JPS5968930A - Wafer holder for wafer cleaning device - Google Patents

Wafer holder for wafer cleaning device

Info

Publication number
JPS5968930A
JPS5968930A JP17930382A JP17930382A JPS5968930A JP S5968930 A JPS5968930 A JP S5968930A JP 17930382 A JP17930382 A JP 17930382A JP 17930382 A JP17930382 A JP 17930382A JP S5968930 A JPS5968930 A JP S5968930A
Authority
JP
Japan
Prior art keywords
wafer
hole
holder
base body
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17930382A
Other languages
Japanese (ja)
Inventor
Bunji Takeuchi
竹内　文二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP17930382A priority Critical patent/JPS5968930A/en
Publication of JPS5968930A publication Critical patent/JPS5968930A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

PURPOSE:To clean a plurality of wafers efficiently by a method wherein the perforated holes in which wafers are immersed and held with their semiconductor elements forming surfaces upside are provided at the center of a plurality of bases and these bases are piled by supporting culumns with a certain interval and supersonic vibration is applied from the top onto the element forming surfaces. CONSTITUTION:A wafer holder 30 is composed of a plurality of bases 20 each of which holds a wafer and which are piled by supporting culumns 25 with a certain interval. A through-hole 22 which has a diameter a little bit larger than that of the wafer 21 and in which the wafer 21 is stored with its element forming surface upside is perforated in each base 20 and the wafer 21 is immersed in the hole 22 with its top surface at the same level as the base and prevented from dropping by a circular supporting edge 23 provided in the hole 22. The circumference of the wafer 21 is fixed by the fitting 24. With this constitution, the wafer 21 is immersed in each base 20 and supersonic vibration is applied from the top of the holder 30 to make foreign substances on each element forming surface drop off.

Description

【発明の詳細な説明】 〔発明の技術分野〕 本発明は、ウェハ洗浄装置用ウェハ保持具に関する。[Detailed description of the invention] [Technical field of invention] The present invention relates to a wafer holder for a wafer cleaning apparatus.

〔発明の技術的背景〕[Technical background of the invention]

半導体装置の製造工程の一つであるウェハの洗浄工程で
は、酸、アルカリ、有機溶剤、水等を用いてウェハの洗
浄が行われている。このようなウェハの洗浄処理は、例
えば、第１図に示すようなウェハ洗浄装置用ウェハ保持
具（以下、単に保持具と記す。）に１０枚程度のウェノ
・１を収容し、このウェハ保持具を洗浄装置内に浸漬す
ることによシ行われている。ウェノ・保持具旦は、耐薬
品性、耐熱性に優れた樹脂等の部材で形成されている。2. Description of the Related Art In a wafer cleaning process, which is one of the steps for manufacturing semiconductor devices, wafers are cleaned using acids, alkalis, organic solvents, water, and the like. In this wafer cleaning process, for example, about 10 wafers 1 are stored in a wafer holder (hereinafter simply referred to as holder) for a wafer cleaning device as shown in FIG. This is done by immersing the tool in a cleaning device. The metal holder is made of a material such as resin that has excellent chemical resistance and heat resistance.

洗浄処理は、ウニ／・保持具１０を浸漬した洗浄液に、
通常超音波による振動を加えて、ウェハ１の表面に付着
した物を除去している。ウェハ保持具１ｏは、上部を開
口した箱状体２の対向する内壁面に、ウェハ１の肉厚に
略等しい溝幅のウェハ収容溝３を多数本形成し、このウ
ェハ収容溝３によってウェハ１の縁部を把持するように
なっている。従って、ウェハ１は、立設した状態で洗浄
液内に設置されるようになっている。In the cleaning process, the sea urchin/・holding tool 10 is immersed in a cleaning solution.
Usually, ultrasonic vibrations are applied to remove substances attached to the surface of the wafer 1. In the wafer holder 1o, a large number of wafer accommodating grooves 3 having a groove width approximately equal to the thickness of the wafer 1 are formed on the opposing inner wall surfaces of a box-like body 2 having an open top. It is designed to be gripped by the edges. Therefore, the wafer 1 is placed in the cleaning liquid in an upright state.

