JPS5950456U - light emitting diode device - Google Patents
light emitting diode deviceInfo
- Publication number
- JPS5950456U JPS5950456U JP14550482U JP14550482U JPS5950456U JP S5950456 U JPS5950456 U JP S5950456U JP 14550482 U JP14550482 U JP 14550482U JP 14550482 U JP14550482 U JP 14550482U JP S5950456 U JPS5950456 U JP S5950456U
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- light emitting
- molded
- diode device
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来装置を示す断面図、第2図は光指向特性を
示す特性図、第3図は本考案の実施例を示す断面図であ
る。
11.12.13・・・第1〜第3リード、11a。
12a・・・第1、第2反射器、14.15・・・第1
、第2発光ダイオードペレット、16・・・第1モール
ド体、17・・・第2モールド体、18・・・第3モー
ルド体。FIG. 1 is a sectional view showing a conventional device, FIG. 2 is a characteristic diagram showing light directivity characteristics, and FIG. 3 is a sectional view showing an embodiment of the present invention. 11.12.13...1st to 3rd leads, 11a. 12a...first, second reflector, 14.15...first
, second light emitting diode pellet, 16... first mold body, 17... second mold body, 18... third mold body.
Claims (1)
の各反射器底面に配された発光ダイオードペレット、上
記各反射器を個々にモールドする第1モールF体、該第
1モールド体の各表面に形成された第2モールド体、上
記反射器を一体にモールドする第3モールド体から構成
され、上記第1、第3モールド体は透光性材料から、ま
た上記第2モールド体はフィシ(光散乱材)入りの透光
性材料からなることを特徴とする発光ダイオード装置。A plurality of leads each having a reflector formed at one end, a light emitting diode pellet arranged on the bottom surface of each reflector of the leads, a first molding F body in which each of the reflectors is individually molded, and each of the first molding bodies. It is composed of a second molded body formed on the surface and a third molded body integrally molded with the reflector, the first and third molded bodies being made of a translucent material, and the second molded body being made of fiber ( 1. A light-emitting diode device comprising a light-transmitting material containing a light-scattering material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14550482U JPS5950456U (en) | 1982-09-24 | 1982-09-24 | light emitting diode device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14550482U JPS5950456U (en) | 1982-09-24 | 1982-09-24 | light emitting diode device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5950456U true JPS5950456U (en) | 1984-04-03 |
Family
ID=30324156
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14550482U Pending JPS5950456U (en) | 1982-09-24 | 1982-09-24 | light emitting diode device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5950456U (en) |
-
1982
- 1982-09-24 JP JP14550482U patent/JPS5950456U/en active Pending
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