JPS5966197A - Taping device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a taping method for producing a so-called taping product in which a plurality of electronic components are arranged at predetermined intervals and their terminal portions are fixed on a strip-shaped mount with adhesive tape. The present invention relates to an apparatus, and more particularly to a taping apparatus for manufacturing all taping products of so-called radial type electronic components in which a plurality of terminal parts all extend in the same direction from one end of an element part.

In general, radial type electronic components are small-signal molded transistors (see Figure 1(a) as a typical example).
(hereinafter referred to as a transistor), the terminal portions 1b extending from one end of the element portion 1a substantially parallel to each other in the same direction, and the spacing between these terminal portions is relatively narrow. . Therefore, when mounting such an electronic component on a printed circuit board, etc., as shown in Section 117I(b), fold over some of the terminal parts and print the 14 intervals between them. It is necessary to mold it to match the mounting standard dimensions such as.

Therefore, the conventional chipping device for radial type electronic components has a first processing section for forming the diagonal part, and a predetermined processing section on a band-shaped mount 2, as shown in Fig. 2. Electronic components are arranged at regular intervals, and the tip of the terminal part ff1l is fixed with adhesive tape 3 (containing adhesive material on the terminal part and the mating surface). Since it has a processing section, a transfer operation is required to transfer the 15 ' 礪 consonants from the first processing section to the second processing section, and for this reason, the positional accuracy of electronic components during taping can be set to a high 0 degrees. It is difficult to maintain and there is a risk of deforming the terminal part of the molded electronic component, so there is a limit to improving the quality of Qi-pin products, and it is also difficult to improve the production speed of taping products due to the mechanism. It has the disadvantage of being

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a taping device which eliminates the above-mentioned drawbacks, has a high quality taping tear, and can be manufactured quickly.

The taping device of the present invention includes a component transport section that has a plurality of electronic component holding grooves arranged at equal intervals on the outer periphery and performs intermittent rotational movement, and an appropriate stop position of the electronic component holding grooves. a component insertion section having an insertion member provided corresponding to a first stop position of one round of the circuit and disposed outside the component transport section for inserting the electronic component into the electronic component holding groove; and the first stop. A second stop position of the electronic component holding groove in the rotational direction of the component transport section relative to the position of the electronic component holding groove is provided, and the electronic component holding groove is disposed outside the component transport section. a terminal forming section having a punch for forming the interval between the terminal portions of the electronic component to a predetermined size; and a stop positioner of the electronic component holding groove located in the rotational direction of the component conveying section with respect to the second stopping position. The terminal portion of the electronic component is fixed by pressing the terminal portion of the electronic component onto a band-shaped mount with adhesive tape, and is provided corresponding to an appropriate third stop position of one of the components. and a pressure bonding part having an adhesive tape suppressing member.

The present invention will be described in detail below with reference to the drawings.

Referring to Figure 3, which is a full plan view of an embodiment of the present invention, there are a plurality of electronic component holding grooves (hereinafter referred to as holding grooves) arranged at equal intervals on the outer periphery (see Figure 4). Component transport unit 12 that performs intermittent rotational movement (the distance of one intermittent rotational movement corresponds to the arrangement interval l of the transistors 1 shown in FIG. 2(a) at the position of the retaining groove on the outer periphery). Components are sequentially inserted into the outside of L3 along the rotation direction (arrow D).
Terminal molding part 14. Leveling capital 15. Crimping part 16. Anaaki is part 1
7 are provided, each of which is connected to a component transport section 12.
It is arranged at a position corresponding to an appropriate one of the plurality of stop positions of the holding groove, and the respective processing operations can be performed when the parts conveying section 12 is stopped.

Also, the transistor 1 to be processed is placed on the parts feeder l0.
The parts feeder 10 and the parts supply part 11 are arranged so that they are aligned by the parts supply part 11 and inserted into the holding groove of the parts transport part 12 at the parts insertion part 13. 21 to the guide roller 31a.

31b, 31CV and is guided to the pressure bonding part 16 by the mount guide part 18, while the adhesive tape 3 is guided from the adhesive tape reel 22 to guide rollers 32a, 32b, 32C.

32d and is also guided to the crimp section 16.

Anamei is located near the evil 17, and the anamei is kept on the outer periphery of the evil 17.
A product feed roller 33 is provided which has a protrusion that fits into the hole 2a (see FIG. 2) drilled in the mount 2 by the mount 2. It is configured so that the component conveyance unit 12 performs a feeding movement of the chip pink product 28 by the same distance (equal to the arrangement interval 1 of the transistors 1).

