JPS5962111A - Preparation of prepreg - Google Patents

Preparation of prepreg

Info

Publication number
JPS5962111A
JPS5962111A JP17268282A JP17268282A JPS5962111A JP S5962111 A JPS5962111 A JP S5962111A JP 17268282 A JP17268282 A JP 17268282A JP 17268282 A JP17268282 A JP 17268282A JP S5962111 A JPS5962111 A JP S5962111A
Authority
JP
Japan
Prior art keywords
resin
prepreg
base material
impregnated
microwave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17268282A
Other languages
Japanese (ja)
Other versions
JPS6311124B2 (en
Inventor
Yoshihiro Kitsuta
橘田 義弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP17268282A priority Critical patent/JPS5962111A/en
Publication of JPS5962111A publication Critical patent/JPS5962111A/en
Publication of JPS6311124B2 publication Critical patent/JPS6311124B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)

Abstract

PURPOSE:To obtain a prepreg which is almost free from moisture, evenly impregnated with resin and suitable for preparing a paper substrate copper plated laminated board, etc. excellent in electric insulating capacity by such an arrangement wherein a cellulose substrate impregnated with resin solution is heated by microwave under hot moisture atmosphere and then it is dried. CONSTITUTION:A resin impregnated substrate 2 is prepared by passing a substrate 1 through a resin solution tank 11 and it is sent to a hot moisture microwave processing chamber 13 through squeeze rolls 12 and microwave heated under hot moisture atmosphere (preferably under heated hot moisture atmosphere of which relative humidity is 100%), and then sent to a drying machine 16 and dried there, and the titled prepreg (preferably resin content is 10-60wt%) is thus obtained. As said substrate, a kind of kraft paper, e.g., is used and as a resin solution, e.g., a solution wherein preferably 60-100wt% of phenol resin are dissolved in a solvent such as water, etc. is used.

Description

【発明の詳細な説明】 この究明はプリプレグの製法に関するものである0 紙基材銅張積層板等の積層板は、その基板力(絶縁性に
富んでいることが求められる。この基板(ま、セルロー
ス基材に樹脂液を含浸させたプリプレグにより構成され
ているため、積層板の製造番こ際し、電気絶縁性を損う
水分をプリプレグから除去する°ことが行われている。
Detailed Description of the Invention This investigation relates to a prepreg manufacturing method. Since the laminate is made of prepreg, which is a cellulose base material impregnated with a resin liquid, moisture that impairs electrical insulation is removed from the prepreg before the laminate is manufactured.

すなわち、プリプレグを熱風、蒸気、電熱等によシ加熱
しプーリプレグ中の水分を除去することが行われている
。しかしながら、このプリプレグ中の水分は、セルロー
ス基材中の7〜10チ含まれる水分によるものであシ、
セルロース基材自身が親水性に富んでいることもあって
上記のような外部加熱方式によっては簡単に除去できな
い。また、130℃以上の高温度になると、角質化現象
が生じ基材の脆弱化が生じる。そのうえ、外部外熱方式
によれば、プリプレグの含浸樹脂の硬化が先行する゛た
め、水分除去には限界がある。そのため、得られる積層
板は電気絶縁性(特に煮済後電気絶縁性)に問題があっ
た。セルロース基材として薄手のものを用いることも考
えられたが、このようにすると生産性が悪くなりコスト
アップを招くため、これも間聰がある。
That is, the moisture in the pulley preg is removed by heating the prepreg with hot air, steam, electric heat, or the like. However, the moisture in this prepreg is due to the moisture contained in the cellulose base material.
Because the cellulose base material itself is highly hydrophilic, it cannot be easily removed by the external heating method described above. Furthermore, when the temperature is as high as 130° C. or higher, a keratinization phenomenon occurs and the base material becomes brittle. Furthermore, according to the external heating method, the impregnated resin of the prepreg is cured first, so there is a limit to how much water can be removed. Therefore, the obtained laminate had a problem in electrical insulation (particularly electrical insulation after cooking). It has been considered to use a thin cellulose base material, but this also results in poor productivity and increased costs, so this also requires some time.

そこで、この発明者は、このような問題を解消するため
に研究を重ねた結果、セルロース基材に樹脂液を含浸さ
せた樹脂含浸基材(プリプレグ)に対して湿熱雰囲気下
においてマイクロ波加熱を施したのち乾燥すると所期の
目的を達成しうることを見いだしこの発明に到逓した。
Therefore, as a result of repeated research to solve these problems, the inventor developed a method of applying microwave heating in a moist heat atmosphere to a resin-impregnated base material (prepreg), which is a cellulose base material impregnated with a resin liquid. They discovered that the desired purpose could be achieved by drying the product after application, and arrived at this invention.

すなわち、この発明は、セルロース基材に樹脂液を含浸
させた樹脂含浸基材に対して、湿熱雰囲気下においてマ
イクロ波加熱を施したのち乾燥することをその賛旨とす
るものである。
That is, the gist of this invention is to apply microwave heating in a moist heat atmosphere to a resin-impregnated base material obtained by impregnating a cellulose base material with a resin liquid, and then dry it.

