JPS592455B2 - polypropylene molding material - Google Patents

polypropylene molding material

Info

Publication number
JPS592455B2
JPS592455B2 JP2426477A JP2426477A JPS592455B2 JP S592455 B2 JPS592455 B2 JP S592455B2 JP 2426477 A JP2426477 A JP 2426477A JP 2426477 A JP2426477 A JP 2426477A JP S592455 B2 JPS592455 B2 JP S592455B2
Authority
JP
Japan
Prior art keywords
weight
molecular weight
polypropylene
molding material
polypropylene molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP2426477A
Other languages
Japanese (ja)
Other versions
JPS53109548A (en
Inventor
太郎 原田
泰介 沖田
「たか」尚 原
勇司 池沢
巍 掛谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kasai Kogyo Co Ltd
Sumitomo Chemical Co Ltd
Original Assignee
Kasai Kogyo Co Ltd
Sumitomo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kasai Kogyo Co Ltd, Sumitomo Chemical Co Ltd filed Critical Kasai Kogyo Co Ltd
Priority to JP2426477A priority Critical patent/JPS592455B2/en
Publication of JPS53109548A publication Critical patent/JPS53109548A/en
Publication of JPS592455B2 publication Critical patent/JPS592455B2/en
Expired legal-status Critical Current

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Description

【発明の詳細な説明】 本発明はポリプロピレンに有機充填剤を充填することに
より、ポリプロピレンの衝撃性、曲げ弾1を1、11デ
←:11性および成形品の外観をいつそう良好にせしめ
たポリプロピレン成形材料に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention improves the impact resistance, bending elasticity of polypropylene by filling it with an organic filler, and improves the appearance of molded products. Regarding polypropylene molding materials.

従来、有機充填剤を配合することによつて樹脂の性質を
改良することがプラスチックの射出成形分野や押出成形
分野において工業的に広く実施されており、これらの分
野において有機充填剤は補強性、寸法安定性、剛性、耐
熱性を向上させるために利用されている。
Conventionally, improving the properties of resins by adding organic fillers has been widely practiced industrially in the fields of plastic injection molding and extrusion molding, and in these fields, organic fillers have been used to improve the properties of resins. It is used to improve dimensional stability, rigidity, and heat resistance.

しかしながら有機充填剤とくにセルロース系物質につい
ては130℃の熱風循環乾燥機で2時間乾燥を行つた場
合、5〜10%の乾燥減量に相当する水分を保持してい
る。そしてこのセルロース系物質の保持水分は180℃
以上において急速に遊離水蒸気を発生させる。この水分
が複合材料とした場合に成形性を低下させ、衝撃強度、
剛性、耐熱性、硬度を低下させ、さらに成形品表面にフ
ラッシュ現象を発生させ、成形品の光沢および外観を著
しくそこねている原因となつている。本発明は衝撃強度
、剛性、耐熱性、硬度等の諸物性を向上させ、さらに成
形性を良好にし、かつ成形品の外観、特に光沢を改良し
たポリプロピレン成形材料を提供せんとするものである
However, organic fillers, particularly cellulosic materials, retain moisture equivalent to a loss on drying of 5 to 10% when dried for 2 hours in a hot air circulation dryer at 130°C. The moisture content of this cellulose material is 180°C.
In the above process, free water vapor is rapidly generated. This moisture reduces the formability and impact strength of composite materials.
It reduces the rigidity, heat resistance, and hardness, and also causes a flash phenomenon on the surface of the molded product, which significantly impairs the gloss and appearance of the molded product. The present invention aims to provide a polypropylene molding material that has improved physical properties such as impact strength, rigidity, heat resistance, and hardness, has good moldability, and has improved appearance of molded products, especially gloss.

さらに詳細には数平均分子量が40、000〜150、
00の結晶性ポリプロピレンに20メッシュを通過する
有機充填剤5〜55重量%と1、000〜10、000
の数平均分子量をもつ低分子量ポリオレフィン3〜20
重量%を混合分散されていることを特徴とするポリプロ
ピレン成形材料を提供せんとするものである。J 以下
その詳細を説明すると、先ず本発明で対象となる結晶性
ポリプロピレンはホモポリマーおよびエチレン、ブチレ
ン等の、α−オレフィンとのコポリマーである。
More specifically, the number average molecular weight is 40,000 to 150,
00 crystalline polypropylene with 5-55% by weight of organic filler passing through 20 mesh and 1,000-10,000
A low molecular weight polyolefin having a number average molecular weight of 3 to 20
It is an object of the present invention to provide a polypropylene molding material characterized in that the polypropylene molding material is mixed and dispersed in a proportion by weight. J To explain the details below, first, the crystalline polypropylene targeted by the present invention is a homopolymer and a copolymer with an α-olefin such as ethylene or butylene.

そしてさらに酸化防止剤、中和剤、紫外線吸収剤、帯電
防止剤、顔料、分散剤、ク 滑剤、可塑剤、無機充填剤
といつた通常の添加剤、ウー充填剤を任意に用いること
が可能であり、本発明の効果に対し障害とはならない。
Further, conventional additives such as antioxidants, neutralizers, ultraviolet absorbers, antistatic agents, pigments, dispersants, lubricants, plasticizers, inorganic fillers, and woo fillers can be optionally used. Therefore, this does not pose an obstacle to the effects of the present invention.

