JPS5956776A - Manufacture of solar battery module - Google Patents
Manufacture of solar battery moduleInfo
- Publication number
- JPS5956776A JPS5956776A JP57166866A JP16686682A JPS5956776A JP S5956776 A JPS5956776 A JP S5956776A JP 57166866 A JP57166866 A JP 57166866A JP 16686682 A JP16686682 A JP 16686682A JP S5956776 A JPS5956776 A JP S5956776A
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- resin
- polyacrylic
- softening point
- polyacrylic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000011347 resin Substances 0.000 claims abstract description 17
- 229920005989 resin Polymers 0.000 claims abstract description 17
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 12
- 239000002985 plastic film Substances 0.000 claims abstract description 6
- 239000002131 composite material Substances 0.000 claims abstract description 4
- 230000003287 optical effect Effects 0.000 claims abstract description 4
- 238000002844 melting Methods 0.000 claims abstract description 3
- 230000008018 melting Effects 0.000 claims abstract description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000000178 monomer Substances 0.000 abstract description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 abstract description 5
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 abstract description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 abstract description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 abstract description 2
- 150000002148 esters Chemical class 0.000 abstract description 2
- 238000010528 free radical solution polymerization reaction Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract description 2
- 229920000642 polymer Polymers 0.000 abstract description 2
- 238000003825 pressing Methods 0.000 abstract description 2
- 238000007720 emulsion polymerization reaction Methods 0.000 abstract 1
- 239000003607 modifier Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 description 7
- 235000013399 edible fruits Nutrition 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- -1 polyfluoroethylene Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 1
- KDAKDBASXBEFFK-UHFFFAOYSA-N 2-(tert-butylamino)ethyl prop-2-enoate Chemical compound CC(C)(C)NCCOC(=O)C=C KDAKDBASXBEFFK-UHFFFAOYSA-N 0.000 description 1
- YXYJVFYWCLAXHO-UHFFFAOYSA-N 2-methoxyethyl 2-methylprop-2-enoate Chemical compound COCCOC(=O)C(C)=C YXYJVFYWCLAXHO-UHFFFAOYSA-N 0.000 description 1
- RUMACXVDVNRZJZ-UHFFFAOYSA-N 2-methylpropyl 2-methylprop-2-enoate Chemical compound CC(C)COC(=O)C(C)=C RUMACXVDVNRZJZ-UHFFFAOYSA-N 0.000 description 1
- URQYRMNIDDQKKW-UHFFFAOYSA-N 3,3-dimethylbutyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCC(C)(C)C URQYRMNIDDQKKW-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 102100033806 Alpha-protein kinase 3 Human genes 0.000 description 1
- 101710082399 Alpha-protein kinase 3 Proteins 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 102100023170 Nuclear receptor subfamily 1 group D member 1 Human genes 0.000 description 1
- 235000006040 Prunus persica var persica Nutrition 0.000 description 1
- 240000006413 Prunus persica var. persica Species 0.000 description 1
- 241001648319 Toronia toru Species 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- VXTQKJXIZHSXBY-UHFFFAOYSA-N butan-2-yl 2-methylprop-2-enoate Chemical compound CCC(C)OC(=O)C(C)=C VXTQKJXIZHSXBY-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 235000011389 fruit/vegetable juice Nutrition 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 1
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 125000000250 methylamino group Chemical group [H]N(*)C([H])([H])[H] 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229940065472 octyl acrylate Drugs 0.000 description 1
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- QIWKUEJZZCOPFV-UHFFFAOYSA-N phenyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=CC=C1 QIWKUEJZZCOPFV-UHFFFAOYSA-N 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- BOQSSGDQNWEFSX-UHFFFAOYSA-N propan-2-yl 2-methylprop-2-enoate Chemical compound CC(C)OC(=O)C(C)=C BOQSSGDQNWEFSX-UHFFFAOYSA-N 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000005341 toughened glass Substances 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
Description
【発明の詳細な説明】
本発明は新規な太陽電池モジー−ルの製法に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a novel method for manufacturing a solar cell module.