この発明により良好な結果が得られるのは、っぎのよう
な理由によるものと考えられる。すなわち、樹脂含浸基
材(プリプレグ)をマイクロ波加熱することにより、セ
ルロース基材中の水分ノミが選択的に加熱(内部加熱)
され気化されて外部へ排出され、それによって内部の組
織が粗になり、これがマイクロ波加熱の中止により冷却
されると内部が減圧状態になシ、その後の乾燥によシセ
ルロース基材の表面側の樹脂が内部に移行し、水分か殆
どなく樹脂が均一に含浸された状態のプリプレグがイ4
Iられるようになると考えられる。そして、マイクロ波
加熱を湿熱雰囲気中で行うことに呵7す、マイクロ波の
分布の均一化と対流による冷却防止効果が得られるよう
になり、マイクロ波加熱による効果が一層向上するよう
になる。
It is believed that the reason why this invention provides good results is as follows. In other words, by heating the resin-impregnated base material (prepreg) with microwaves, water fleas in the cellulose base material are selectively heated (internal heating).
It is vaporized and discharged to the outside, which causes the internal structure to become coarse, and when this is cooled by stopping microwave heating, the internal pressure is reduced, and the surface side of the cellulose base material is then dried. The resin has migrated into the interior, and the prepreg is now uniformly impregnated with resin with almost no moisture.
It is thought that it will become possible to use I. By performing microwave heating in a moist heat atmosphere, it becomes possible to achieve a uniform distribution of microwaves and a cooling prevention effect due to convection, thereby further improving the effectiveness of microwave heating.

つぎに、この発明について詳しく説明する。Next, this invention will be explained in detail.

この発明で用いるセルロース基材としては、クラフト原
紙、コツトンリンター紙、模様紙、平織綿布などセルロ
ースを含む棟々の基材があげられる。樹脂液としては、
例えば、フェノール樹脂(水溶性レゾール樹脂)、アミ
ン樹脂(エリア、メラミン)、不飽和ポリエステル樹脂
またはエポキシ樹脂を適当な溶剤に溶がしたものがあげ
られる。
Examples of the cellulose base material used in this invention include base materials containing cellulose such as kraft paper, cotton linter paper, patterned paper, and plain woven cotton cloth. As a resin liquid,
Examples include phenol resins (water-soluble resol resins), amine resins (area, melamine), unsaturated polyester resins, or epoxy resins dissolved in a suitable solvent.

特に溶剤を加えなくとも、上記樹脂にモノマーが含まれ
ていて、そのモノマーが溶剤の役目を果すものであって
もよい。液状を呈する樹脂であればそのままでも使用で
きる。なお、上記の溶剤としては、水、メタノール、エ
タノール、アセトンまたはメチルエチルケトンを主成分
とするものなどがある。場合によっては、これらのうち
の2以上の溶剤が混ざっていてもよい。
Even if no particular solvent is added, the resin may contain a monomer and the monomer may serve as a solvent. Any resin that exhibits a liquid state can be used as is. Note that the above-mentioned solvents include those containing water, methanol, ethanol, acetone, or methyl ethyl ketone as a main component. In some cases, two or more of these solvents may be mixed.

樹脂液の濃度は、不揮発分(樹脂分)の含有蓋が7エノ
ール樹脂、アミノ樹脂の場合60〜10100N%(以
下「チ」と略す)、エポキシ樹脂の場合70〜100%
であっても充分含浸させることが可能であるが、実用上
は70〜90%とするのが好ましい。しかしながら、樹
脂液の濃度はこのような範囲に限定するものでなく、こ
れよりも誤度の低いもの、[+11えは40%程度の樹
脂液を用いることができることはいうまでもない。
The concentration of the resin liquid is 60 to 10100 N% (hereinafter abbreviated as "chi") for non-volatile content (resin content) for enol resins and amino resins, and 70 to 100% for epoxy resins.
Although it is possible to achieve sufficient impregnation even if the amount is 70% to 90%, it is practically preferable. However, the concentration of the resin liquid is not limited to this range, and it goes without saying that a resin liquid with a lower error rate than this, such as [+11%] of about 40%, can be used.

基材に樹脂数を含浸させる方法は、ロールコータ−法、
浸漬法、刷毛塗り法など棟々の方法を採用することがで
きる。樹脂液の塗布に除しては、樹脂液を基材の片面の
みに塗布しておいてもよく、両面に塗布しておいてもよ
い。基材に含浸させる樹脂液の鼠は、乾燥後のプリプレ
グの樹脂含有輩か10〜60%となるような範囲が好ま
しい、グリプレグに対する湿熱雰囲気下におけるマイク
ロ波加熱は、公知のマイクロ波加熱装置を用い、湿熱雰
囲気中、し1]えば相対湿度10t1%の加熱雰囲気中
において行われる。加熱時間は、樹脂液の種類や磁度、
基利の厚み等に応じて適宜に選ばれる。
The method of impregnating the base material with resin is the roll coater method,
Various methods such as dipping and brush coating can be used. Regarding the application of the resin liquid, the resin liquid may be applied to only one side of the base material, or may be applied to both sides. The resin liquid to be impregnated into the base material is preferably in a range such that the resin content of the prepreg after drying is 10 to 60%.The microwave heating of the prepreg in a moist heat atmosphere can be performed using a known microwave heating device. The heating is carried out in a moist heat atmosphere, for example, in a heated atmosphere with a relative humidity of 10t1%. Heating time depends on the type of resin liquid, magnetism,
It is selected appropriately depending on the thickness of the base material.

