JPS59223746A - Phenolic resin molding material for substrate to be plated - Google Patents

Abstract

PURPOSE:To provide the titled material for a substrate which can be directly electroplated without requiring any chemical plating stage, by adding specified quantities of an electrically conductive material and rubber. CONSTITUTION:3-10% (based on the quantity of molding material) rubber, pref. nitrile rubber, and an electrically conductive material, e.g. metallic powder, carbon black or graphite, in a sufficient quantity to make the volume resistivity of molding 10<3>OMEGAcm or below, are mixed with a phenolic resin compsn. consisting of a resol type phenolic resin (a novolak type phenolic resin may be used together with a hardener such as hexamethylenetetramine), a filler, e.g., woodmeal or calcium carbonate, and a parting agent, e.g., wax or metallic soap, to obtain a phenolic resin molding material for a substrate to be plated.

Description

[Detailed Description of the Invention] [Technical Field] The present invention relates to a phenolic resin molding material used for wiring devices, electrical appliances, household goods, etc., and particularly relates to a phenolic resin molding material for producing molded products that do not require chemical money. It is something.

[Background technology]

Conventionally, plating phenolic resin molded products required the following steps: degreasing the molded product, pre-etching, etching, neutralization, chemical plating, and electroplating, but these processes were long and caused increased costs. .

[Purpose of the invention]

The purpose of the invention is to omit the chemical plating process and to immediately produce electric money.

[Disclosure of the invention]

The invention was made by molding a phenolic resin by adding conductive materials and combs so that the volume resistivity of the molded product was less than 1OΩO7+, which made it possible to apply electrical money directly to the molded product. It is.

The present invention will be explained in detail below. The phenolic resin used in the present invention is a mixture of phenols such as phenol, cresol, and xylenol, or phenols modified with sugar melon, liqunin, xylene, naphthalene, petroleum aromatic hydrocarbons, etc., and aldehydes such as formalin and formaldehyde. Novolac type phenol resins are mixed in a molar ratio of 1 to 1 and reacted under an acidic catalyst such as hydrochloric acid, sulfuric acid, or oxalic acid, or resol type phenolic resins are reacted under an alkaline catalyst such as sodium hydroxide, ammonia, or amine.

When using a novolak type phenol resin, 6 to 20% by weight (hereinafter simply referred to as %) of hexamethylenetetramine is added to the resin as a curing agent. Organic or inorganic fillers such as wood flour, calcium carbonate, pulp, and silica are used as fillers, and stearic acid, wax, metal soap, etc. are used as release agents. As the conductive material, metal powder, metal foil, metal piece, carbon black, graphite, etc. are used. The amount of conductive material added varies depending on the type of filler, the amount added, etc., but it must be added so that the volume resistivity of the molded product is 10Ω or less. That is, if the volume resistivity exceeds 1♂Ω, it becomes impossible to directly electroplate the molded product. As the rubber added to improve the adhesion between the molded product and the plating layer, styrene rubber, butyl rubber, inprene rubber, nitrile rubber, chloroprene rubber, etc. are used, but nitrile rubber is preferable because it has excellent compatibility with phenolic resin. 3 to 1 for the total amount
It is desirable to add 0%. That is, if it is less than 3%, the adhesion between the molded product and the plating layer tends to decrease, and if it exceeds 10%, the rigidity tends to decrease.

Because there is. The phenolic resin, curing agent, conductive material, rubber, filler, mold release agent, coloring agent, etc. are thus mixed, mixed, and pulverized to obtain a phenolic resin molding material for the donor base.

The present invention will be explained below using examples.

Example 1 8 parts of hexamethylenetetramine, 2 parts of stearic acid, 2 parts of carbon black, 3 parts of novolak type phenolic resin with a softening point of 90° C.
10 parts of aluminum foil of 0 mesh, 3 parts of nitrile rubber, and 35 parts of heavy calcium carbonate were added, mixed, mixed, and crushed to obtain a phenolic resin molding material for plating base.

Example 2 To 40 parts of the same phenolic resin as in Example 1, 8 parts of hexamethylenetetramine, 2 parts of stearic acid, 2 parts of carbon black, 50 parts of brass powder (20 parts of powder, 10 parts of nitrile rubber, heavy 18 parts of calcium carbonate was added and treated in the same manner as in Example 1 to obtain a phenolic resin molding material for coin bases.

Conventional Example: To 40 parts of the same phenolic resin as in Example 1, 8 parts of hexamethylenetetramine, 2 parts of stearic acid, 2 parts of carbon black, 40 parts of 100 Me Soche wood powder, and 8 parts of heavy calcium carbonate were added. [Effect of the invention] The phenolic resin molding materials of Examples 1 and 2 and the conventional example were molded for 1 minute at a molding temperature of 170°C and a molding pressure of 150 mm to a thickness of 3. A simple molded article was obtained, the molded article was degreased with trichlorethylene, pre-etched with a 10% sodium hydroxide solution, etched with a mixed solution of sulfuric acid, phosphoric acid and potassium chromate, and neutralized with 5% hydrochloric acid. As is clear from Table 1, the results of electrolytic copper plating for minutes show that beautiful and strong copper plating was applied to the molded products obtained from the phenolic resin molding material for plating bases of the present invention, but compared to the conventional example. It was confirmed that the present invention was superior because it could not be plated.

Table 1 patent applicant Matsushita Electric Works Co., Ltd. Representative Patent Attorney Toshimaru Takemoto (2 idiots)

Claims (1)

[Claims] (1) A phenolic resin molding material consisting of a phenolic resin, a curing agent, a filler, a mold release agent, etc. is further added with a conductive material and rubber so that the volume resistivity of the molded product is 105 Ωm or less. A phenolic resin molding material for plating substrates.