JPS593998A - Mounting structure of electronic device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] The present invention relates to a mounting structure for an electronic device.

Figures 1a and 1b show a plan view and a cross-sectional view of a housing of a conventional electronic device.

Conventional electronic devices of this type have two or three vertically elongated functional modules 3 in which printed circuit boards 2 on which a large number of heat generating elements 1 such as LSIs are mounted are mounted in parallel rows, as shown in Figs. The functional modules 3 are stacked one on top of the other, and blowers 4 are provided above and below the functional modules 3 to blow air from below to the top to cool the heat generating elements 1 such as LSIs. Further, the blower 4 and the functional module 3 are held by a rack 5 and further surrounded by a housing 6.

Generally, the heating element 1 of an LSI device has strict temperature limits in order to guarantee its operation, and it is necessary to keep the temperature below a certain limit.

For this reason, how to cool the heat generating element 1 such as an LSI is very important, and this is a major point in determining the mounting structure of an electronic device.

However, due to the rapid progress of semiconductor technology in recent years, the integration density of heat generating elements 1 such as LSIs has improved dramatically, and the amount of heat generated by heat generating elements 1 has also increased rapidly in proportion to this.
With the cooling structure shown in Figure b, it is no longer possible to cool LSIs and the like while maintaining their performance. Therefore, from the perspective of placing emphasis on the cooling structure, instead of stacking the functional modules 3 vertically as shown in Figures 2a and 2b, a single-stage cooling structure was adopted in which the functional modules 3 were arranged horizontally and blowers 4 were placed above and below each functional module 3. There is.

However, this mounting structure has the disadvantage that the length of the cable that transmits electrical signals between the functional modules 3 becomes too long, which poses an obstacle to improving the performance of the electronic device, and furthermore, the body 6 becomes horizontally long. This increases the installation space and has the disadvantage of being unfavorable from an ergonomic point of view.

An object of the present invention is to provide an electronic device mounting structure that can simultaneously satisfy cooling performance and excellent device performance such as not requiring a large installation space and short wiring cables.

In order to achieve the above object, the mounting structure of an electronic device according to the present invention includes a plurality of functional modules each having a plurality of printed circuit boards mounted with a large number of heat generating elements such as LSI mounted in parallel, mounted on a rack and housed in a housing. In the electronic device mounting structure in which the functional modules are cooled by a blower, the functional modules are fixed to the rack so that they form a V-shape with each other horizontally, and the lower and upper sides of each functional module are fixed to the rack. One or more blowers are provided on at least one of the long sides.

According to the above configuration, the object of the present invention is completely achieved.

Hereinafter, the present invention will be explained in more detail with reference to the drawings.

Figures 3a and 3b are a plan view and a sectional view showing an embodiment of the mounting structure according to the present invention.

The functional module 3 is constructed by mounting a plurality of parallel rows of printed circuit boards 2 on which a large number of heat generating elements 1 such as LSIs are mounted.
This functional module 3 is tilted slightly from the vertical position so that the long side becomes the side, and is attached to the rack 5 so as to form a figure 7 with another functional module.

Furthermore, a large number of air blowers 4 are also installed at the positions of the upper long side and the lower long side of each functional module. In this way, V-shaped functional modules and blowers are attached to the rack 5 housed in the housing 6 in multiple layers.

'The cooling structure, which occupies an important element in the mounting structure of the electronic device, is such that cold air sucked in by the blower 4a from the bottom of the casing 6 passes through the functional module 3 and cools the heating element 1 at this time.

The warm air coming out of the functional module 3 is combined with the warm air coming out of other functional modules 3 and exhausted from the top of the housing 6. In this case, the air that enters any functional module 3 is
All cold air is sucked in from the bottom of the housing 6, and is equivalent to -
Although the flow of air that achieves film cooling is diagonal, it is directed from the bottom to the top, which is consistent with the principle that warmed air rises, so it is a natural flow of air. It has become.

The length of the cable between the functional modules 3 is shorter because the functional modules 3 form a figure 7 shape, and the length of the cable connecting both ends of the figure 7 shape is also shorter in the longitudinal direction of the 3 functional modules. The length is sufficient.

Furthermore, if it is desired to further shorten the cable length between the functional modules 3 in terms of the performance of the device, this can be achieved by reducing the angle of the figure 7 shape.

In recent years, electronic devices have tended to be installed in places close to people, such as general offices, and the design of the housing 6 and the balance between vertical and horizontal dimensions have also become important factors.

In particular, the height of the casing 6 is unfavorable from an ergonomic point of view if it is too high or too low; it is desirable that the casing 6 has an appropriate height and a well-balanced vertical and horizontal dimension.
The mounting structure according to the invention by Tsumegi satisfies the main points in this respect as well.

With the recent rise in pollution levels, noise requirements have also become stricter, and lower noise equipment is desired, which can also be expected to reduce noise.

As described in detail above, the present invention can provide an excellent mounting structure that satisfies both cooling performance and device performance by forming functional modules in a seven-shape shape within the housing.

[Brief explanation of the drawing]

Figure 1a is a plan view showing a conventional mounting structure. Figure 1b is a sectional view taken along line A-A in Figure 1a. Figure 2a is a plan view showing another example of the conventional mounting structure. Figure 2b is a plan view showing another example of the conventional mounting structure. 2a is a sectional view taken along line B-B in FIG. 2a, FIG.・Heating element such as LSI 2...Printed circuit board 3...Functional module 4・
...Blower 5...Rack 6...Casing Patent applicant NEC Corporation Representative Patent attorney Hisashi Inoro 2'3 Figure

Claims (1)

[Claims] In the mounting structure of an electronic device, a plurality of functional modules each having a plurality of printed circuit boards mounted with a large number of heat generating elements such as LSIs mounted in parallel are mounted on a rack and housed in a housing, and the functional modules are cooled by a blower. The functional modules are fixed to the rack so that they form a V-shape with each other horizontally, and one or more air blowers are provided on at least one side of the long side of each functional module, which is located at the bottom or top side. Mounting structure of electronic devices.