The taping product 28, which has been completely processed by the capital 17, is attached to the guide rollers 34a, 34b and the guide drum 3.
Each guide roller, guide drum 35, and take-up reel 25 are arranged so that the product is guided by the product take-up reel 25 and guided by the product take-up reel 25.

Note that the guide drum 35 has a protrusion that fits into the hole 2a of the mount 2, similar to the product feed roller 33, and is configured to feed the taped product 28 in synchronization with the movements of the component conveyance section 12 and the product feed roller 33. It is composed of Further, the interlayer paper reel 26 is a reel for supplying an interlayer paper 27 to be inserted between the transistors 1 to prevent them from coming into direct contact with each other when the taping product 28 is wound onto the product take-up reel 25. Interlayer paper 27 is taping product 2
8 and is wound onto the product take-up reel 25.

Next, the operation of the taping device configured as described above will be explained.

The transistors 1 for making taped products are placed in the parts feeder 10, aligned, and continuously sent through the parts supply section 11 to the position of the component transport section 120 and the component insertion section 13. When the component transport section 12 is stopped, the transistor 1 is inserted into the opposing holding groove. (The details of the operation of the component insertion section 13 will be described later.) When the insertion of one transistor is completed, the component transport section 12
rotates by a certain angle (10° in this example) and then stops, and the component insertion section 13 inserts the next transistor into the next holding groove of the component transport section 12, and thereafter repeats this operation to hold the transistor one after another. Insert the transistor into the groove.

When the intermittent rotational movement of the component transport section 12 is repeated multiple times (six times in the case of this embodiment), the transistor 1 inserted into the holding groove first reaches the position of the terminal forming section 14, and at this position, the transistor 1 is bent and formed by the terminal forming portion 14 held in the holding groove so that the interval between the terminal portions becomes a predetermined dimension. (Details of the operation of the terminal forming section 14 will also be described later.) When the transistor 1 whose terminal portion has been formed further reaches the leveling section 15 due to the intermittent rotational movement of the component conveying section 12,
Similarly, this leveling part 15V is held in the holding groove.
From step c, leveling is applied.

(Smoothing is the process of compressing and forming the terminals so that all the terminals are in the same plane parallel to the mount after being folded in the terminal forming section 14 to widen the spacing. This is an auxiliary process to ensure that the terminal part is fixed in the correct position during the crimping process described later, and as a result of the process in the terminal forming part 14, the shape of the terminal part is correct and on the same plane parallel to the mount. (In this embodiment, the transistor 1, whose terminal portion has been molded and which has been smoothed if necessary, is subjected to repeated intermittent rotational movement of the component conveying section 12.) 6 times), the guide rollers 31a, 31b, 3
It is crimped and fixed with adhesive tape 3 onto the mount 2 which has been guided by the mount 1G, pedestal #, and Higashinai fils 18 VC and has reached the position of the crimping portion 16. At this time, the adhesive tape 3 is also adhesive f-7'')-ru 22 or C:p guide roller 3.
2a, 32b.

32c and 32d to reach the crimp portion 16. (Details of the operation of the crimping unit 16 will also be described later.) The taped product produced by crimping and fixing the transistor 1 onto the mount 2 with the adhesive tape 3 in the crimping unit 16 is synchronized with the intermittent rotational movement of the component conveying unit 12. A perforated portion 17 is provided between the product feed roller 33 and the crimping portion 16 to prevent the intermittent movement of the component conveyance portion 12. At the same time, holes 2a (see Fig. 2) are drilled at predetermined intervals on the mount 2 during the period when the movement is stopped, while the product feed roller 33 has protrusions on its outer periphery that fit into the holes 2a. Therefore, the taped product 28 is reliably sent out by a predetermined distance (equal to the array interval of the transistors 1) by one operation of the product feed roller 330. The relative position of the hole 2a and the transistor 1 (FIG. 2p) can be achieved with desired precision by accurately determining the position of the hole opening 17 with respect to the holding groove of the component transport MSx2. Note that if the mount 2 has holes 2a' drilled in advance, the hole punching section 17 can be omitted. (Relative position p between hole 2a and transistor 1 at this time)
The desired dimensions can be obtained by setting the distance between the protrusion of the product feed/roller 33 and the holding groove of the component transport section 12 so as to satisfy all predetermined conditions. ) The taped product 28 sent out by the product feed roller 33 is guided to the guide drum 35 by guide rollers 34a and 34b. The guide drum 35 is provided on its outer periphery with a protrusion that fits into the hole 2a, similar to the product feed roller 33, and performs intermittent rotational movement in synchronization with the movement of the product feed roller 233 to roll up the taped product 28 into product winding υ-. le 25
The taping product 28 sent out by this guide drum 35 is sent out toward the guide 4-236.
The product is guided by the product winding reel and wound onto the product take-up reel. At this time, the glabellar paper 27 supplied from the interlayer paper reel 26 is also wound up together with the taping product 28 to prevent the transistor 1 from coming into direct contact with it.