太陽電池モジー−ルは、通常強化ガラスからなる表面側
透過板と、防湿材との間に、太ＩＩＭ電池素子をシリコ
ン系樹脂で封入した形で介在させ、周囲を該囮脂でシー
ルすると共に外枠がはめられている。A solar cell module has a thick IIM battery element encapsulated in silicone resin interposed between a front transparent plate made of tempered glass and a moisture-proof material, and the surrounding area is sealed with the decoy resin. The outer frame is fitted.
しかし上記樹脂は、一般に反応性液状シリコン樹脂が使
用さλするために、収１）扱いが煩雑であると共に、完
全硬化までに時間がかか１）、そのため番こ次工程へ連
続して移ることができないという欠点と、液状であるた
めに封入時素み出したり、気泡を形成した０するという
欠点と、さらに討入時において、素子の位置合せや角度
の調整が煩雑であるという欠点がある。However, since the above-mentioned resin is generally a reactive liquid silicone resin, it is complicated to handle and takes a long time to completely cure (1), so it must be transferred to the next step. The disadvantages are that it is not possible to do so, and because it is in a liquid state, the element oozes out or forms bubbles when it is encapsulated, and furthermore, it is complicated to align the element and adjust the angle during injection. .
また近時モジー−ルの小型化及び４１化が要望されてい
るが、素子の大きさに比して、透過板及び封入樹脂の容
蹟が極めて大きく、シかも例えば樹脂は液状であるため
に高精度の薄層とすることができ（こぐいといった問題
があるために満足する状態（こ至っていないのが現状で
ある。In addition, there has recently been a demand for smaller modules and 41 mm modules, but the volume of the transmitting plate and the encapsulating resin is extremely large compared to the size of the element, and it may be difficult to do so because the resin is in a liquid state. It is possible to form a thin layer with high precision (although this has not yet been achieved at present, due to problems such as roughness).
本発明はかかる欠点を解決した新規な太陽電池モジー−
ルの製法を提供するもので、その要旨とするところは、
軟化点が１２０°Ｃ以−トで且つ光学的透明性にすぐれ
るプラスチックシート（又はフイルム）（こ軟化点が１
２０“Ｃ以Ｆのポリアクリル系樹脂層をＪ構成してなる
腹合シートと、軟化点が１２０゜℃以ドのボＩＪ ’／
’クリル系樹果樹−トｔ−１（独又は該樹脂シートと防
／！ｌｉ！フィルムにの債層シートを用意し、両ＪＷＪ
Ｉｌｉ’ｊ間（こ人陽宙泪］素子を介在して加だ（加
圧し７、少なくとも一方のポリアクリル系樹脂゛を溶融
又は軟化せしめて、前記素子を封入することである。The present invention is a novel solar cell module that solves these drawbacks.
It provides a manufacturing method for
A plastic sheet (or film) with a softening point of 120°C or higher and excellent optical transparency.
A sheet made of a polyacrylic resin layer with a temperature of 20"C or higher and a void IJ'/with a softening point of 120°C or lower.
'Crylic fruit tree-T-1 (Germany or the resin sheet and the bond layer sheet on the film is prepared, both JWJ
Pressure is applied through the element (7) to melt or soften at least one of the polyacrylic resins and encapsulate the element.
本発明の製法に４、第１ば、予め１戊形したポリアクリ
ル果樹）ｊｉ′ｉを上体するシート間（こ太陽電池素子
を介在して加熱加圧して封入するものであるから、絃み
出しや気泡が構成された０することがなく、しかも素子
をプラスチックシート材料で封入するので、小型で軽い
モジュールが１↓）らハるものである。4. In the manufacturing method of the present invention, the first step is to form a polyacrylic fruit tree (polyacrylic fruit tree) which has been pre-shaped in advance between the sheets (which are sealed by heat and pressure with the solar cell element interposed therebetween). Since there are no protrusions or bubbles, and the elements are encapsulated in plastic sheet material, a small and light module can be created.