〔背原技術の問題点〕[Problems with spine technology]

而して、超音波振動子は、洗浄装置の洗浄槽の底部等に
設けられている。このため、超音波振動子から発せられ
た振動は、洗浄液を媒介にしてウェハ１の被洗浄面に対
して平行に伝播する。しかも、ウェハ収容溝３の溝幅は
、ウェノ・１の出入操作を容易にするため、ウェハ１の
肉厚よりも僅に大きく設定されている。このため、洗浄
処理の際にウェハ１が確実に固定されていす、振動する
。その結果、ウェハ１の表面の付着物を完全に除去する
ことができない。また、ウェハ１の表面に、例えばレー
ザスクライビング工程で保護用のレジスト膜が被着して
いた場合には、レーザ照射によってし・シスト膜が硬化
して強固にウェハ１の表面に付着している。このため、
スクライビング処理後にウェハ１の表面に残存したレジ
スト膜等の付着物を、洗浄処理の際に確実に除去できな
い。その結果、信頼性の低い不良の半導体製品ができる
問題があった。The ultrasonic vibrator is provided at the bottom of the cleaning tank of the cleaning device. Therefore, the vibrations emitted from the ultrasonic vibrator propagate parallel to the surface to be cleaned of the wafer 1 through the cleaning liquid. Furthermore, the groove width of the wafer storage groove 3 is set to be slightly larger than the thickness of the wafer 1 in order to facilitate the operation of inserting and removing the wafer 1. Therefore, during the cleaning process, the wafer 1 is securely fixed and vibrates. As a result, the deposits on the surface of the wafer 1 cannot be completely removed. In addition, if a protective resist film has been deposited on the surface of the wafer 1 during, for example, a laser scribing process, the cyst film is hardened by laser irradiation and firmly adheres to the surface of the wafer 1. . For this reason,
Adherents such as a resist film remaining on the surface of the wafer 1 after the scribing process cannot be reliably removed during the cleaning process. As a result, there is a problem in that defective semiconductor products with low reliability are produced.

〔発明の目的〕[Purpose of the invention]

本発明は、ウェノ・の表面に付着した付着物を超音波洗
浄工程中に確実に除去することができるウェハ洗浄装置
用ウェノ・保持具を提供することをその目的とするもの
である。SUMMARY OF THE INVENTION An object of the present invention is to provide a wafer holder for a wafer cleaning apparatus that can reliably remove deposits attached to the surface of the wafer during an ultrasonic cleaning process.

〔発明の概要〕[Summary of the invention]

本発明は、ウェノ・の半導体素子形成面を超音波振動子
と対向させ、裏面側からウニ”を固定するようにしたこ
とにより、超音波振動子より発せられる振動を被洗浄面
に対して直角に当てると共に、ウェノ＼の固定を確実に
することによって、ウェノ・の表面に付着した付着物を
超音波洗浄工程中に確実に除去できるようにしたウェハ
洗浄装置用ウェノ・保持共である。In the present invention, the semiconductor element forming surface of the ultrasonic transducer is placed opposite the ultrasonic vibrator, and the ultrasonic vibrator is fixed from the back side, thereby directing the vibrations emitted from the ultrasonic vibrator at right angles to the surface to be cleaned. This wafer holder for wafer cleaning equipment is designed to ensure that the wafer is firmly fixed in place so that deposits on the surface of the wafer can be reliably removed during the ultrasonic cleaning process.

〔発明の実施例〕[Embodiments of the invention]

以下、本発明の実施例について図面を参照して説明する
。Embodiments of the present invention will be described below with reference to the drawings.

