JPS5949491U - solder chip - Google Patents

solder chip

Info

Publication number
JPS5949491U
JPS5949491U JP14583282U JP14583282U JPS5949491U JP S5949491 U JPS5949491 U JP S5949491U JP 14583282 U JP14583282 U JP 14583282U JP 14583282 U JP14583282 U JP 14583282U JP S5949491 U JPS5949491 U JP S5949491U
Authority
JP
Japan
Prior art keywords
solder chip
solder
abstract
wire
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14583282U
Other languages
Japanese (ja)
Inventor
桜井　馨
Original Assignee
日本板硝子株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本板硝子株式会社 filed Critical 日本板硝子株式会社
Priority to JP14583282U priority Critical patent/JPS5949491U/en
Publication of JPS5949491U publication Critical patent/JPS5949491U/en
Pending legal-status Critical Current

Links

Landscapes

  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図面は本考案の実施の一例を示すものであり、第１図は
本考案に係る半田チップの全体斜視図、第２図は同半田
チップを用いてブスバーに軸重端子を接合する状態を示
すリヤウィンドガラスの正面図、第３図は第２図の一部
拡大斜視図である。 尚、図面中１は半田チップ、２は半田片、３は線材、易
はブスバーである。The drawings show an example of the implementation of the present invention; Fig. 1 is an overall perspective view of a solder chip according to the present invention, and Fig. 2 shows a state in which an axle load terminal is joined to a bus bar using the solder chip. A front view of the rear window glass, FIG. 3 is a partially enlarged perspective view of FIG. 2. In the drawings, 1 is a solder chip, 2 is a solder piece, 3 is a wire, and 1 is a bus bar.

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）線材の両端部のそれぞれに板状をなす半田片を取
り付けたことを特徴とする半田チップ。(1) A solder chip characterized by having plate-shaped solder pieces attached to each end of a wire rod. （２）前記線材は磁性材料からなることを特徴とする実
用新案登録請求の範囲第１項記載の半田チップ。(2) The solder chip according to claim 1, wherein the wire is made of a magnetic material.
JP14583282U 1982-09-27 1982-09-27 solder chip Pending JPS5949491U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14583282U JPS5949491U (en) 1982-09-27 1982-09-27 solder chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14583282U JPS5949491U (en) 1982-09-27 1982-09-27 solder chip

Publications (1)

Publication Number Publication Date
JPS5949491U true JPS5949491U (en) 1984-04-02

Family

ID=30324793

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14583282U Pending JPS5949491U (en) 1982-09-27 1982-09-27 solder chip

Country Status (1)

Country Link
JP (1) JPS5949491U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016064444A (en) * 2014-09-25 2016-04-28 株式会社旭製作所 Solder chip, method for manufacturing glass substrate with terminal by use of solder chip

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016064444A (en) * 2014-09-25 2016-04-28 株式会社旭製作所 Solder chip, method for manufacturing glass substrate with terminal by use of solder chip

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