本発明に用いら第１るプラスチックシート（又はフィル
ム）としては、軟化、壱が１２０℃以上で且つ光学的透
明性を有するプラスチック物？ｄからなるものであわば
特Ｑこ制限さ才１ないが、例えはポリカーボネ、−ト系
シート又はフィルム、ポリエステル系シート又はフィル
ム、ポリアミド系シート又はフィルム、１便＋ｉ４ポリ
塩化ビニル系シート又はシート、ポリフロロエチレン系
シート−ｔｚはフィルムなどが卒けられ、これらの１プ
みは約５０〜８００μｍの範囲が使用される。また該ン
ーＩ・又はフィルムの表面には耐ストレスクランク性向
上などのために、シリコーン、フッ化マグネシーウムの
ＩＪｎ ＊ ＪｔＪ 料ヲ用いて処理してもよいもので
あ２・。The first plastic sheet (or film) used in the present invention is a plastic material that softens at a temperature of 120°C or higher and has optical transparency. Although there are no special restrictions on d, for example, polycarbonate, -t-based sheets or films, polyester-based sheets or films, polyamide-based sheets or films, 1 + i4 polyvinyl chloride-based sheets or sheets. The polyfluoroethylene sheet-tz is not a film or the like, and a sheet having a thickness of about 50 to 800 μm is used. In addition, the surface of the film may be treated with silicone or magnesium fluoride IJn*JtJ material to improve stress cranking resistance.
またポリアクリル系樹脂としては、アクリル酸もしくは
メタクリル酸と炭素数１２以下の′アルコールとのエス
テルを＋七ツマー七１７、これ（こ必要に応じて改質用
極性モノマーを改えて溶液重合或いはエマルジョン車台
などさせて得られるモ均分手頃が通常約１０万以上で、
且つ１２０℃以下の軟化点を有する屯合体が用いられる
。As the polyacrylic resin, an ester of acrylic acid or methacrylic acid and an alcohol having 12 or less carbon atoms is used, which can be prepared by solution polymerization or emulsion by changing the polar monomer for modification as necessary. The average price that can be obtained by installing a chassis etc. is usually about 100,000 yen or more,
In addition, a tonoplast having a softening point of 120° C. or lower is used.
上記土七ツマ−としては、アクリル酸エチル、アクリル
酸ブチル、アクリル酸オクチルなどの（メタ）アクリル
酸アルキルエステルが用いられるが、殊をこアクリル酸
エステル、メタクリル酸エステルの群から選ばれたホモ
ポリマーのガラス転移点が２７３″に以−ヒとなりつる
不飽和小尉体がとくをこ奸摘で、その貝（４４列として
はアクリル酸・、−ヅク［フヘキシル（２８９ｃ）Ｋ）
、アク＋） ルｆＢ ｌ チ／ｌ／ （２７９’Ｋ ）
、メタクリル酸ブヂル（２９３）ぐ）、１＼Ｉ・↑、Ｊ
、Ｌ／メチルアミノＪ−チルメタクリレート（２８９°
■ぐ）、メタクリル酸ヘキサデンル（２８８°Ｋ）、メ
タクリル酸２−メトキシエチル（２８６°Ｉぐ）、メタ
クリル酸２−ブヂル（３１８°Ｉ（）、３・３−ジメチ
ルブチルメタクリレート（３１８’□Ｋ）、３・３−ジ
メチル−２−ブヂルメダクリレート（３８１°Ｋ）、メ
タクリル酸エヂル（３３８ｃＫ）、グリシジルメタクリ
レート（３１９０Ｋ）、イア 、Ｊ−、ａニルＪ ９
り’Ｊ レ−） （３８３°］ｌ（）、メタクリル酸イ
ソブチル（３２６°Ｋ）、イソプロピルメタクリレート
（３５４°Ｋ）、メタクリル酸メチル（３７８°Ｋ）、
メタクリル酸フェニル（３７８°Ｋ）、ｎ−プロピルメ
タクリレート（３０８°Ｋ）、イソボロニルアクリレー
ト（３６７°Ｋ）などのポモポリマーのガラス転移点が
２７３°ＩＱ十とな０うる不１ｊｃ＋Ｊ和単ＩＡ体があ
る。(Meth)acrylic acid alkyl esters such as ethyl acrylate, butyl acrylate, and octyl acrylate are used as the above-mentioned clay. The glass transition point of the polymer is 273'', and the unsaturated enthalpy is particularly important.