第２図（Ａ）は、本発明の一実施例の平面図、同図（Ｂ
）は、同実施例の正面図、第３図は、同実施例の斜視図
である。図中２０は、被洗浄体であるウェハ２１の径よ
シも僅に大きい径のｌホ通孔２２を穿設した基体である
。貫通孔２２の内周面には、ウェハ２１の肉厚に略等し
い深さのところに、周面に沿って環状にウェハ支持縁部
２３が突出している。ウェハ支持縁部２３は、環状に限
らず、貫通孔２２の内周面からその中心部に向って突出
して、ウェハ２１の下面を支持する作用を有するもので
あれば如何なるものでも良い。基体２００表面には、貫
通孔２２の近傍に立設したとめ一ンによって一端部を回
動自在に保持されたウェハ固定具２４が１対設けられて
いる。ウェハ固定具２４は、その先端部を貫通孔２２上
に導出することにより、第４図に示す如く、貫通孔２２
内に収納されたウェハ２１の表面を押圧して、ウェハ支
持縁部２３とでウェハ２１の位置を固定するようになっ
ている。このウェハ固定具２４の数及び配置は、ウェハ
２１の大きさ等に応じて適宜設定するのが望ましい。ま
た、基体２０の表面には、相対向するウェハ固定具２０
を結ぶ直線と略直交する位置関係をなす地点に、１対の
支持柱２５が立設している。基体２０の裏面側には、こ
の支持柱２５と対応する位置に１対の支持枝嵌入孔２６
が穿設されている。而して、このように構成されたウェ
ハ洗浄装置用ウェハ保持具１互（以下、単にウェハ保持
具と記す。）は、第５図に示す如く、支持柱２５の先端
部を他のウェハ保持具３０の支持枝嵌入孔２６に嵌入す
ることによって、容易に所望の数だけ積層できるように
なっている。FIG. 2(A) is a plan view of an embodiment of the present invention, and FIG. 2(B) is a plan view of an embodiment of the present invention.
) is a front view of the same embodiment, and FIG. 3 is a perspective view of the same embodiment. In the figure, reference numeral 20 denotes a base body in which a through hole 22 having a diameter slightly larger than that of the wafer 21 which is the object to be cleaned is bored. A wafer support edge 23 protrudes annularly from the inner peripheral surface of the through hole 22 at a depth approximately equal to the thickness of the wafer 21 along the peripheral surface. The wafer support edge 23 is not limited to an annular shape, and may be of any shape as long as it protrudes from the inner peripheral surface of the through hole 22 toward the center thereof and has the function of supporting the lower surface of the wafer 21. A pair of wafer fixing devices 24 are provided on the surface of the base body 200, one end of which is rotatably held by a stopper placed upright near the through hole 22. By leading the tip of the wafer fixture 24 onto the through hole 22, as shown in FIG.
By pressing the surface of the wafer 21 housed inside, the position of the wafer 21 is fixed with the wafer support edge 23. It is desirable that the number and arrangement of the wafer fixtures 24 be set appropriately depending on the size of the wafer 21 and the like. Further, on the surface of the base body 20, opposing wafer fixtures 20 are provided.
A pair of support columns 25 are erected at points that are substantially perpendicular to the straight line connecting the two. A pair of support branch fitting holes 26 are provided on the back side of the base body 20 at positions corresponding to the support columns 25.
is drilled. As shown in FIG. 5, the wafer holder for the wafer cleaning apparatus constructed in this way (hereinafter simply referred to as wafer holder) connects the tip of the support column 25 to the other wafer holder. By fitting into the support branch insertion hole 26 of the tool 30, a desired number of layers can be easily stacked.

