JPS5956795U - electronic equipment housing - Google Patents
electronic equipment housingInfo
- Publication number
- JPS5956795U JPS5956795U JP15246982U JP15246982U JPS5956795U JP S5956795 U JPS5956795 U JP S5956795U JP 15246982 U JP15246982 U JP 15246982U JP 15246982 U JP15246982 U JP 15246982U JP S5956795 U JPS5956795 U JP S5956795U
- Authority
- JP
- Japan
- Prior art keywords
- casing
- electronic device
- outer surfaces
- metal
- equipment housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Casings For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図はこの考案に係わる電子機器筐体あ一実施例を示
す斜視図、第2図は第1図の要部を示す分解斜視図、第
3図は第2図の要部を拡大して示、す断面図、第4図、
第5図はそれぞれ異なるこの考案の他の実施例を示すも
ので一部を切除して示す斜視図である。
11・・・筐体、12・・・上蓋、13・・・底蓋、1
4・・・裏蓋、15・・・前面パネル、1B、 19
. 42・・・金属、51・・・リベット。
第4図
第5図Fig. 1 is a perspective view showing an embodiment of an electronic device casing related to this invention, Fig. 2 is an exploded perspective view showing the main parts of Fig. 1, and Fig. 3 is an enlarged view of the main parts of Fig. 2. A sectional view shown in FIG. 4,
FIG. 5 is a partially cut away perspective view showing other embodiments of this invention, each different from the other. 11... Housing, 12... Top lid, 13... Bottom lid, 1
4...Back cover, 15...Front panel, 1B, 19
.. 42...Metal, 51...Rivet. Figure 4 Figure 5
Claims (4)
的に熱良導性金属によってメッキしたことを特徴とする
電子機器筐体。(1) An electronic device housing characterized in that the inner and outer surfaces of the housing formed of a resin material are plated with a metal having good thermal conductivity.
体の縁部で連続一体形成されたことを特徴とする実用新
案登録請求の範囲第1項記載の電子機器筐体。(2) The electronic device casing according to claim 1, wherein the metal plated on the inner and outer surfaces of the casing is continuous and integrally formed at the edges of the casing.
体を貫通するスルーホールメッキによって連続一体形成
されたことを特徴とする実用新案登録請求の範囲第1項
記載の電子機器筐体。(3) The electronic device casing according to claim 1, wherein the metal plated on the inner and outer surfaces of the casing is continuously and integrally formed by through-hole plating that penetrates the casing. body.
は筐体を貫通する金属部材を介して一体的に接続された
ことを特徴とする実用新案登録請求の範囲第1項記載の
電子機器筐体。(4) The electronic device according to claim 1, wherein the metal plated on the inner and outer surfaces of the casing are integrally connected via a metal member penetrating the casing. Equipment housing.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15246982U JPS5956795U (en) | 1982-10-07 | 1982-10-07 | electronic equipment housing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15246982U JPS5956795U (en) | 1982-10-07 | 1982-10-07 | electronic equipment housing |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5956795U true JPS5956795U (en) | 1984-04-13 |
Family
ID=30337588
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15246982U Pending JPS5956795U (en) | 1982-10-07 | 1982-10-07 | electronic equipment housing |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5956795U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011129955A (en) * | 2011-03-28 | 2011-06-30 | Suikoh Topline:Kk | Housing or piping comprising heat sink |
JP2014082451A (en) * | 2012-09-25 | 2014-05-08 | Panasonic Corp | Electronic apparatus |
-
1982
- 1982-10-07 JP JP15246982U patent/JPS5956795U/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011129955A (en) * | 2011-03-28 | 2011-06-30 | Suikoh Topline:Kk | Housing or piping comprising heat sink |
JP2014082451A (en) * | 2012-09-25 | 2014-05-08 | Panasonic Corp | Electronic apparatus |
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