, Aku+) Le fB l Chi/l/ (279'K)
, butyl methacrylate (293)g), 1\I・↑, J
, L/methylamino J-thyl methacrylate (289°
), hexadenyl methacrylate (288°K), 2-methoxyethyl methacrylate (286°Igu), 2-butyl methacrylate (318°I(), 3,3-dimethylbutyl methacrylate (318'□K) ), 3,3-dimethyl-2-butyl medacrylate (381°K), edyl methacrylate (338cK), glycidyl methacrylate (3190K), Ia, J-, a-Nyl J 9
(383°] l(), isobutyl methacrylate (326°K), isopropyl methacrylate (354°K), methyl methacrylate (378°K),
The glass transition point of pomopolymers such as phenyl methacrylate (378°K), n-propyl methacrylate (308°K), and isobornyl acrylate (367°K) is 273°IQ + 0 URUJC + J + IA There is.
また目］１．妃ｊ１ｉ１１性セノマーとしては、たとえ
ば塩化ビニル、プロピオン酸ビニル、フレイン酸のモノ
もしくはジエステル、アクリル酸、メタクリル酸、クロ
トン酸、７１ツイン酸、イダコン酸、アクリル＠２−ヒ
ドロキシエチル、アクリル酸２−ヒドロキンプロピル、
メタクリル酸２−ヒドロキシエチル、Ｎ−Ｎ−ジメチル
アミノエチルアクリレート、Ｎ−Ｎ−ジメチルアミノエ
チルアクリレート、Ｎ −ｔｅｒｔ−ブチルアミノエチ
ルアクリレート、ビス（Ｎ−Ｎ−ジメチルアミノエチル
）マレエート、アクリルアミドなどが挙（、ヂられる。Eyes] 1. Examples of the monomer cenomer include vinyl chloride, vinyl propionate, mono- or diester of furyic acid, acrylic acid, methacrylic acid, crotonic acid, 71tonic acid, idaconic acid, acrylic@2-hydroxyethyl, 2-hydroacrylic acid. Quinpropyl,
Examples include 2-hydroxyethyl methacrylate, N-N-dimethylaminoethyl acrylate, N-N-dimethylaminoethyl acrylate, N-tert-butylaminoethyl acrylate, bis(N-N-dimethylaminoethyl) maleate, acrylamide, etc. (It's hurt.
ＦＩＩｉＪ記モモツマ−と極性モノマーとの配合割合は
、七モノマー：極性モノマー＝７０：１００：３０〜０
、好ましくは８０〜９９：２０〜１（各れも甫ｒｒｔ比
）の範囲とされるが、主モノマーの少ｆｒ くとも１０
すｒ購％、好ましくは２０〜８０車騎％をｂＩＪ記不飽
和単喰体で構成することは、得られるモジュールの剛性
向上の点から好ましいものである。The blending ratio of FIIIiJ peach and polar monomer is 7 monomers: polar monomer = 70:100:30-0
, preferably in the range of 80 to 99:20 to 1 (both ratios), but the main monomer content is at least 10
From the viewpoint of improving the rigidity of the resulting module, it is preferable that %, preferably 20 to 80%, be made of unsaturated monolithic material.
またかかる土モノマーと極性モノマーとを共重合してな
るポリアクリル系樹脂（試薬を用いて架橋してなるもの
を含む）は、その軟化点が１２０゛Ｃ以ド、好ましくは
１１０〜７０’Ｃ；の範囲となるように設ｈ１−さｔし
Ｃいることか心的であ（］、１２０℃貝十では木子ヒ１
人時、索子か翠（劣化などの（；；ニ饗をパ冴げ２）た
め（こ（ｌｉｆ ま し７ く なし・ものである。Polyacrylic resins formed by copolymerizing such earth monomers and polar monomers (including those formed by crosslinking using reagents) have a softening point of 120°C or higher, preferably 110 to 70°C. It is mentally set so that it is within the range of (), and at 120℃, the temperature is
At the time of human life, Sukoko or Midori (deterioration, etc.) (;; Nibashi wo Pasaege 2) for (this (lif Mashi7) is something.