前もってテストを行い最適な時間が選はれる。この場合
、マイクロ波加熱により、in内部の水分のみが直接加
熱されるため通常の外部加熱に比べて加熱時間を1/l
O〜1./100に短縮しうる。すなわち、プリプレグ
の樹脂の温度は上昇せずに水分の温度のみが上昇し気化
してプリプレグ表面より蒸散する。この蒸散によ)セル
ロース基材の内部組織が水分の蒸散1こよって粗の状態
となる。湿熱雰囲気は、このマイクロ波加熱の効率を向
上させる0 マイクロ波加熱後の乾燥は、通常公知の熱風乾燥機を用
いて行われる。この熱風乾燥時には、セルロース基材内
部はマイクロ波加熱時よシも低温になり、いわば冷却さ
れた状態となるため、基材内部が減圧状態となシ表面側
の含浸樹脂が内部の粗な状態の部分に浸透する。その結
果、水分が殆どなく、しかも樹脂が均一な状態で含浸さ
れているプリプレグが得られるようになる。
Tests are conducted in advance to select the most suitable time. In this case, microwave heating directly heats only the moisture inside the inn, so the heating time is 1/l compared to normal external heating.
O~1. It can be shortened to /100. That is, the temperature of the resin of the prepreg does not rise, but only the temperature of the water rises, vaporizes, and evaporates from the surface of the prepreg. Due to this transpiration, the internal structure of the cellulose base material becomes coarse due to the evaporation of water. A moist heat atmosphere improves the efficiency of this microwave heating. Drying after microwave heating is usually performed using a known hot air dryer. During this hot air drying, the inside of the cellulose base material becomes lower than during microwave heating, and is in a cooled state, so the inside of the base material is in a reduced pressure state, and the impregnated resin on the surface side becomes rough inside. Penetrates the part of the body. As a result, a prepreg with almost no moisture and uniformly impregnated with resin can be obtained.

第1図はこの発明にかかる製法に供される装置の実施例
をあられす。同図において、樹脂液4w11を通ったロ
ールベーパなどの基材lは樹脂含浸基材2となり、スク
イズロール12を経て湿熱マイクロ波処理室13に送シ
込まれる。この室13内には加温された湿シ空気が保持
されておシ、ここで樹脂含浸基材2に対し湿熱雰囲気下
におけるマイクロ波加熱が施される。この場合、湿熱マ
イクロ波処理室13の湿度は100%RHに設定されて
いる。マイクロ波加熱は、樹脂含浸基材に対して加熱水
蒸気を直接状き付けながら行ってもよい。
FIG. 1 shows an embodiment of an apparatus used for the manufacturing method according to the present invention. In the figure, a base material l such as roll vapor that has passed through a resin liquid 4w11 becomes a resin-impregnated base material 2, and is sent to a moist heat microwave processing chamber 13 via a squeeze roll 12. Warmed moist air is held in this chamber 13, and the resin-impregnated base material 2 is subjected to microwave heating in a moist heat atmosphere. In this case, the humidity of the moist heat microwave processing chamber 13 is set to 100% RH. Microwave heating may be performed while directly applying heated steam to the resin-impregnated base material.

この湿熱雰囲気中におけるマイクロ波加熱により、樹脂
含浸基材中の含浸樹脂の乾燥を防ぎながら基材中の水分
のみを選択的に加熱し、基材外に追い出しうるのである
。そして、湿熱マイクロ波処理室13を出た樹脂含浸基
材2は乾燥機16に送られ乾燥されて乾燥機16から出
てくる。図中、15はマイクロ波発振装置、17は乾燥
機16内に吸入された空気を加熱するための蒸気加熱エ
ロフィン、18はすし気ダクトである。
By microwave heating in this moist heat atmosphere, only the moisture in the base material can be selectively heated and expelled from the base material while preventing the impregnated resin in the resin-impregnated base material from drying. Then, the resin-impregnated base material 2 that has left the wet heat microwave treatment chamber 13 is sent to a dryer 16, dried, and then comes out of the dryer 16. In the figure, 15 is a microwave oscillator, 17 is a steam heating Erofin for heating the air taken into the dryer 16, and 18 is a sushi air duct.

つぎに、実施レリについて比111′例および従来例と
併せて睨明する。
Next, the practical implementation will be discussed together with the comparative example 111' and the conventional example.