ここで、ウェハ保持具二を構成する基体２０、ウェハ固
定具２４．支持柱２５等の材質は、ウェハ２１の洗浄液
に侵されないものであれば金属、樹脂等如何なるものを
使用しても良い。また、支持柱２５の形状、配置は、ウ
ェハ保持具３０の形状、ウェハ２１の大きさ等に応じて
適宜設定するのが望ましい。基体２０の形状は、ウェハ
２１を収容する貫通孔２２を穿設すると共に、支持柱２
５及びウェハ固定具２４を取付けることができるもので
あれば、如何なるものでも良い。また、貫通孔２２の径
は、ウェハ２１の径の約２％分だけ大きく設定しておく
のが望ましい。基体２０の肉厚は、ウェハ２１の肉厚の
約５〜１０倍とし、基体２０の裏面側での貫通孔２２の
径は、ウェハ２１の径の約２多分だけ小さく設定してお
くのが望ましい。Here, a base body 20, a wafer fixture 24, and a wafer fixture 24, which constitute a wafer holder 2, are shown. The support columns 25 and the like may be made of any material, such as metal or resin, as long as it is not corroded by the cleaning solution for the wafer 21. Further, the shape and arrangement of the support columns 25 are desirably set appropriately depending on the shape of the wafer holder 30, the size of the wafer 21, and the like. The shape of the base body 20 includes a through hole 22 for accommodating the wafer 21, and a support column 2.
5 and the wafer fixture 24 can be attached. Further, the diameter of the through hole 22 is desirably set to be approximately 2% larger than the diameter of the wafer 21. The thickness of the base body 20 should be about 5 to 10 times the thickness of the wafer 21, and the diameter of the through hole 22 on the back side of the base body 20 should be set to be about 2 times smaller than the diameter of the wafer 21. desirable.

このように構成されたウェハ保持具３０によれば、第４
図に示す如く、ウェハ２１の半導体素子形成面２１ａを
ウェハ支持縁部２３側に向けて、貫通孔２２内に収納し
、ウェハ２１の裏面側をウェハ固定具２４で押圧する。According to the wafer holder 30 configured in this way, the fourth
As shown in the figure, the wafer 21 is housed in the through hole 22 with the semiconductor element formation surface 21a facing the wafer support edge 23 side, and the back side of the wafer 21 is pressed by the wafer fixture 24.

このようにしてウェハ２１を収納したウェハ保持具ユヱ
の複数個を、第５図に示す如く、ウェハ保持具３０の支
持桟嵌入孔２６内に、他のウェハ保持具ユヱの支持柱を
嵌入して所望段数だけ積層する。これを洗浄装置の洗浄
槽内に設定して、洗浄槽の底部に設けられた超音波振動
子により振動を加え、ウェハ２１の洗浄を行う。洗浄処
理の際に、全てのウェハ２１は、ウェハ固定具２４によ
ってその位置を確実に固定されている。As shown in FIG. 5, the plurality of wafer holder units storing the wafers 21 in this manner are inserted into the support bar fitting holes 26 of the wafer holder 30, and the support columns of other wafer holder units are inserted into the support columns of the wafer holders 30. Insert and stack the desired number of layers. This is set in a cleaning tank of a cleaning device, and vibration is applied by an ultrasonic vibrator provided at the bottom of the cleaning tank to clean the wafer 21. During the cleaning process, all wafers 21 are securely fixed in position by wafer fixtures 24.

しかも、ウェハ２１は、水平状態で洗浄槽内に設置され
ている。このためウェハ２１の表面と超音波振動子とは
平行状態に配置されるので、振動子から発せられた振動
は、ウェハ２ノの表面に対して垂直に伝播する。その結
果、極めて高い洗浄作用の下にウェハ２１の表面を洗浄
することができる。従って、ウェハ２ノの表面にレーデ
スクライビング処理等によってレノスト膜等が強固に付
着していても、容易にかつ確実に除去することができる
。その結果、信頼性の高い半導体製品を容易に得ること
ができる。Moreover, the wafer 21 is placed in the cleaning tank in a horizontal state. Therefore, since the surface of the wafer 21 and the ultrasonic vibrator are arranged in parallel, the vibrations emitted from the vibrator propagate perpendicularly to the surface of the wafer 2. As a result, the surface of the wafer 21 can be cleaned with extremely high cleaning action. Therefore, even if the Lenost film or the like is firmly attached to the surface of the wafer 2 due to a laser scribing process or the like, it can be easily and reliably removed. As a result, highly reliable semiconductor products can be easily obtained.