複合シートは、ｍｌ ｒ；己プラスチックシート（又は
フィルム）に、該樹脂の溶液又は水分散物を塗設するか
、或いは該樹脂を予めフィルム叉は７ンート状をこ迄１
１かし、務各剤、融着などの接置手段を用いて貼り合せ
２）ことによって得られる。ポリアクリル樹脂層の厚み
は、５０〜１０００μｍが奸ｆしいものである。The composite sheet can be prepared by applying a solution or aqueous dispersion of the resin to a plastic sheet (or film), or applying the resin to a film or sheet in advance.
1) It can be obtained by bonding 2) using a bonding means such as adhesives, adhesives, and fusion. The thickness of the polyacrylic resin layer is preferably 50 to 1000 μm.
端層シートも同様にして得られるものであ０、防湿フィ
ルムとし、てはポリフッ化ビニルフィルム、該フィルム
とＡＡＰｔｉとのラミネートシートカ°どが用いらオｌ
る。The end layer sheet can also be obtained in the same manner, and a moisture-proof film such as a polyvinyl fluoride film or a laminated sheet sheet of this film and AAPti can be used.
Ru.
またポリアクリル系樹ＩＩＩｆシートは、前記優Ｉ Ｊ
ＩＮをキャスティング、押し出しなどＱこよ（）、１９
さ５０〜５００μ刀りに」！−膜することによって得ら
れる。In addition, the polyacrylic tree IIIf sheet is
Casting IN, extrusion, etc. Qkoyo (), 19
50 to 500 micrometers! -obtained by coating.
本発明の製ｔハは、かかるフィルム又はシート状材料を
用い、例えば削Ｉ記複合シートのポリアクリル樹脂層面
に素子を配置し、このトにポリアクリル（ｆ＋・１１指
層＋ｆｉｉにＦｔ、−ρを配置し、この十にポリアクリ
ル系１′、′−１月）７ンー１． （１，、ｌ、バーｊ
＋）′−Ｉ・の漏１、イヤ１．ｔポリアクリル系（Ｉ・
１）指面を介して）を中ね分１′−５１〜かるイ４月Ｉ
Ｊ熱加辻しイ、少；’ｌ−くとも一方のポリアクリル系
樹脂１＋’ｉ （又はｉ／−１・）を溶融又は軟化させ
て、両刃υ））ｉ￥： 、’ｌｉを接百一体化させると
其（こ素子をトｒ人し、直ちに或い１・才徐々に冷却す
ることによってモジ・−−ルを製造するものである。The manufacturing device of the present invention uses such a film or sheet material, for example, by arranging an element on the polyacrylic resin layer surface of a composite sheet described in Section 1, and applying polyacrylic (Ft to f+, 11th finger layer + fii, - Place ρ and add polyacrylic 1','-1 month) to this ten.7-1. (1,, l, bar j
+)'-I・leakage 1, ear 1. tPolyacrylic (I・
1) Through the finger surface) in the middle 1'-51 ~ Karui April I
Melt or soften the polyacrylic resin 1+'i (or i/-1・) on at least one side, and connect the double-edged edges υ))i￥: ,'li. Once the elements are integrated, they are dried and cooled immediately or gradually for 1 year to produce a module.
ｎＩＪ記加熱加熱加圧手段ては、熱プレス、■−ロール
ｌ「どが用いられ、また温度或いは１七力はポリアクリ
ル系樹脂の軟化点や厚みによってＹなるが、８０〜１５
０°Ｃで０．１〜３０分のｊル１ヤ＼と、少なくとも０
５Ｘ／ ／ｃａ の圧力がちオｔは充分である。The heating, heating and pressing means used are a heat press, a roll, and the temperature or pressure varies depending on the softening point and thickness of the polyacrylic resin, but 80 to 15
0.1 to 30 minutes at 0°C and at least 0.