〔実施例、比較レリおよび従来例〕[Example, comparative example and conventional example]

つぎの配合の樹脂を用意した。 A resin with the following formulation was prepared.

(樹脂A) 臭素化エポキシ樹脂 (大日本インキ化学工業社製エビクロン153)27g
嵐部(以下r部」と略す) 鎖状エポキシ樹脂 (大日本インキ化学工業社製エピクロン1600)lo
部 硬化剤 パラビニルフェノール   lo 部促進剤 
ベンジルジメチルアミン     0.005部(#i
、l脂B) ヒスフェノールAm固型エポキシ樹脂 (エポキシ当m475 )   70  部数状エポキ
シ樹脂 (工°ボキシ当鈑180)   18  部硬化剤 ジ
シアンジアミド    4 部促m剤 ベンジルジメチ
ルアミン     0.1m(樹脂C) ビスフェノールA型エポキシ樹脂 (エピコート828)    37  部硬化剤  パ
ラビニルフェノール   1o 部促進剤 ペンジルジ
メチルアきン     0.005部(樹脂D) 撹拌器、温度計、冷却器を付したフラスコに、フェノー
ル940j’(10モルに相当)、桐油470f、パラ
トルエンスルホン酸1.759を入れ、撹拌混合した。
(Resin A) Brominated epoxy resin (Ebikuron 153 manufactured by Dainippon Ink Chemical Industries, Ltd.) 27 g
Arashi part (hereinafter abbreviated as "r part") Chain epoxy resin (Epicron 1600 manufactured by Dainippon Ink and Chemicals) lo
part hardener paravinylphenol lo part accelerator
Benzyldimethylamine 0.005 part (#i
, l fat B) Hisphenol Am solid epoxy resin (epoxy m475) 70 parts Epoxy resin (engineering boxy part 180) 18 parts Hardening agent Dicyandiamide 4 parts Promoting agent Benzyldimethylamine 0.1 m (Resin C) Bisphenol A type epoxy resin (Epicote 828) 37 parts Curing agent Paravinylphenol 10 parts Accelerator Penzyldimethylaquine 0.005 parts (Resin D) Add phenol 940j to a flask equipped with a stirrer, thermometer, and condenser. ' (equivalent to 10 moles), 470f of tung oil, and 1.759f of para-toluenesulfonic acid were added and mixed with stirring.

この混合物を攪拌しながら加熱し、約40分後に110
℃とし、その後、30分間還流した。還bit、後直ち
に冷却し、約30分間で室温とした。これに、37%ホ
ルムアルデヒド1095F (ホルムアルデヒド13.
5モルに相当)と25%アンモニア水27.29(アン
モニア0.4モルに相当)を添加し、充分に撹拌混合し
た。この混合物を、撹拌を続けながら加熱し、約30分
間で沸とうさせ、その後60分間還流した。還流終了後
、直ちにフラスコ内を100〜150■Hgの内圧に減
じ、加熱を続けながら減圧脱水し、樹脂を得た。得られ
た樹脂の樹脂含有率は87チであった。
Heat this mixture with stirring and after about 40 minutes
℃ and then refluxed for 30 minutes. After refluxing, the mixture was immediately cooled down to room temperature in about 30 minutes. To this, 37% formaldehyde 1095F (formaldehyde 13.
5 mol of ammonia) and 27.29 mol of 25% ammonia water (corresponding to 0.4 mol of ammonia) were added thereto and thoroughly stirred and mixed. The mixture was heated with continued stirring to boiling for about 30 minutes and then refluxed for 60 minutes. Immediately after the reflux was completed, the internal pressure inside the flask was reduced to 100 to 150 μHg, and dehydration was carried out under reduced pressure while continuing heating to obtain a resin. The resin content of the obtained resin was 87%.

(樹Ha ” ) キ7レンホルムアルデヒド樹脂(分子Jt450 )1
70(Hl 、フェノール850fおヨヒパラトルエン
スルホン峻4. Oyを撹拌棒、冷却器を付した四つロ
フラスコに入れ、100〜105℃に加熱し30分間反
応させた後、脱水しながらさらに120分間反応させた
。これを40”ICまで冷却し、パラホルムアルデヒド
3309. トリエチルアミン5.2Fおよび溶媒とし
てトルエン800gを加え、90℃で150分間反応さ
せ、つぎに減圧下で濃縮し、トルエン含有ft20%、
樹脂含有率70%の樹脂を得た。
(Ji Ha”) Ky7lene formaldehyde resin (molecule Jt450) 1
70 (Hl, phenol 850f, para-toluene sulfone) 4. Oy was placed in a four-bottle flask equipped with a stirring rod and a condenser, heated to 100-105°C, reacted for 30 minutes, and then further reacted for 120 minutes while dehydrating. This was cooled to 40" IC, paraformaldehyde 3309. triethylamine 5.2 F and 800 g of toluene were added as a solvent, and the mixture was reacted at 90° C. for 150 minutes. Then, it was concentrated under reduced pressure to obtain a solution containing toluene containing ft20%,
A resin with a resin content of 70% was obtained.