次に有機充填剤としては木粉、セルロースパウダー、モ
ミガラ、パルプおよびこれらの混合物が用いられ、粒度
としては20メツシユ、好ましくは80メツシユより細
かいものを用いる。この有機充填剤の充填量は5〜55
重量%、好ましくは25〜40重量%充填するもので5
6重量%以上では成形性が極端に低下し、成形品の外観
が悪くなり機械的性質、特に衝撃強度が低下する。低分
子量ポリオレフインは分子量が1,000〜10,00
01好ましくは1,000〜5,000で10,000
より大きくなると成形品の外観が悪くなり、量的には3
〜20重量%、好ましくは5〜15重量%で3重量%未
満では表面改良の効果がなく、21重量%以上になると
衝撃強度、耐熱性=7iフ電?;?X:ご′.′:′:
岑―である。
Next, as the organic filler, wood flour, cellulose powder, rice hulls, pulp, and mixtures thereof are used, and the particle size is finer than 20 mesh, preferably smaller than 80 mesh. The filling amount of this organic filler is 5 to 55
5% by weight, preferably 25-40% by weight.
If it exceeds 6% by weight, the moldability is extremely reduced, the appearance of the molded product becomes poor, and the mechanical properties, especially the impact strength, are reduced. Low molecular weight polyolefin has a molecular weight of 1,000 to 10,00
01 preferably 1,000 to 5,000 and 10,000
The larger the size, the worse the appearance of the molded product, and the larger the quantity.
~20% by weight, preferably 5 to 15% by weight. If it is less than 3% by weight, there is no surface improvement effect, and if it exceeds 21% by weight, impact strength and heat resistance = 7i Fden? ;? X: Thank you. ′:′:
It is 岑.

この低分子量ポリオレフインは成形性を向上させること
は言うまでもなく、有機充填剤による剛性、寸法安定性
、耐熱性をいつそう向上させ、特に成形品の表面を改良
する上で非常に有用なものであり、3〜20重量%配合
せしめることにする。結晶性ポリプロピレンに有機充填
剤および低分子量を混合分散させる方法は1軸、2軸押
出機、ロール、バンバリ一等の溶融混練機が利用できる
This low-molecular-weight polyolefin not only improves moldability but also improves the rigidity, dimensional stability, and heat resistance of organic fillers, and is particularly useful for improving the surface of molded products. , 3 to 20% by weight. For mixing and dispersing the organic filler and the low molecular weight into the crystalline polypropylene, a melt kneader such as a single-screw or twin-screw extruder, a roll, or a Banbury type can be used.

成形方法は射出成形法が最適であるが押出、圧縮等の各
種成形方法も採用し得る。本発明のポリプロピレン成形
材料は各種の構造材料として使用される。
The most suitable molding method is injection molding, but various molding methods such as extrusion and compression may also be used. The polypropylene molding material of the present invention is used as a variety of structural materials.

実施例 1〜5 下表に示すように結晶性ポリプロピレンは数平均分子量
50,000のもの、有機充填剤として20メツシユを
通過する木粉、低分子量ポリオレフインとして低分子量
ポリプロピレン(数平均分子量4,000)を用いて、
重量組成比を変化させ、粉体混合機で5〜10分混合し
、温度200℃でベント付2軸押出機(65m1!Lφ
)を使用し押出ペレツトを作成した。
Examples 1 to 5 As shown in the table below, crystalline polypropylene had a number average molecular weight of 50,000, wood flour that passed through 20 meshes was used as the organic filler, and low molecular weight polypropylene (number average molecular weight of 4,000) was used as the low molecular weight polyolefin. )Using,
After changing the weight composition ratio, mixing for 5 to 10 minutes using a powder mixer, and using a vented twin-screw extruder (65 m1! Lφ) at a temperature of 200°C.
) was used to create extruded pellets.

Claims (1)

【特許請求の範囲】[Claims] 1 数平均分子量が40,000〜150,000の結
晶性ポリプロピレンに20メッシュを通過する有機充填
剤5〜55重量%と1,000〜10,000の数平均
分子量をもつ低分子量ポリオレフィン3〜20重量%を
混合分散させたことを特徴とするポリプロピレン成形材
料。
1 Crystalline polypropylene with a number average molecular weight of 40,000 to 150,000, 5 to 55% by weight of an organic filler that passes through 20 mesh, and 3 to 20% of a low molecular weight polyolefin with a number average molecular weight of 1,000 to 10,000. A polypropylene molding material characterized by mixing and dispersing % by weight.
JP2426477A 1977-03-04 1977-03-04 polypropylene molding material Expired JPS592455B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2426477A JPS592455B2 (en) 1977-03-04 1977-03-04 polypropylene molding material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2426477A JPS592455B2 (en) 1977-03-04 1977-03-04 polypropylene molding material

Publications (2)

Publication Number Publication Date
JPS53109548A JPS53109548A (en) 1978-09-25
JPS592455B2 true JPS592455B2 (en) 1984-01-18

Family

ID=12133367

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2426477A Expired JPS592455B2 (en) 1977-03-04 1977-03-04 polypropylene molding material

Country Status (1)

Country Link
JP (1) JPS592455B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01101658U (en) * 1987-12-25 1989-07-07
US6841239B2 (en) 2001-09-28 2005-01-11 Katuyuki Hasegawa Composite wood and manufacturing method thereof

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58217552A (en) * 1982-06-12 1983-12-17 Kasai Kogyo Co Ltd Composite resin composition
CN102732044B (en) * 2012-07-20 2014-04-09 鑫盛(湖州)塑木科技有限公司 Anti-aging wood-plastic composite material board and preparation method thereof
JP2014214202A (en) * 2013-04-24 2014-11-17 株式会社プライムポリマー Polypropylene resin composition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01101658U (en) * 1987-12-25 1989-07-07
US6841239B2 (en) 2001-09-28 2005-01-11 Katuyuki Hasegawa Composite wood and manufacturing method thereof

Also Published As

Publication number Publication date
JPS53109548A (en) 1978-09-25

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