Note that the interlayer paper 27 is necessary only for specific electronic components, so if it is not particularly necessary, use the interlayer paper reel 26.
can be omitted. Furthermore, although the above-mentioned embodiment is a case where the taped product is made into a rolled product, if the product is made into a product that is folded to a predetermined length and stacked, the entire storage box is used instead of the product winding reel. A desired taping product can be obtained by providing a crease processing section between the storage box and the guide drum 35 for forming a crease of a predetermined length. Furthermore, by providing both the above-mentioned storage box, crease processing section, and product take-up reel, and switching so that only one of them operates as necessary, it can be folded, wound, or rolled. It is also possible to manufacture both types of products.

FIG. 4(a) is a plan view showing the main parts of the component insertion section 13 in FIG. The transistors 1 that are aligned and successively fed by the transistors 11 arrive at the tip of the component supply section 11 and come to rest, and the insertion section layer 50 of the component insertion section 13 is provided corresponding to the resting position of the transistors 1. On the other hand, the component conveyance tray 112 is set so as to stop at a position where the holding groove 51 faces the insertion portion 50 when the intermittent rotational movement is stopped.

In the component insertion section 13 configured as described above, when the component conveyance section 12 completes the intermittent rotational movement and stops, the insertion member 50
is moved toward the holding groove 51, and this movement inserts the transistor 1 into the holding groove 51. When the insertion member 50 finishes its insertion movement and returns to its original position, the component transport section 12
rotates by a certain angle and comes to rest at a position where the next holding groove faces the insertion member 50. Thereafter, the above-described operation is repeated to insert the transistors 1 into the holding grooves 51 one after another.

Note that the guide member 52 is a component 4'l'2 in order to hold the terminal portion 1b of the transistor 1 in an approximately vertical position when the transistor 1 is inserted into the holding groove 51.
This is a member provided along with the transport 'F3's 12 1C, and is an auxiliary member for keeping the posture of the transistor l constant during transport by the component transport section 12.

5(a) is a plan view showing the main parts of the terminal molding part 14 in FIG. 3, and FIG. 5(b) is a sectional view taken along line BB in FIG. 5(a). As shown in the figure, a forming punch 5 is placed outside of the holding groove of the component conveying section 12 in correspondence with the stop position.
5 and a terminal pressing member 56, and a component pressing member 57 is arranged above them.

When the component conveying section 12 carrying the transistor 1 performs intermittent rotational movement and stops, the terminal forming section 14 configured as described above moves the component pressing member 57 completely downward to press the head of the transistor 1 and release the transistor. 1 and move the terminal pressing member 56 toward the entire holding groove to press the terminal portion 1b of the transistor 1 near the element portion 1a against the component conveying portion 12 to fix the upper part of the terminal portion 1b;
At the same time, the molding punch 55 is moved toward the terminal portion of the transistor 1. As a result, the terminal portion of the transistor 1 is bent with the terminal interval widened in accordance with the shape formed at the tip portion of the forming punch 55, and is bent into a predetermined terminal shape. When the terminal forming operation by the forming punch 55 is completed and the forming punch 55, the terminal pressing member 56, and the component pressing member 57 return to their original positions, the component conveying section 12
is rotated by a certain angle, and the next holding groove is formed by the forming punch 55.
Stand still in a position facing the Thereafter, the above-described operations are repeated to form the terminal portions of the transistor 1 one after another.

FIG. 6(a) is a plan view showing the main part of the crimp part 16 in FIG. 3, and FIG. 6(b) is a sectional view taken along the line C-C in FIG. 6(a).
As shown in the figure, the crimping section 16 has an adhesive tape suppressing member 60 located outwardly thereof corresponding to the stop position of the holding groove of the component conveying section 12.
and a terminal holding member 61 are arranged. A pressure bonding rubber 61 is attached to the tip of the adhesive tape pressing member 60,
A groove portion 61 a that matches the shape of the molded terminal of the transistor 1 is provided at the tip of the terminal holding member 61 .