(樹脂F) 攪拌器、冷却器を付した四つロフラスコ中で、7エ/−
ル94Of (10−T−ルに相当)、80%ホルムア
ルデヒド488F(ホルムアルデヒド13モルに相当)
、アニリン15M(0,16モルに相当)および触媒と
してトリエチルアミン10.I F (0,1モルに相
当)を、100℃で90分間反応させ、アニリン変性レ
ゾール樹脂を得た。この樹脂の樹脂含有率は73チであ
った。
(Resin F) In a four-loaf flask equipped with a stirrer and a condenser, 7 e/-
94Of (equivalent to 10-T-l), 80% formaldehyde 488F (equivalent to 13 moles of formaldehyde)
, aniline 15M (equivalent to 0.16 mol) and triethylamine 10. I F (equivalent to 0.1 mol) was reacted at 100° C. for 90 minutes to obtain an aniline-modified resol resin. The resin content of this resin was 73%.

(樹脂G) 攪拌器、冷却器を付した四つ目フラスコ中で、フェノー
ル940 g(10モルに相当)、55%ホルムアルデ
ヒド655F(ホルムアルデヒド12モルに相当)およ
び触媒としてトリエチルアミン101f(01モルに相
当)を、l U (J ’Cで45分間還流丁で反尾、
さゼ、レゾール向側を得た。樹脂含有率は63チてあっ
た、 実施例 樹脂Aをメチルエチルケトンで希釈して樹脂含有率75
%の樹脂液とした。基材として、密度0.52y/an
 r * ミ10ミルス(2544B)のコツトンリン
ター紙を用い、これに前記樹脂液を浸漬塗布した樹脂含
浸基材を100℃の水蒸気(100%RH)中において
2450 Mllzのマイクロ波(5KW )で5秒間
処理した。しかるのち熱風乾燥を行い、樹脂官有h15
0〜51チのプリプレグを得た。
(Resin G) In a fourth flask equipped with a stirrer and a condenser, 940 g of phenol (equivalent to 10 mol), 55% formaldehyde 655F (equivalent to 12 mol of formaldehyde) and triethylamine 101f (equivalent to 0.01 mol) as a catalyst were added. ), refluxed with a knife for 45 minutes at J'C
Saze, I got the other side of Resol. The resin content was 63%.Example resin A was diluted with methyl ethyl ketone to obtain a resin content of 75%.
% resin liquid. As a base material, density 0.52y/an
r* A resin-impregnated base material using 10 mils (2544B) cotton linter paper and dip-coated with the resin solution was heated in a microwave (5 KW) at 2450 Mllz in steam at 100°C (100% RH). Processed for 5 seconds. After that, hot air drying is carried out, and the resin kanyu h15
Prepregs of 0 to 51 inches were obtained.

〔実施[ンリ2 〕 樹脂Bをアセトンで希釈して桐脂含肩率85チの樹脂液
とした。樹脂液として、この樹脂液を用いたほかは、」
二記笑施例1と同様な条件で処理して、樹脂含有!1j
’、 50〜51頭のプリプレグを得tこ。
[Execution [Nri 2]] Resin B was diluted with acetone to obtain a resin liquid having a shoulder content of 85 cm. Other than using this resin liquid as the resin liquid,
After processing under the same conditions as in Example 1, it contained resin! 1j
', I obtained 50-51 prepregs.

〔実力’or fンリ 3 ] 樹脂Cを、他の浩剤を添加することなく樹脂液ルス(5
08μm、)のコツトンリンター紙に浸漬塗布し、つい
で100℃の水蒸気中において24soM)(zのマイ
クロ波(5KW )を10秒間照射した。しかるのち乾
燥を行い、樹脂含有量51%のプリプレグを得た。
[Actual strength or fren 3] Resin C was mixed with resin liquid (5 ml) without adding any other thickening agent.
It was coated by dip coating on cotton linter paper of 08 μm) and then irradiated with microwave (5 KW) of 24 soM Obtained.

〔実施例4〕 樹脂りをメタノールで希釈して樹脂含有率50チの樹脂
液とした。基材として、密度0.51 f/cd 。
[Example 4] A resin solution was diluted with methanol to obtain a resin solution with a resin content of 50%. As a base material, the density is 0.51 f/cd.

厚み20ミルス(508μrrL)のクラフト原紙を用
い、これに前記樹脂液を浸漬塗布し、ついで100℃の
水蒸気を吹きつけなから245QMHz のマイクロ波
(5KW)を5秒間照射した。[2かるのち熱風乾燥を
行い、樹脂含有量49〜50%のプリプレグを得た。
A kraft base paper having a thickness of 20 mils (508 μrrL) was coated with the resin liquid by dip coating, and then water vapor at 100° C. was sprayed on the paper and then microwaved at 245 QMHz (5 KW) was irradiated for 5 seconds. [After 2 hours, hot air drying was performed to obtain a prepreg with a resin content of 49 to 50%.