A pressure of 5X//ca is sufficient.
本発明の製法は以上のように、予め成形したポリアクＩ
Ｉ ル系樹脂を主体とするシートをｆ−ｔ’Ｊい、こ２
１、 Ｇこ素子を介在させて加熱加圧すン・と：］号（
こ溶融又は；欧化させて接着一体化して１人するもので
あるから、作猫性に摩れ、しかも気泡を抱衣込むことな
く、連続生産できるという特徴を有する。また全停をフ
ィルム又はシート状の材料で１１１＋成したので、モジ
ー−ルを小４１す化及び・窪１ｊｌ、 （ヒで〜ｋＺ〕
という実用１１−のＴ１．（１瑯ブ）−人、ノ、Ｃろも
のであど、。As described above, the manufacturing method of the present invention involves pre-molding polyac I
A sheet mainly made of I-based resin is f-t'J, this 2
1. Heat and pressurize with the intervening G element.
Since it is made by one person by melting or adhering it in one piece, it has the characteristics of being easily manufactured and capable of continuous production without enclosing air bubbles. In addition, since the entire stop was made of film or sheet material, the module was made into a small 41 cm and a hollow 1 jl, (Hide~kZ)
Practical 11- T1. (1) - people, ノ, C things, etc.
（す、正本発明の′、￥１ｉｉｊｉ イ５１１を示す。(Shows 511 of the original invention).
実施例
ツクグリル酸メヂル：アクリルＩ■エチル：アクリル酸
２−１ニドロギシェチル−６０：４０：２（ＭＡ６゜比
）から／「る配合物を常法により〕工”フルジョン重合
し、塩析して、分子：ａ４０万のｉｌｉリアグリル系樹
果樹（１欧化点１０５℃）を７−ｅＨ，７ン。Examples: Medyl acrylic acid: Acrylic I ■ Ethyl: Nidrogychetyl acrylate 2-1 - 60:40:2 (MA 6° ratio) / A mixture was subjected to fulsion polymerization by a conventional method and salted out. , Molecule: a400,000 ili liagrill fruit tree (1 Europeanization point 105°C) is 7-eH, 7-n.
この！ｉｒＪ ＩＪｉｆ ’、を押出１゛、層こて厚さ
２００μ７７１のシート状に押出し、こ几を片面シリコ
ーン系処理剤Ｇこで表面したポリカーボネ−トフィルム
（ｊ＋Ｉｊさｉ００μ？？’Ｌ ）ノＪ［処（＋、１１
而（こ、”／ Ｅ Ａ −ト（１ＭｔＵ” １５０’Ｇ
） Ｌ、透明信実ｔｚｆｔ「ＩＭ疹ンシーを７（トる
。this! irJIJif' was extruded into a sheet with a layer thickness of 200μ771, and the polycarbonate film (j+Ij×i00μ??'L) was coated with a silicone-based treatment agent on one side. (+, 11
と(ko,”/E A-to(1MtU” 150'G
) L, Transparent Shinji tzft “IM Responsibility 7 (Toru.
一方、自’４ｉｉ己訂寸用イを押出機にてＩＬ？：さ２
００μｍのシート状に押出し、こ第１をすさ１００／１
１ｎのポリフッ（ヒビニルフィルムにラミネート（１５
０’ｃ’）ｌ、て（古層 ｙ−ｈ イＩ−１１７−る
っ
と欠に１１へ端層らノートのポリアクリル系ｂａｔ ｉ
Ｊｉ′：３Ｉｎ ［ｈｉに＆ ｌ１Ｖｔ ”ｌ’ｉ ／
ｌＩＪ素了−を？’１己＋Ｆ’ｉ Ｉ、 、 コノ上＋
ニー ｆ＋’Ｊ Ｗ己ｍ 片ン）を樹脂層面を介し、て
重ね合せ、１２５℃に保持された熱ロール間（汁力２ｋ
ｇ／ｃＡ’）に、０．９７７１／ ｍｉｎの速度で送０
込んで、両方のポリアクリル果樹１指を溶融きせて接着
一体化すると共に素子を１ご１人［７、空冷しで、太陽
？ｉｔ ７１．ｔ７モジーールを得た。On the other hand, I used an extruder to make my own '4ii self-correction I? :Sa2
Extrude it into a sheet of 00μm, and the first one has a width of 100/1.
