JPS5946092A - Method of producing printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION This invention relates to a method of manufacturing a wiring board.

Conventionally, a screen printing method has generally been used as a method for manufacturing printed wiring end plates. Zunawaji,
This is a method of printing enoting resin 1-ink on the surface (conductive material) of the substrate 1 for printing by screen printing, corroding the copper surface where the ink is not attached, and wiring. Such screen printing is not suitable for printing on large scales in a short period of time, and therefore has the disadvantage of being extremely expensive. So, how can I use L7 to use gauze? ■It has the disadvantage of poor one-line reproducibility, and high precision cannot be measured. Therefore, when high-precision products are required, photographic methods are used, but
In this case, the productivity is lower and the yarn costs more.

The present invention solves the above-mentioned conventional drawbacks, has excellent fine line reproducibility compared to the screen printing method, and also enables large-volume printing in a short period of time. The purpose of this invention is to provide a manufacturing method, and in order to achieve this purpose, the present invention basically includes the following steps:
It is characterized by being printed using a lithographic plate that does not require water.

However, the present invention prints enoting resist 1-ink on the surface of a conductive material of a raw substrate for wiring using a waterless lithographic printing method, and prevents corrosion of the parts other than the enoting and cyst ink. . U.

However, such waterless planographic printing is carried out by energizing, off-the-shelf printing, or local printing, but in general, these printing methods are ε1 toy/4. -Transfer!
For example, in the screen printing method, I II
To form an ink film thickness of 3 to 5 tt on the copper surface with 1 shift lithographic printing, it is less than 3 to 5 tt on the copper surface.
Because the film thickness was insufficient, this was
4U; , +4
．． , there (in the present invention, such a lithographic printing method (overcoming the disadvantages of conventional screen printing))'j
From j to I'll printing method, l.

teha (+7 rare force・-962 place, +ri+ t
i' by degrees (, No. 11: It is possible to make IM with Isl-, ?, Print 1-wiring) + (It is a realization of the manufacturing method of IIJ, and that is the one) 1. Accordingly, the present invention provides a photosensitive layer on the second surface of the photosensitive layer 1, and a photosensitive layer on the second surface of the photosensitive layer 1.
)・Produce one printing roll using a printing plate with laminated layers,
, :.

Etching resist ink is printed on the surface of the conductive material from 4 to 4 using an offset printing machine or a letterpress printing machine using a printing plate, and the ink on the printed wiring board is leveled. The ink surface is lubricated by -17, then UV-dried, and then the conductive H curve is etched.

That is, to explain the method of the present invention in more detail, in the present invention, first, as a printing original plate, as shown in FIG.
A rubber elastic layer (2) is laminated on the substrate (1), and a photosensitive IH layer (3) is applied to the surface of the rubber elastic layer (2). 4) Laminate L7
1 and 2, and using this printing original plate (5), a printing plate (6) is produced as in No. 21 Two. The manufacturing method for such a printing plate (6) is the same as the conventional method. For example, the printing plate (5) is manufactured using a positive film.
The surface of the image is exposed to light, and the photoadhesion removes wrinkles in non-print areas.]
By adhering the ink layer (4) and the photosensitive layer (3), and then scraping off the ink layer (4), the non-image area (7) shown in FIG. 2 is removed. rubber gift
The transparent layer (2) is exposed and an ink receiving part (8) is formed.

And in this way the 17th edition (6) is r
Although it has an elastic layer (:)), the L1 flangette is transferred to the second layer and then printed. 1) It is possible to secure a sufficient amount of ink transfer not only in printing presses, but also in continuous printing methods that print directly from the plate cylinder, and printing can be performed even when using a so-called letterpress 111 printing press.1. Moreover, such a printing plate (6) has an ink receiving HUB (R1 depth of up to 3
F + J function up to about 0μ, 1, -re, L, , te.
The amount of ink and transfer is increased, and the method using IC is shown for U, Print I, and wiring boards.
Printed version ((il l::.

How many inks were applied? -11, -]') Nli, 7
After being transferred to I, (l tl , 1), the impression cylinder (11)
(,:21-7tej'tj+wai) Raw board for wiring (12
) Hey? Are you wearing it? ). Manohin No. 1 Figure 11 The letterpress printing press is used to print the back side of the printing press. Transferred to No. 1-group treatment (12) for direct wiring.

In addition, as for the raw board for wiring (12), as shown in FIG.
(eye)', i is used with f layer, lysine 1! There are two types: TL and XL, but polyimide film is used as the base (13) for flexible substrates.
(eg, Kapton brand name) is optimal.