〔実施f!I 5 ] 樹脂りをメタノールで希釈して樹脂含有率65チの樹脂
液とした。基材とし2て、密度0.45 y7csi 
[Implementation f! I 5 ] The resin solution was diluted with methanol to obtain a resin solution with a resin content of 65%. As base material 2, density 0.45 y7csi
.

厚み30ミルス(762μrrL)のクラフト原紙を用
い、これに前記樹脂液を浸漬塗布し、ついて100℃の
水蒸気を吹きつりながら2450 MHzのマイクロ波
(5KW)を5秒間j)(1射した。しかるのち畠周波
加熱装置を用いて乾燥を行い、樹脂含有M、50〜51
チのプリプレグを得た。
Using kraft base paper with a thickness of 30 mils (762 μrrL), the resin solution was applied by dip coating, and then 2450 MHz microwave (5 KW) was irradiated for 5 seconds while blowing 100°C steam. Afterwards, drying was performed using a Hatake frequency heating device to obtain resin-containing M, 50-51.
I got the prepreg of Chi.

〔実施例6〕 実施例5で用いた樹脂液を、密度0.65 f/cd 
、厚み13ミルス(33o ttgl )のクラフト原
紙に片面だけ塗布し、ついて100℃の水蒸気を吹きつ
けな力(ら2450+%4111のマイクロ波(5KW
)を10秒間照射した。しかるのち熱風乾燥を行い、樹
脂金*鼠48〜50%のプリプレグを得た。
[Example 6] The resin liquid used in Example 5 had a density of 0.65 f/cd.
, coated on one side of kraft paper with a thickness of 13 mils (33 ottgl), then sprayed with steam at 100°C and heated with microwave (5 KW) at a power of 2450 + 4111.
) was irradiated for 10 seconds. Thereafter, hot air drying was performed to obtain a prepreg containing 48 to 50% resin gold.

実施例 樹脂1)をメタノールで希釈して樹脂含有率75チの樹
脂液とした。基材として、密M O,68f/d 。
Example resin 1) was diluted with methanol to obtain a resin liquid with a resin content of 75%. As a base material, dense MO, 68 f/d.

厚み20ミルス(508μm、 )のクラフト原紙を用
0、その曲は実施例4と同様な条件で処理して、樹脂金
+4’ j+i: 49〜50%のプリプレグをイ↓す
た。
A kraft base paper with a thickness of 20 mils (508 μm) was used, and the material was treated under the same conditions as in Example 4 to remove a resin gold + 4' j + i: 49-50% prepreg.

実施例 樹脂1)をメタノールで希釈して樹脂含有率80チの樹
脂液とした。基材として、密度0.51 f/cti 
Example resin 1) was diluted with methanol to obtain a resin liquid with a resin content of 80%. As a base material, density 0.51 f/cti
.

厚み10ミルス(254μrIL)のクラフト原紙を用
い、これに前記樹脂液を浸漬塗布12、ついて100℃
の水蒸気を吹きつけなから2450 A4)lxのマイ
クロ波(5KW)を5秒間照射した。しかるのち熱風乾
燥し、樹脂含有量49 %のプリプレグを得た。
Using kraft base paper with a thickness of 10 mils (254 μrIL), the resin solution was applied by dip coating 12 at 100°C.
2450 A4) lx microwave (5 KW) was irradiated for 5 seconds. Thereafter, it was dried with hot air to obtain a prepreg with a resin content of 49%.

実施例 樹脂Eをその捷ま樹脂液として使用した。その池は実施
例8と同様な条件で処理してプリプレグを得た。
Example Resin E was used as the kneaded resin liquid. The pond was treated under the same conditions as in Example 8 to obtain prepreg.

〔実施枠り10 〕 樹脂Gをそのまま樹脂液として用いた。基材としで、密
度0.47 f/cd 、厚み10ミルス(254μr
rL)のコツトンリンター紙を用い、これに前記樹脂液
を浸υを塗布し1、ついで100℃の水蒸気を吹きつけ
ながら2450%4Hzのマイクロ波(5KW)を10
秒間照射した。しかるのち熱風乾燥し、樹脂含肩箪46
%のプリプレグを得た。
[Implementation Framework 10] Resin G was used as it was as a resin liquid. The base material has a density of 0.47 f/cd and a thickness of 10 mils (254 μr).
Using a cotton linter paper (rL), soak it with the resin solution and apply it for 10 minutes. Then, while blowing 100℃ water vapor, 2450% 4Hz microwave (5KW) was applied for 10 minutes.
Irradiated for seconds. Afterwards, it is dried with hot air, and the resin-containing shoulder rack 46
% prepreg was obtained.

