JPS5970790A - 部分メツキ装置 - Google Patents
部分メツキ装置Info
- Publication number
- JPS5970790A JPS5970790A JP18017482A JP18017482A JPS5970790A JP S5970790 A JPS5970790 A JP S5970790A JP 18017482 A JP18017482 A JP 18017482A JP 18017482 A JP18017482 A JP 18017482A JP S5970790 A JPS5970790 A JP S5970790A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- plating solution
- plated
- pipe
- pipes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims description 106
- 239000000463 material Substances 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 17
- 239000007788 liquid Substances 0.000 description 15
- 238000005452 bending Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000003788 bath preparation Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18017482A JPS5970790A (ja) | 1982-10-14 | 1982-10-14 | 部分メツキ装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18017482A JPS5970790A (ja) | 1982-10-14 | 1982-10-14 | 部分メツキ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5970790A true JPS5970790A (ja) | 1984-04-21 |
| JPS624472B2 JPS624472B2 (Direct) | 1987-01-30 |
Family
ID=16078684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18017482A Granted JPS5970790A (ja) | 1982-10-14 | 1982-10-14 | 部分メツキ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5970790A (Direct) |
-
1982
- 1982-10-14 JP JP18017482A patent/JPS5970790A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS624472B2 (Direct) | 1987-01-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR890005858A (ko) | 반도체장치의 제조방법 및 그 제조장치 | |
| JPS5837190A (ja) | 部分メツキ方法及びその装置 | |
| CN110408978A (zh) | 一种基于电化学沉积的金属微构件互联方法 | |
| JPS5970790A (ja) | 部分メツキ装置 | |
| GB786281A (en) | Improvements in or relating to methods of manufacturing semiconductor systems | |
| CN208674438U (zh) | 连接器的电连接组件、连接器以及电子设备 | |
| CN101492831B (zh) | 电镀用阳极装置及包括该阳极装置的电镀装置 | |
| JPS5974292A (ja) | 部分メツキ装置 | |
| CN203715750U (zh) | 一种用于pcb金属沉积补镀装置 | |
| JPS5970789A (ja) | 部分メッキ法 | |
| JPS5881989A (ja) | 部分メツキ方法 | |
| JPS6131197B2 (Direct) | ||
| JPS6092497A (ja) | メツキ装置 | |
| CN111190502B (zh) | 一种可防止触摸屏微短路的生产工艺 | |
| JP3196941B2 (ja) | めっき装置 | |
| CN213028692U (zh) | 一种fpc柔性线路板 | |
| JPS6128037B2 (Direct) | ||
| JPS627280B2 (Direct) | ||
| JP2000156557A (ja) | 配線部材の製造法 | |
| CN203360615U (zh) | 一种微型电极电镀工艺 | |
| CN219621290U (zh) | 一种电镀槽 | |
| JP2005154839A (ja) | 電子部品用めっき治具及び電解めっき装置 | |
| CN211267252U (zh) | 一种具有良好散热性能的调速线路板 | |
| JP3221519B2 (ja) | めっき装置 | |
| TWI720890B (zh) | 載具 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |