JPS5946846A - Semiconductor sensor - Google Patents

Abstract

PURPOSE:To obtain an inexpensive semiconductor sensor of a throw-away type, by sealing tightly a sensor chip in a sensor prior to use to provide a thorough protection against contamination to the sensor chip and exposing the sensor chip to the outside only while the sensor is in use. CONSTITUTION:A sensor chip 10 is disposed in a molding die which has a notch 17 on the circumference of the part corresponding to a cavity 15 by reserving a slight width therein, and wherein a seating pin 11 and electrodes 14, 14 are projected to the outside from a mold body 16. A molten plastic is injected into the die to form a molding. When the upper part 16A of the body 16 is pushed laterally, the upper part 16A thereof is easily broken off from the lower part 16B thereof along the notch 17. The semiconductor sensor broken out of the upper part 16A of the body 16 is set in a detector by inserting both pins 11, 14 into insertion holes for the pin 11 and pins 14 of the detector. The semiconductor sensor set in such a way performs prescribed detection by the sensor part 12, and feeds the signal relating to said detection through the pin 14 to the detector.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor sensor provided with a protective film such as an oxide film or a nitride film to prevent contamination from the external environment, and more particularly to a disposable type semiconductor sensor.

For example, an oxide film must be formed on the surface of a sensor chip used in such a semiconductor sensor to prevent contamination from the outside.

In particular, in a semiconductor sensor with a structure in which the sensor chip is exposed to the outside, it is necessary to form a dot on the entire surface of the sensor chip. For this reason, fif (magazine r4ON)
IcsJ (February 1978 issue), as shown in Figure 1, a silicon wafer (1) is provided with multiple short boat-shaped cuts (2)...
Oxidation +1 not only on the front and back sides of 1... but also on both sides
1A, and the support part (4) of the processor chip is formed as 4a.
411iMall 1 and then cut from the cut 2+)... to form a sensor chip as shown in the enlarged view of Figure 2. Uj
-C 3. In Figure 2, (5) is a resin mold. However, such a sensor chip is extremely expensive on the market, and therefore, a single-use conductor sensor using such a sensor chip is always expensive as a disposable type, and cannot be easily disposed of. .

In view of the above, the present invention is designed to completely protect the sensor chip from contamination by sealing the sensor chip before use, and allowing the sensor chip to fall outside only when it is used for personal use. To obtain an inexpensive disposable type semiconductor sensor by enabling even an inexpensive processor chip to be used in a disposable type semiconductor sensor, and to easily dispose of the sensor chip.

In order to achieve the above-mentioned object, the present invention is designed to reduce the size of the sensor chip. °The chip is tightly molded with resin together with a part of the electrode pin, and a part of the molding I is broken off at the notch, and the cutoff surface is exposed through the gap. It is configured as follows.

Hereinafter, the present invention will be described in detail with reference to an embodiment shown in the drawings.

FIG. 3 is an external view of a semiconductor according to an embodiment of the present invention from top to bottom, and FIG. 4 is a longitudinal sectional view of FIG. 3.

Sensor chip θQ made of semiconductor wafer such as silicon
is fixed to the seating surface of the seating pin 0υ. Connect the electrode bin (+4) 0ψ via the wirebottom (13Q:1) near both ends of the sensor part 0 force on one side of the sensor part 0ψ.
The detection signal is led out from both pins 0I)0→. Sensor chip (10 is 7/→ so that a gap θ is left at the top of the part O)! J iid
1llll Bi/(II) 04) and a resin mold 1- of plastic etc., and both the Pino(II) (+
41 is Mohr I/body (protrudes from IQ to external force).

