular front and rear side frames, and an upper frame and a lower frame that connect the front and rear side frames, and the front and rear sides of the shelf frame are A sliding guide groove or a guide strip is formed in the front-rear direction of the outer surface of the upper frame and the lower frame extending in the direction in which the sliding guide means is fixedly installed on the shelf frame side. The width of the upper frame and the lower frame is narrower than the width of the front and rear side frames to promote convective heat dissipation in the vertical direction within each stored printed board mounting frame. It is distantly related to the structure of the printed board mounting frame.

Hereinafter, the present invention will be explained by way of examples with reference to the accompanying drawings.

FIG. 1 is a perspective view showing a printed board mounting frame structure according to the present invention, in which a rectangular printed board shown by an imaginary line consisting of two-dot chain lines can be mounted.

The printed board has mounting brackets 1 at its upper and lower ends, respectively.
Fixed at 09, 110 and 107, 108 (not shown)
The mounting fittings 109, 110 and the upper frame 102, and the mounting fittings 107, 108 and the lower frame 103 each have a structure of four pieces.

(Figure 4). The upper frame 102 is made of iron and has a groove-shaped cross section, and a long groove 106 is formed in the longitudinal direction (FIGS. 1 and 2).
0 guide track 201 (FIG. 3).

The shelf frame 200 is fixed between the frame columns (not shown) of an electronic equipment rack via flanges 206 and 207.

In addition, the shelf frame 200 has a rectangular parallelepiped shape as a whole, the front and rear surfaces are open, and the top and bottom surfaces have a structure that does not impede convection airflow, and are provided with long grooves 106 and 111 (Figs. 1 and 2). ) and the protrusion-shaped guide tracks 201 and 202 correspond to (
Figure 3).

Note that the lower frame 103 has the same shape and structure as the upper frame 102 described above.

On the other hand, the front ends of the upper and lower frames 102 and 103 are supported by a rectangular front side frame 104, and the rear ends are supported by screws 113 in a rectangular rear side frame 105 in which an elongated hole 112 is formed. figure).

Also, the width W of the upper and lower frames 102 and 103 is the front and rear side frames 10
Approximately i of the width U of 4,105, the long groove 106,
It is equal to the width of 111.

By configuring the structure 100 of the printed board mounting frame as described above, the long groove 106° 111 is guided from the direction of arrows A and B to the corresponding guide track 201. of the shelf frame 200, as shown in FIG.
202.

If a plurality of printed board mounting frames are stored in parallel in the shelf frame 200 in such a compatible state, the gap size between adjacent mounting frames will be larger by approximately U-W compared to the conventional case, and this increased gap size will be The heat generated by the semiconductor elements mounted on the printed circuit board can easily escape upward through the electronic equipment rack, and the temperature of the entire electronic equipment rack is maintained at an appropriate value, and its accuracy is also improved.

[Brief explanation of drawings]

Fig. 1 is a perspective view showing the structure of the printed board mounting frame according to the present invention, Fig. 2 is a sectional view taken along line II-II in Fig. 1, and Fig. 3 is the mounting frame of the present invention and the printed board storage shelf. FIG. 4 is a partially cutaway perspective view of the upper frame of the mounting frame of the present invention, and FIG. 5 is a perspective view showing the structure of a conventional printed board mounting frame. 100... Printed board mounting frame of the present invention, 102,
103,106゜111...Upper and lower frame and guide groove, 104,105...Front and rear side frames, 200...
... Shelf frame, 201.202 ... Guide strip, W
... Upper and lower frame width, U ... Front and rear side frames.

Claims (1)

[Scope of utility model registration request] In an electronic device racking device in which a large number of printed board mounting frames to which printed boards are attached are stored in parallel in a horizontal direction by holding the printed board surface vertically within the shelf frame of the electronic equipment racking device,
The printed board mounting frame is formed into a rectangular shape by rectangular front and rear side frames, and an upper frame and a lower frame that connect the front and rear side frames, and the upper frame and lower frame extend in the front and back direction of the shelf frame. A sliding guide groove or a guide strip is formed in the front-rear direction of the outer surface of the frame to be guided by sliding guide means fixed to the shelf frame side, and the width of the upper frame and the lower frame is A structure of a printed board mounting frame characterized in that the width is narrower than the width of the front and rear side frames.