〔実施例11〕 樹脂Fをメタノールで希釈し、樹脂含有率70チの樹脂
液とした。そして、基材として平織綿布を用い、これに
前記樹脂液を浸漬塗布し、ついで100℃の水蒸気雰囲
気中で2450 MHzのマイクロ波(5KW )を1
5秒間照射した。しかるのち熱風乾燥し、樹脂含有量5
0%のプリプレグを得た。
[Example 11] Resin F was diluted with methanol to obtain a resin liquid with a resin content of 70%. Then, using a plain-woven cotton cloth as a base material, the resin liquid was dip-coated onto it, and then microwaved at 2450 MHz (5 KW) was applied for 1 hour in a steam atmosphere at 100°C.
It was irradiated for 5 seconds. After that, it is dried with hot air and the resin content is 5.
A 0% prepreg was obtained.

〔実施例12〕 樹脂りをメタノールで希釈し、樹脂含廟率65チの樹脂
液とした。そして、基材として、密度0.51f/cd
 、 )W−み10ミルス(254μnL)のクラフト
原紙を用い、これに前記樹脂液を浸漬塗布し、ついで、
水蒸気を吹き出して温度80℃、相対湿度50%にした
室に塗装基材を導き2450MHzのマイクロ波(5K
W )を10秒間照射した。しかるのち熱風乾燥を行な
い、樹脂含有量49チのプリプレグを得た。
[Example 12] A resin solution was diluted with methanol to obtain a resin solution with a resin content of 65%. And as a base material, density 0.51f/cd
, ) Using 10 mils (254 μnL) W-milled kraft paper, the resin solution was dip-coated onto it, and then,
The coating substrate was introduced into a room with a temperature of 80°C and a relative humidity of 50% by blowing out water vapor, and a 2450MHz microwave (5K
W) was irradiated for 10 seconds. Thereafter, hot air drying was performed to obtain a prepreg with a resin content of 49 inches.

〔実7+Tii I41113 ] 水蒸気処441の条件を、温度60℃、相対湿度30チ
の室内で5秒間処理することとした以外は、上記実カξ
例12と同様な条件で処理してプリプレグを得た。
[Act 7 + Tii I41113] The above actual case ξ except that the conditions of the steam treatment 441 were that the treatment was carried out for 5 seconds indoors at a temperature of 60 °C and a relative humidity of 30 °C.
A prepreg was obtained by processing under the same conditions as in Example 12.

〔比較例1〜11〕 実M+j VIJ l〜11において、それぞれ対応す
る番号の実施β・りの製造条件と同様な条件を用いたが
、湿熱マイクロ波処理は行なわう、樹脂液を塗布したの
ち直ちに乾燥を行なった。
[Comparative Examples 1 to 11] In actual M+j VIJ 1 to 11, the same manufacturing conditions as those of the corresponding numbered implementation β and ri were used, but moist heat microwave treatment was performed, and after applying the resin liquid. Drying was performed immediately.

〔従来レリ1〕 樹脂Aをメチルエチルケトンで希釈して、樹脂含有率6
5%の樹脂液とした。これを、密度0.52’I/d 
、厚み10ミルス(254μrrL)のコツトンリンタ
ー紙にt=l−Ut塗布l7、ついで乾燥を行ない、樹
脂含治に50〜51%のプリプレグを得た。
[Conventional Reli 1] Resin A was diluted with methyl ethyl ketone to a resin content of 6.
It was made into a 5% resin liquid. This has a density of 0.52'I/d
The prepreg was coated at t=l-Ut on cotton linter paper having a thickness of 10 mils (254 .mu.rrL) and then dried to obtain a prepreg with a resin content of 50 to 51%.

〔従来例2〕 樹脂りをメタノールで希釈して、樹脂含有率5゜チの樹
脂液とした。これを、密度0.50 f/c4 、厚み
10ミルス(254μrrL)のクラフト原紙に浸漬塗
布し、ついで熱風乾燥を行ない、樹脂含有量49〜50
%のプリプレグを得た。
[Conventional Example 2] A resin solution was diluted with methanol to obtain a resin solution with a resin content of 5°. This was applied by dip coating onto kraft paper with a density of 0.50 f/c4 and a thickness of 10 mils (254 μrrL), and then dried with hot air to obtain a resin content of 49 to 50
% prepreg was obtained.

(M層板の製造) 丘記各実施例、比較例、往来例で得られたプリプレグを
、それぞれ所定枚数重ね合わせ、さらに、その七から各
1枚の接着剤付銅箔(厚み35μm)を東ねて、金り1
プレートにはさみ常法により加熱成形して、製品である
片面銅貼枇を製作した。製作条件は、第1六のim l
yであった。
(Manufacture of M-layer board) A predetermined number of prepregs obtained in each of the Examples, Comparative Examples, and Conventional Examples were superimposed, and one adhesive-coated copper foil (35 μm thick) was added from each of the seven prepregs. East, gold 1
The product, a single-sided copper laminate, was produced by sandwiching it between plates and heat-forming it using a conventional method. The production conditions are the 16th im l
It was y.

(性 曲) イ1られた片面帽貼板の性能を第2表に示す。(sex song) Table 2 shows the performance of the single-sided cap laminate plate.