The crimp section 16 configured as described above is connected to the terminal forming section 14.
When the component transport section 12 carrying the transistor 1 whose terminal portion has been molded into a predetermined shape performs intermittent rotational movement and stops, the terminal pressing member 61 is moved toward the transistor 1 to press the terminal portion of the transistor 1 into the groove. 61aK, and at the same time move the adhesive tape suppressing member 60 in the direction of the transistor 1, sandwich the adhesive tape 3 between the terminal parts of the transistor l using the pressure bonding rubber 60a, and press it against the mount 2 to fix the terminal part of the transistor 1. . When the adhesive tape pressing member 60 finishes fixing the terminal portion of the transistor 1 and the adhesive tape pressing member 60 and the terminal holding member 61 return to their original positions, the component conveying section 12 rotates by a certain angle and moves to the next holding groove. The transistor 1 held by the transistor 1 comes to rest at a position facing the adhesive tape suppressing member 60. Thereafter, the above-described operations are repeated to successively fix the terminal portions of the transistors 1 to the mount using adhesive tape to produce a taping product.

As is clear from the above explanation, the taping device of the present invention can perform all the processes such as terminal forming, leveling force, and crimping in a state where the electronic component to be taped is inserted into the component 4 feeder and supported. Since the electronic components are not transferred when moving from one machining process to the next, it is easy to maintain the blueness of the holding position of the electronic components, and it is easy to maintain the blueness of the electronic component holding position while moving between machining processes. There is no risk of deformation of the terminal part.

Furthermore, since the component transport mechanism is simple, it is easy to increase the manufacturing speed of taped products.

All of the above-mentioned embodiments are examples in which there is one parts feeder, but two parts feeders are arranged in parallel so that the direction in which the electronic component 1 is fixed to the mount 2 can be freely selected from front to back. You can also.

Furthermore, by directly connecting the parts supply section 11 to the parts manufacturing apparatus, it is possible to configure a continuous manufacturing apparatus that eliminates intermediate parts supply operations.

As explained in detail above, by using the taping device Mk of the present invention, it is possible to obtain a taping device with high quality of manufactured taping products and a fast manufacturing speed.

[Brief explanation of the drawing]

FIGS. 1(a) and (b) are plan views before and after terminal forming of a small-signal molded transistor, which is an example of an electronic component to be taped with the chip-pin device of the present invention, and FIG. 2(a) and (b) are a plan view and a side view showing a cross section of a taped product produced by taping the electronic component shown in FIG. 1 using the taping device of the present invention, and FIG.
The figure is a plan view of one embodiment of the taping device of the present invention.
Figures (a) and (b) are plan views and cross-sectional views showing the main parts of the component insertion part in Fig. 3, and Figs. 5 (a) and (b) show the main parts of the terminal molding part in Fig. 3. 6(a) and 6(b) are a plan view and a sectional view showing a main part of the crimping part shown in FIG. 3. In the figure, 1... Molded transistor for small signals, 2...
...Paper, 3...Adhesive tape, 10...
... Noku-tsu feeder, 11 ... Parts supply section, 12 ... Parts transport section, 13 ... Parts insertion section, 14 ... Terminal forming ff1s, 15...
...Leveling part, 16...Crimping part, 17...
... Anaki is a sound curse, 18... Mount information section, 21.
...Paper reel, 22...Adhesive tape reel, 25...Product winding reel. 26...Interlayer paper reel, 27...Interlayer paper, 28...9 taping items, 33...
・Product feed roller, 50...--Insertion member, 51...
... Electronic component holding groove, 52 ... Guide member, 55
...Molding punch, 56...Terminal pressing member, 57...Parts pressing member, 60...
Adhesive tape suppression member, 60a... Pressure rubber, 6
1...Terminal holding member. <(1) (Ni,) Figure 1 second prisoner QA-z (6) Figure 4/z and θ diq u2/ (d) Rod 5 5 F] (Guraanro Figure 485--

Claims (1)

[Scope of Claims] A component transport section that has a plurality of electronic component holding grooves arranged at equal intervals on its outer periphery and performs intermittent rotational movement; a component insertion section provided corresponding to one first stop position and having an insertion member disposed outside the component transport section to insert an electronic component into the electronic component holding groove; and the first stop. an appropriate one of the stop positions of the electronic component holding groove in the rotational direction of the component transport section with respect to the position;
a terminal forming section configured to correspond to the second stop position of the electronic component, and having a punch disposed outside the component conveying section to form a gap between the terminal portions of the electronic component to a predetermined dimension; Appropriate four of the stop positions of the electronic component holding groove in the rotational direction of the component transport section with respect to the second stop position.
An adhesive tape pressing member is provided corresponding to the third stop position of the electronic component, and is placed outside the component transport section and presses and fixes the entire terminal portion of the electronic component onto a band-shaped mount with adhesive tape. What is claimed is: 1. A taping device comprising: a crimping section.