Next, in the present invention, the surface of the raw substrate for wiring (12) printed with ink as described above is leveled, and the surface of the ink (15) is smoothed. Generally, as shown in FIG. 7, the surface of the printed ink (15) may have pinholes to which the ink has not been transferred, and this does not function as an etching resist.
There is a possibility that this type of wiring board may cause a fatal defect such as circuit breakage. Leveling is performed for the purpose of filling such pinholes by leveling the ink surface to 1%. As a method for such L-ringing, for example, a printed raw board for wiring ( 12) Heating the surface with an infrared heating furnace,
There is a method of increasing the fluidity of the ink surface to allow the ink to flow into the pinhole portion, and as shown in Fig. 8, a printed wiring board (12) is passed between the impression cylinders (17) (+7). There are several methods, such as pressing the entire surface of one impression cylinder (17) ζ and C slightly, and pressing both 6 (1 river). Finally, 4: Z, J-, 31, the raw substrate for wiring (12) in Figure 1 printed with Enon non-gresist ink (15) was dried at 11 V of the ink (15). After doing this, the ink (15>1:J) corrodes the outer part of the ink (15), and then peels off this ink (15) and performs the same process as in Section 7I. l, I,
1: I layer ~ 1 saw'? Less IJ space required 2
ノ, -1sl-rwhitea=extremely selfish.

As can be understood from the following explanations, Q2 Invention 1. 2, 4 c, r,
It is done by screen printing method or photocopying, tl, - (manufacture of printed wiring end 1?j without water required), itne off-mono l-printing or direct printing. Maj゛) Hot plate @711.'j1;il'
ζCan be printed on a person's back, and compared to the conventional method, it is much more illuminating;
In addition to being able to notify +Mj with one strike, the present invention - (Shi12
, 2, 1, ゛) Since a printing original plate with U7 and a 1" layer of elastic rubber is used, it is necessary to increase the ink transfer rate or increase the amount of kL, so A1 laminate Q gauze is required. Compared to the screen printing method, the reproducibility of the line is better, and it is possible to obtain a product with less pinballs per bite.Furthermore, there is no need for water, and despite the number of times, To perform UV drying,
It is possible to obtain a product that is superior to the izY method (compared to the /J method), as it can be dried within a short time and can be carried out at a lower cost. In particular, in the present invention, leveling is performed after printing to smooth the ink surface and then prevent corrosion of the copper surface, which further reduces pinholes and makes it possible to stabilize objects with high precision and constant crystallinity. There is an effect that can be supplied.

[Brief explanation of drawings]

Figure 1 is a cross-sectional view of the original printing plate, Figure 2 is a cross-sectional view of the printing plate,
Figure 3 shows offset printing machine 6. A schematic diagram showing the two-way printing method, Figure 4 is a letterpress printing press,! , FIG. 5 is a cross-sectional view of the wiring board 41; FIG. 6 is a cross-sectional view of the raw wiring board after printing, and FIG. 7 is an enlarged view of the main part of FIG. 6. FIG. 8 is a schematic diagram showing an example of a wire and a ring, and FIG. 9 is a sectional view of the wiring base 1. (1) One substrate, (2) Rubber elastic layer, (3
) Photosensitive layer, (4) Silicon layer, (12) Raw substrate for wiring, (14) Copper layer, (1
5) Etching resist ink, (16) - Wiring thread plate patent Applicant: Toyo IC Industry Co., Ltd. 1 attorney, Hisayuki Taruki Figure 5 13 Figure 6 6. 7 14 Tenuma Rokuneifi Masashi W: (Voluntary amendment) λda November H, 1980/-Itimo R 乍 Agency Director Kazuo Wakasugi Screen 1, Incident Indication Patent Application No. 157036 of 1988 2, Name of the invention Method for manufacturing a board wiring board 3, Relationship with the amended case Patent 1] Standard V\ Address 1-3-18 Ashihara, Ryosoku-ku, Osaka Name Toyo Shigyo Co., Ltd. 4 , Daicho 4L〈Address ◎550 Nishi-ku, Osaka City'' ■11-5-2 Yotsubashi Shinkosan Building 9F 6. Number of inventions increased by amendment 7, Subject of amendment Specification 8.7 + li Positive contents 53 River Contents of correction (I) as per Mr. Details shop 1C line 19 1 printable 4mm board 16
゜ "Correct it as raw board for wiring-1. (2), Do 4! '!Printing method 1 on page 3, line 14 of book ♀♀111" is corrected as photographic method J. (3), 700th line 7 [“91st gl J 1
No. 71: /1”. More L

Claims (1)

[Claims] A printing plate is produced using the printing original plate H1-7, and a silicone rubber layer is laminated on the photosensitive layer. Using an offset printing machine or a letterpress printing machine, print Enoting Regis 1 to the ink on the conductive material surface of the raw wiring board, level the ink on the printed raw wiring board to smooth the ink surface, and then 1. A method for manufacturing a printed wiring board, characterized in that the surface of a conductive material is corroded after LJV drying.