When molding the sensor chip (1) configured as described above with resin, insert a filler into the gap (1) or seal it with an inert tube (IJ: ly). , it is possible to completely prevent contamination of the sensor part α.Then, the sensor chip (1 [phase]) is covered with a gap (corresponding to the helmet), leaving a slight width around the part of the sensor chip (1: phase). jL
- Place the seating pin (11) and the electrode (+4) in a mold such that it has a notch (+71) and protrudes outward from the mold body, and inject molten plastic into the mold. However, in order to ensure that the IR5 voids are left in the mold,
Sensor chip' (Itth -.

It is j+fjj +' to place filler material in advance on
It's nice; it's nice.

Next, make this kind of Makizo 11. conductor 4
!ノ→t O') Use will be explained.

First, push the upper part (16A) of molding 1 integral θQ in the horizontal direction. Then, the mold body O0 is made of resin, and a notch (Iη) is formed around it, and there is only a small width between it and the gap in the center, so a part of it (Iη) is formed. , 6A) is simply removed from its lower part (16B) along the notch 07). Since this break-off surface is located at the gap θ0, the sensor portion O is exposed to the broken blood through the gap θ.

FIG. 3 shows the appearance of the semiconductor processor when the upper part (16A) of the mold body 00 is cut away. Here, if a filler has been inserted into the void, it is recommended to remove it. In this way, the upper part (1
The semiconductor sensor 6A,) is inserted into the detection device g by inserting the two bottles 0υ04) into the seating pin Oυ and the insertion hole for the electrode bottle (14) of the detection device (not shown). With this set, the semiconductor sensor performs a predetermined detection using the sensor portion a4 and sends a signal related to the detection to the detection device via the electrode pin 0.

In addition, the semiconductor sensor of the above-mentioned embodiment can be applied to a pressure sensor, a gas sensor, a pH sensor → J, an ion sensor → NO, etc.
It can also be used as a medical processor in the fields of analysis of bath components in blood, urine tests, etc.

As explained above, according to the present invention, at least the part on the 7)→L depth is covered? ;Ullj;
The Seno Iγ Chitsuno is densely molded with resin together with a part of the electrode bottle, etc., so that a notch for removing the Iji is formed with a small width around it, and the notch is shaped like a notch. By the way, when a part of the mold is removed, the sessor part is exposed through the gap, so that it is convenient to break it off. =
In this case, the sensor chip does not need to be contaminated from the outside, and for this reason, the sensor chip can be made by simply cutting out a protective film such as an oxide film on the front and back surfaces of the semiconductor wafer and scribing this. Once upon a time, it became possible to use a very cheap sensor chip.
A cheap and convenient disposable Taino semiconductor processor can be obtained. In addition, according to the present invention, for convenience, the -
・You can obtain a semiconductor sensor that is easy to use by simply breaking off the part.

[Brief explanation of the drawing]

1 and 2 relate to a conventional example, FIG. 1 is a perspective view of a non-contact wafer for explaining the manufacturing method of a processor chip conveniently used in the conventional example, and FIG. 2 is a wafer manufactured by the manufacturing method shown in FIG. The diagrams showing the hvi configuration of the processor chip shown in FIGS. 3 to 5 relate to embodiments of the present invention. FIG. 3 is an external perspective view of an afJ used in an embodiment of the present invention. FIG. 4 is a vertical cross-sectional view of FIG. 3, and FIG. 5 is a perspective view of the appearance of this embodiment in use. θ燵・・・Sessa tip, θυ・Seating bin, 02...
-Sessor part, θF...electrode via, θG...gap, Oe...mold body. (Iη...notch protrusion - person Taikino Kogyo Co., Ltd. agent Patent attorney Kazuhide Okada Figure 1 Figure 2 Figure 4 Figure 3

Claims (1)

[Claims] 1. The cesser chip θ0 is attached to a part of the electrode pin θ so that a gap OQ remains at least near the cesser part 0 on the cesser chip oQ, and a notch Q71 for breaking off with a slight width is formed around the gap OQ. etc., and when a part of the mold is broken off at the notch Q7), there is a breakage of 11V, and a cessation part a comes out through the gap aυ. Characteristic semiconductor sensor.