(以  千  余  白  ) <’i’+   1   表 第2表より、実Am (s41品は、比較同品および従
来例品に比べて性能が優れていることかわかる。
(1,000 margins) <'i'+ 1 From Table 2, it can be seen that the actual Am (s41 product has superior performance compared to the comparative product and the conventional example product.

以上のように、この発明は、セルロース基材ニ樹脂液を
含浸さぜた4MJ脂含浸基祠に対して、湿熱雰囲気干に
おいてマイクロ波加熱を施したのち乾燥することを特畝
とするため、コストアップを招くことなく、水分が#1
は完全に除去され樹脂が均一な含浸状態になっているプ
リプレグを11)ることかできる。
As described above, the present invention is characterized in that a 4MJ fat-impregnated base made by impregnating a cellulose base with a resin liquid is subjected to microwave heating in a moist heat atmosphere and then dried. #1 moisture content without increasing costs
It is possible to prepare a prepreg (11) from which the resin has been completely removed and the resin is uniformly impregnated.

【図面の簡単な説明】[Brief explanation of the drawing]

!に1図はこの発明の実施に用いる装b9.の構成図で
ある。 1・・・左利 2・−樹脂含浸基材 12・・・スクイ
ズロール 13・・・温熱マイクロ波処理室15・・・
マイクロ波発振装置+′?、16・・・乾燥器 17・
・・蒸気加熱エロフィン 18・・・排気ダクト代理人
 弁理士 松 木 武 彦 1 第1図
! Figure 1 shows the equipment used to carry out this invention b9. FIG. 1...Left hand 2-Resin-impregnated base material 12...Squeeze roll 13...Heat microwave treatment chamber 15...
Microwave oscillator +′? , 16... Dryer 17.
...Steam heating Erofin 18...Exhaust duct agent Patent attorney Takehiko Matsuki 1 Figure 1

Claims (2)

【特許請求の範囲】[Claims] (1)セルロース基材に樹脂液を含浸させた樹脂含浸基
材に対して、湿熱雰囲気下におし)でマイクロ波加熱を
施したのち乾燥することを特徴とするプリプレグの製法
(1) A prepreg manufacturing method characterized by subjecting a resin-impregnated base material, which is a cellulose base material impregnated with a resin liquid, to microwave heating in a moist heat atmosphere, and then drying the resin-impregnated base material.
(2)湿熱雰囲気が、相対湿度100%の加熱蒸気雰囲
気である特許請求の範囲第1項記載のプ1ノブレグの製
法。
(2) The method for producing a plastic knob according to claim 1, wherein the moist heat atmosphere is a heated steam atmosphere with a relative humidity of 100%.
JP17268282A 1982-09-30 1982-09-30 Preparation of prepreg Granted JPS5962111A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17268282A JPS5962111A (en) 1982-09-30 1982-09-30 Preparation of prepreg

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17268282A JPS5962111A (en) 1982-09-30 1982-09-30 Preparation of prepreg

Publications (2)

Publication Number Publication Date
JPS5962111A true JPS5962111A (en) 1984-04-09
JPS6311124B2 JPS6311124B2 (en) 1988-03-11

Family

ID=15946405

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17268282A Granted JPS5962111A (en) 1982-09-30 1982-09-30 Preparation of prepreg

Country Status (1)

Country Link
JP (1) JPS5962111A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5139861A (en) * 1990-06-21 1992-08-18 E. I. Du Pont De Nemours And Company Process for bonding blends of cellulosic pulp and fusible synthetic pulp or fiber by high-speed dielectric heating and products produced thereby
JP2003064197A (en) * 2001-08-23 2003-03-05 Hitachi Chem Co Ltd Method for producing prepreg, prepreg and metal-clad laminate
DE102008032053A1 (en) * 2008-07-08 2010-01-14 Kaindl Decor Gmbh Method and apparatus for drying and precondensing impregnates formed from resin impregnated sheet-like sheet material; Melamine resin-free impregnate

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5139861A (en) * 1990-06-21 1992-08-18 E. I. Du Pont De Nemours And Company Process for bonding blends of cellulosic pulp and fusible synthetic pulp or fiber by high-speed dielectric heating and products produced thereby
JP2003064197A (en) * 2001-08-23 2003-03-05 Hitachi Chem Co Ltd Method for producing prepreg, prepreg and metal-clad laminate
JP4736275B2 (en) * 2001-08-23 2011-07-27 日立化成工業株式会社 Manufacturing method of prepreg
DE102008032053A1 (en) * 2008-07-08 2010-01-14 Kaindl Decor Gmbh Method and apparatus for drying and precondensing impregnates formed from resin impregnated sheet-like sheet material; Melamine resin-free impregnate
DE102008032053A8 (en) * 2008-07-08 2010-04-29 Kaindl Decor Gmbh Method and apparatus for drying and precondensing impregnates formed from resin impregnated sheet-like sheet material; Melamine resin-free impregnate

Also Published As

Publication number Publication date
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