JPS5970351U - Forced air-cooled semiconductor device for vehicles - Google Patents

Forced air-cooled semiconductor device for vehicles

Info

Publication number
JPS5970351U
JPS5970351U JP16627782U JP16627782U JPS5970351U JP S5970351 U JPS5970351 U JP S5970351U JP 16627782 U JP16627782 U JP 16627782U JP 16627782 U JP16627782 U JP 16627782U JP S5970351 U JPS5970351 U JP S5970351U
Authority
JP
Japan
Prior art keywords
semiconductor device
forced air
vehicles
cooled semiconductor
cooled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16627782U
Other languages
Japanese (ja)
Inventor
清 斉藤
板鼻 博
仁浩 張
Original Assignee
株式会社日立製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社日立製作所 filed Critical 株式会社日立製作所
Priority to JP16627782U priority Critical patent/JPS5970351U/en
Publication of JPS5970351U publication Critical patent/JPS5970351U/en
Pending legal-status Critical Current

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来形半導体装置の平面図、第シ図はその正面
図、第3図は第2図の■−■矢視断面図、第4図は本考
案の半導体装置の正面図、第5図は第4図の■−■矢視
断面図、第6図は本考案の応用例の詳細図である。 10・・・金網、11・・・カバー、12・・・吸音材
FIG. 1 is a plan view of a conventional semiconductor device, FIG. 5 is a sectional view taken along the line ■-■ in FIG. 4, and FIG. 6 is a detailed view of an application example of the present invention. 10...wire mesh, 11...cover, 12...sound absorbing material.

Claims (1)

【実用新案登録請求の範囲】 1 半導体スタック・リアクトル類およびこれらを冷却
する電動送風機を備えた半導体装着において、排風口部
に排風方向とほぼ直角にカバーを設けたことを特徴とす
る車両用強制空冷式半導体装置。 2 実用新案登録請求の範囲第1項において、カバーの
内面に吸音材を取付けたことを特徴とする車両用強制空
冷式半導体装置。
[Scope of Claim for Utility Model Registration] 1. A semiconductor mounting device equipped with a semiconductor stack reactor and an electric blower for cooling the same, for a vehicle, characterized in that a cover is provided at the exhaust port section at a nearly right angle to the exhaust direction. Forced air-cooled semiconductor device. 2. A forced air-cooled semiconductor device for a vehicle as set forth in claim 1 of the utility model registration claim, characterized in that a sound absorbing material is attached to the inner surface of the cover.
JP16627782U 1982-11-04 1982-11-04 Forced air-cooled semiconductor device for vehicles Pending JPS5970351U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16627782U JPS5970351U (en) 1982-11-04 1982-11-04 Forced air-cooled semiconductor device for vehicles

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16627782U JPS5970351U (en) 1982-11-04 1982-11-04 Forced air-cooled semiconductor device for vehicles

Publications (1)

Publication Number Publication Date
JPS5970351U true JPS5970351U (en) 1984-05-12

Family

ID=30364060

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16627782U Pending JPS5970351U (en) 1982-11-04 1982-11-04 Forced air-cooled semiconductor device for vehicles

Country Status (1)

Country Link
JP (1) JPS5970351U (en)

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