〔発明の効果〕〔Effect of the invention〕

以上説明した如く、本発明に係るウェハ洗浄装置用ウェ
ハ保持具によれば、ウェハの表面に付着した付着物を超
音波洗浄工程中に確実に除去することができるものであ
る。As explained above, according to the wafer holder for a wafer cleaning apparatus according to the present invention, deposits attached to the surface of the wafer can be reliably removed during the ultrasonic cleaning process.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、従来のウェハ洗浄装置用ウェハ保持具の斜視
図、第２図囚は、本発明の一実施例の平面図、同図（Ｂ
）は、同実施例の正面図、第３図゛は、同実施例の斜視
図、第４図は、同実施例のウェハ保持具にウェノ・を収
納した状態を示す断面図、第５図は、同つェノ・保持共
を多段に積層した状態を示す斜視図である。 ２０・・・基体、２１・・・ウニ”、２１ａ・・・半導
体素子形成面、２２・・・貫通孔、２３・・・ウェノ・
支持縁部、２４・・・ウェノ・固定具、２５・・・支持
柱、２６・・・支持枕嵌入孔、３０・・・ウェノ・保持
具。 出願人代理人　　弁理士　鈴　江　武　彦第７図 秒 第３閏FIG. 1 is a perspective view of a conventional wafer holder for a wafer cleaning device, and FIG. 2 is a plan view of an embodiment of the present invention.
) is a front view of the same embodiment, FIG. 3 is a perspective view of the same embodiment, FIG. 4 is a sectional view showing the state in which the wafer is stored in the wafer holder of the same embodiment, and FIG. FIG. 2 is a perspective view showing a state in which the same actuator and holder are stacked in multiple stages. 20...Base body, 21...Uni", 21a...Semiconductor element forming surface, 22...Through hole, 23...Uni"
Support edge, 24... Weno/fixing tool, 25... Support column, 26... Support pillow insertion hole, 30... Weno/holder. Applicant's Representative Patent Attorney Takehiko Suzue Figure 7 Second 3rd Interval

Claims (2)

【特許請求の範囲】[Claims] （１）　　ウェハの径より僅に大きい径の貫通孔を穿設
した基体と、該基体の表面側から前記ウェハの肉厚に略
等しい深さで前記貫通孔の内周面部分に突出したウェハ
支持縁部と、前記貫通孔の近傍の前記基体の表面上に回
動自在に取付けられたウェハ固定具とを具備することを
特徴とするウェハ洗浄装置用ウェハ保持具。(1) A base body having a through hole with a diameter slightly larger than the diameter of the wafer, and a wafer that protrudes from the surface side of the base body to the inner peripheral surface of the through hole at a depth approximately equal to the thickness of the wafer. A wafer holder for a wafer cleaning apparatus, comprising a support edge and a wafer fixture rotatably mounted on the surface of the base near the through hole. （２）基体の表面上に支持柱が着脱自在に立設されてお
り、かつ、基体の裏面側に該支持柱の配置に対応した配
置で支持枕嵌入孔が形成されている特許請求の範囲第１
項記載のウェハ洗浄装置用ウェハ保持具。(2) A claim in which a support column is removably erected on the surface of the base body, and a support pillow insertion hole is formed on the back side of the base body in an arrangement corresponding to the arrangement of the support column. 1st
A wafer holder for a wafer cleaning device as described in 1.
JP17930382A 1982-10-13 1982-10-13 Wafer holder for wafer cleaning device Pending JPS5968930A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17930382A JPS5968930A (en) 1982-10-13 1982-10-13 Wafer holder for wafer cleaning device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17930382A JPS5968930A (en) 1982-10-13 1982-10-13 Wafer holder for wafer cleaning device

Publications (1)

Publication Number Publication Date
JPS5968930A true JPS5968930A (en) 1984-04-19

Family

ID=16063465

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17930382A Pending JPS5968930A (en) 1982-10-13 1982-10-13 Wafer holder for wafer cleaning device

Country Status (1)

Country Link
JP (1) JPS5968930A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6115738U (en) * 1984-07-04 1986-01-29 島田理化工業株式会社 Wafer holding device
JPH03263823A (en) * 1990-03-14 1991-11-25 Tokyo Electron Ltd Boat for treatment use

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6115738U (en) * 1984-07-04 1986-01-29 島田理化工業株式会社 Wafer holding device
JPH03263823A (en) * 1990-03-14 1991-11-25 Tokyo Electron Ltd Boat for treatment use

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