JPS5946650U - パレツトフイ−ダ− - Google Patents
パレツトフイ−ダ−Info
- Publication number
- JPS5946650U JPS5946650U JP14278182U JP14278182U JPS5946650U JP S5946650 U JPS5946650 U JP S5946650U JP 14278182 U JP14278182 U JP 14278182U JP 14278182 U JP14278182 U JP 14278182U JP S5946650 U JPS5946650 U JP S5946650U
- Authority
- JP
- Japan
- Prior art keywords
- pallet
- pair
- conveyors
- stopper
- predetermined position
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Feeding Of Workpieces (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14278182U JPS5946650U (ja) | 1982-09-20 | 1982-09-20 | パレツトフイ−ダ− |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14278182U JPS5946650U (ja) | 1982-09-20 | 1982-09-20 | パレツトフイ−ダ− |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5946650U true JPS5946650U (ja) | 1984-03-28 |
JPS6140442Y2 JPS6140442Y2 (enrdf_load_stackoverflow) | 1986-11-18 |
Family
ID=30318916
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14278182U Granted JPS5946650U (ja) | 1982-09-20 | 1982-09-20 | パレツトフイ−ダ− |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5946650U (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20210134905A (ko) | 2019-03-07 | 2021-11-11 | 린텍 가부시키가이샤 | 다이 본딩 시트, 및 필름형 접착제가 형성된 반도체 칩의 제조 방법 |
KR20210137020A (ko) | 2019-03-07 | 2021-11-17 | 린텍 가부시키가이샤 | 다이 본딩 시트, 및 필름형 접착제가 형성된 반도체 칩의 제조 방법 |
-
1982
- 1982-09-20 JP JP14278182U patent/JPS5946650U/ja active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20210134905A (ko) | 2019-03-07 | 2021-11-11 | 린텍 가부시키가이샤 | 다이 본딩 시트, 및 필름형 접착제가 형성된 반도체 칩의 제조 방법 |
KR20210137020A (ko) | 2019-03-07 | 2021-11-17 | 린텍 가부시키가이샤 | 다이 본딩 시트, 및 필름형 접착제가 형성된 반도체 칩의 제조 방법 |
Also Published As
Publication number | Publication date |
---|---|
JPS6140442Y2 (enrdf_load_stackoverflow) | 1986-11-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5946650U (ja) | パレツトフイ−ダ− | |
JPS602603U (ja) | 物品案内兼ケ−ス位置決め装置 | |
JPS584532U (ja) | ワ−ク集積装置 | |
JPS60167643U (ja) | 搬送装置 | |
JPS6033U (ja) | 搬送装置の治具切換装置 | |
JPS5926413U (ja) | 搬送コンベア | |
JPS58125642U (ja) | 位置決め機構付き搬送装置 | |
JPS6113997U (ja) | プリント基板搬送装置 | |
JPS58161917U (ja) | 作業台兼用直交搬送装置 | |
JPS588536U (ja) | 組立て作業ラインからの被搬送物搬出装置 | |
JPS6146140U (ja) | 被搬送物姿勢変更機構 | |
JPS5964824U (ja) | 溝形材積載装置 | |
JPS60188103U (ja) | 圧縮包装機における圧縮移送装置 | |
JPS59102282U (ja) | 被加工物搬入出装置 | |
JPS5978203U (ja) | 保形トレイからの箱本体の取り出し装置 | |
JPS5916731U (ja) | プレス用の薄板供給兼塗油装置 | |
JPS5895952U (ja) | 板状体の平積装置 | |
JPS58170131U (ja) | ブランク材等のプレス間搬送装置 | |
JPH0568960U (ja) | 搬送トレイおよびその位置決め装置 | |
JPS588534U (ja) | 組立て作業ラインからの作業台搬出装置 | |
JPS60159716U (ja) | 垂直ベルトコンベヤ−に対する水平ベルトコンベヤ−からの被搬送物移送装置 | |
JPS5943443U (ja) | 板状部材供給装置 | |
JPS60122716U (ja) | ワ−ク整列台 | |
JPS6016424U (ja) | 袋物荷物の自動仕分装置 | |
JPS6049646U (ja) | リ−ドフレ−ムロ−ダ |