Laminated on 1N polyfluoride (Hyvinyl film) (15
0'c') l, te (old layer y-h iI-117-ru to 11 to edge layer et al. notebook polyacrylic bat i
Ji': 3In [hi & l1Vt "l'i /
lIJ Soryo-? '1self+F'i I, , Konoue+
Lay them together via the resin layer surface and roll them between heated rolls maintained at 125°C (juice force 2k).
g/cA') at a speed of 0.9771/min.
At the same time, one finger of both polyacrylic fruit trees was melted and glued together, and the elements were assembled one by one [7. it 71. t7 module was obtained.
得られたモジュールは気泡がｔｒ ＜ 、’ｒｆ９明ｆ
ＩＩＧこずぐれ、しかも？蓋来のモジー−ル（こ１十シ
て１′４Ｆ＜４県いものであった。The obtained module has air bubbles tr < , 'rf9 light f
IIG Kozugure, and what's more? The last 10 years have been 1'4F <4 prefectures.
特許出刈ｊ人 日東電気二［イ５イ朱式会化 代表者 士 方 五 部Patent owner Nitto Electric 2 [I5 I Vermilion Ceremony] Representative: 5 divisions
Claims (1)
プラスチックシート（又はフィルム）、（こ軟化点が１
２０°Ｃ以下のポリアクリル系樹脂層を形成しテｆ、ｒ
る複合シートと、軟化点が１２０’ＣＪＪ、下のポリア
クリル系樹脂シート単独又は該樹脂シートと防湿フィル
ムとの積層シートとを用意し、両樹脂面間に太ｌ！Ａｑ
ｉ准素子を介在して加熱加圧し、少なくとも一方のポリ
アクリル系樹脂を溶融又は軟化せしめて、前記素子を封
入することを特徴とする太１鵠電１１１！七ジーーール
の製法。A plastic sheet (or film) with a softening point of 120°C or higher and excellent optical transparency,
Form a polyacrylic resin layer at a temperature of 20°C or less
A composite sheet with a softening point of 120' CJJ and a lower polyacrylic resin sheet alone or a laminated sheet of the resin sheet and a moisture-proof film are prepared, and a thick l! Aq
Tai 1 Eden 111! characterized in that the element is encapsulated by heating and pressurizing at least one of the polyacrylic resins with the element interposed therebetween, thereby melting or softening at least one of the polyacrylic resins. The manufacturing method of Seven Geels.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57166866A JPS5956776A (en) | 1982-09-25 | 1982-09-25 | Manufacture of solar battery module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57166866A JPS5956776A (en) | 1982-09-25 | 1982-09-25 | Manufacture of solar battery module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5956776A true JPS5956776A (en) | 1984-04-02 |
Family
ID=15839083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57166866A Pending JPS5956776A (en) | 1982-09-25 | 1982-09-25 | Manufacture of solar battery module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5956776A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0629004A1 (en) * | 1993-06-14 | 1994-12-14 | Canon Kabushiki Kaisha | Covering material for solar cell module |
| NL9500368A (en) * | 1994-02-25 | 1995-10-02 | Tega Holding B V | Arrangement for converting solar radiation energy into some other form of energy |
-
1982
- 1982-09-25 JP JP57166866A patent/JPS5956776A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0629004A1 (en) * | 1993-06-14 | 1994-12-14 | Canon Kabushiki Kaisha | Covering material for solar cell module |
| US5482571A (en) * | 1993-06-14 | 1996-01-09 | Canon Kabushiki Kaisha | Solar cell module |
| NL9500368A (en) * | 1994-02-25 | 1995-10-02 | Tega Holding B V | Arrangement for converting solar radiation energy into some other form of energy |
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