JPS5977250U - light emitting diode - Google Patents

light emitting diode

Info

Publication number
JPS5977250U
JPS5977250U JP17344682U JP17344682U JPS5977250U JP S5977250 U JPS5977250 U JP S5977250U JP 17344682 U JP17344682 U JP 17344682U JP 17344682 U JP17344682 U JP 17344682U JP S5977250 U JPS5977250 U JP S5977250U
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
lead
cylindrical lead
rod
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17344682U
Other languages
Japanese (ja)
Inventor
梅根　治
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP17344682U priority Critical patent/JPS5977250U/en
Publication of JPS5977250U publication Critical patent/JPS5977250U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図および第２図は従来の異なる発光ダイオードの断
面図を示し、第３図および第４図はこの考案の異なる実
施例の発光ダイオードの断面図を示す。 ７・・・・・・発光素子、８・・・・・・金属細線、９
・・・・・・透明樹脂、２１．３１・・・・・・筒状リ
ード、２２．３２・・・・・・反射面、２３・・・」・
・絶縁物、２４・・・・・・棒状リニド。1 and 2 show cross-sectional views of different conventional light emitting diodes, and FIGS. 3 and 4 show cross-sectional views of light emitting diodes of different embodiments of this invention. 7...Light emitting element, 8...Thin metal wire, 9
......Transparent resin, 21.31...Cylindrical lead, 22.32...Reflective surface, 23...''・
- Insulator, 24... Rod-shaped linide.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 少なくとも先端部内面にテーパ状の反射面を有する筒状
リード内に絶縁物を介して棒状リードを固着し、棒状リ
ードの先端面に発光素子を固着して、発光素子の表面電
極を金属細線を介して筒状リードに接続し、筒状リード
の反射面部に透明樹脂を充填してなる発光ダイオード。A rod-shaped lead is fixed via an insulator in a cylindrical lead that has a tapered reflective surface on the inner surface of at least the tip, a light emitting element is fixed to the tip surface of the rod-shaped lead, and the surface electrode of the light emitting element is connected to a thin metal wire. A light emitting diode that is connected to a cylindrical lead through the cylindrical lead, and the reflective surface of the cylindrical lead is filled with transparent resin.
JP17344682U 1982-11-15 1982-11-15 light emitting diode Pending JPS5977250U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17344682U JPS5977250U (en) 1982-11-15 1982-11-15 light emitting diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17344682U JPS5977250U (en) 1982-11-15 1982-11-15 light emitting diode

Publications (1)

Publication Number Publication Date
JPS5977250U true JPS5977250U (en) 1984-05-25

Family

ID=30377844

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17344682U Pending JPS5977250U (en) 1982-11-15 1982-11-15 light emitting diode

Country Status (1)

Country Link
JP (1) JPS5977250U (en)

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