JPS5926815U - conductive film - Google Patents

conductive film

Info

Publication number
JPS5926815U
JPS5926815U JP12168582U JP12168582U JPS5926815U JP S5926815 U JPS5926815 U JP S5926815U JP 12168582 U JP12168582 U JP 12168582U JP 12168582 U JP12168582 U JP 12168582U JP S5926815 U JPS5926815 U JP S5926815U
Authority
JP
Japan
Prior art keywords
conductive film
base
metal layer
film
layer laminated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12168582U
Other languages
Japanese (ja)
Inventor
道夫 武貞
実 長田
岡本　豊尚
Original Assignee
日立コンデンサ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立コンデンサ株式会社 filed Critical 日立コンデンサ株式会社
Priority to JP12168582U priority Critical patent/JPS5926815U/en
Publication of JPS5926815U publication Critical patent/JPS5926815U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の実施例の断面図、第２図は第１図の実
施例を袋状にしてプリント板を入れる途中の状態の斜視
図、第３図は本考案の他の実施例の断面図を示す。 １．１１・・・・・・基体、２，１２・・・・・・金属
層、３゜１３・・・・・・保護層。Fig. 1 is a cross-sectional view of an embodiment of the present invention, Fig. 2 is a perspective view of the embodiment of Fig. 1 in a bag-like state in the middle of inserting a printed board, and Fig. 3 is another embodiment of the present invention. A cross-sectional view is shown. 1.11...Base, 2,12...Metal layer, 3゜13...Protective layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] フィルム状の基体と、該基体の片面又は両面に積層され
た薄い又は模様状の金属層と、該金属層に積層された導
電性の保護層とからなる導電性フィルム。A conductive film comprising a film-like base, a thin or patterned metal layer laminated on one or both sides of the base, and a conductive protective layer laminated on the metal layer.
JP12168582U 1982-08-12 1982-08-12 conductive film Pending JPS5926815U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12168582U JPS5926815U (en) 1982-08-12 1982-08-12 conductive film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12168582U JPS5926815U (en) 1982-08-12 1982-08-12 conductive film

Publications (1)

Publication Number Publication Date
JPS5926815U true JPS5926815U (en) 1984-02-20

Family

ID=30278406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12168582U Pending JPS5926815U (en) 1982-08-12 1982-08-12 conductive film

Country Status (1)

Country Link
JP (1) JPS5926815U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5595207A (en) * 1979-01-14 1980-07-19 Ritsuo Hasumi Conductive transparent film
JPS56134746A (en) * 1980-03-26 1981-10-21 Sony Corp Method of forming wiring

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5595207A (en) * 1979-01-14 1980-07-19 Ritsuo Hasumi Conductive transparent film
JPS56134746A (en) * 1980-03-26 1981-10-21 Sony Corp Method of forming wiring

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