JPS59219428A - Production of electrical contact material - Google Patents

Production of electrical contact material

Info

Publication number
JPS59219428A
JPS59219428A JP58094603A JP9460383A JPS59219428A JP S59219428 A JPS59219428 A JP S59219428A JP 58094603 A JP58094603 A JP 58094603A JP 9460383 A JP9460383 A JP 9460383A JP S59219428 A JPS59219428 A JP S59219428A
Authority
JP
Japan
Prior art keywords
oxide
electrical contact
resistance
terms
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58094603A
Other languages
Japanese (ja)
Inventor
Shinichi Hashizume
橋詰 伸一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Tateisi Electronics Co
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tateisi Electronics Co, Omron Tateisi Electronics Co filed Critical Tateisi Electronics Co
Priority to JP58094603A priority Critical patent/JPS59219428A/en
Publication of JPS59219428A publication Critical patent/JPS59219428A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00Contacts
    • H01H1/02Contacts characterised by the material thereof
    • H01H1/021Composite material
    • H01H1/023Composite material having a noble metal as the basic material
    • H01H1/0237Composite material having a noble metal as the basic material and containing oxides
    • H01H1/02372Composite material having a noble metal as the basic material and containing oxides containing as major components one or more oxides of the following elements only: Cd, Sn, Zn, In, Bi, Sb or Te

Abstract

PURPOSE:To produce inexpensively a material having excellent resistance to melt sticking and contact performance by press molding a specifically composed powder mixture contg. Ni and oxides of In, Zn and Cu and the balance Ag then sintering the molding in a reducing atmosphere thereby reducing a part of the oxides. CONSTITUTION:A powder mixture composed of 10-30% Ni, 1.7-5% In oxide (in terms of In), 1.7-15% Zn oxide (in terms of Zn), 1.7-10% Cu oxide (in terms of Cu) and the balance substantially Ag is press molded. The molding is sintered in a reducing atmosphere of decomposed gaseous NH3 and at the same time at least a part of the above-described oxides are reduced and are solutionized in the Ni to fine the Ni alloy. The fine Ni alloy particles are thus dispersed in the Ag matrix. A part of the reduced metal is solutionized into the Ag as well to increase slightly the resistance as compared to pure Ag but poses no problem as an electrical contact material.

Description

【発明の詳細な説明】 本発明は電気接点材料の製造方法、特に、耐溶着性に際
J已−無占な電気接点用焼結材料の製造方法に関す−る
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing an electrical contact material, and more particularly to a method of manufacturing a sintered material for an electrical contact that is superior in welding resistance.

従来、中負荷領域の電気接点材料として汎用されている
t\8(、、′、tlO系焼結材料は、陵れL二接点性
能を有12ている/ア(、有害なCdを材料とするため
その製造[程および使用中にCdを含有する粉塵となっ
て公害を発生する恐れがあり、しかもAg含有量か多い
為コストが高いという欠点もあった。
Conventionally, the t\8(,,',tlO-based sintered material, which has been widely used as an electrical contact material in the medium load range, has a ridge L2 contact performance.) Therefore, during the manufacturing process and during use, there is a risk that dust containing Cd will be generated and cause pollution, and furthermore, it has the disadvantage of being high in cost due to the high Ag content.

池方、Cdを含有しない無害な電気接点材料としてA3
Ni系焼結材料か実用化されているが、このABNi系
焼結材料はA g Cd O系のものに比べ耐溶着性に
おいて劣るという問題があった。
Ikegata, A3 as a harmless electrical contact material that does not contain Cd
Although Ni-based sintered materials have been put into practical use, this ABNi-based sintered material has a problem in that it is inferior in welding resistance compared to A g Cd O-based materials.

本発明は、従来のAHNi系焼結材料の欠点である耐溶
着性を向上させると共に、AgCd0系電気接点祠料と
同等以」二の接点性能を有する安価な電気接点材料を製
造でbるようにすることを目的とするものである。
The present invention improves the welding resistance, which is a drawback of conventional AHNi-based sintered materials, and makes it possible to manufacture inexpensive electrical contact materials that have contact performance equivalent to or better than AgCd0-based electrical contact abrasives. The purpose is to

本発明の要旨は、N i  10 = 3 (1%、I
n酸化物 In換抹で1.7・〜5%、Z、n酸化物 
Zn換算で1.7−15%、Cu酸化物 Cu換算で1
.7−1 f)%、残部実質的にABからなる混合粉末
を加圧成形した後、還元性雰囲気中で焼結させるととも
に、前記酸化物の少なくとも一部を還元して、AHおよ
びNi中に金属の形態で固溶させることを特徴とする電
気接点材料の製造方法にある。
The gist of the invention is that N i 10 = 3 (1%, I
n oxide 1.7-5% in In exchange, Z, n oxide
1.7-15% in terms of Zn, 1 in terms of Cu oxide Cu
.. After press-molding a mixed powder consisting of 7-1 f)% and the remainder substantially AB, it is sintered in a reducing atmosphere, and at least a portion of the oxide is reduced to form a mixture in AH and Ni. A method for producing an electrical contact material, characterized by solid solution in the form of metal.

本発明に係る電気接点用焼結材料の成分組成を前記のよ
うに限定した理由について説明すると、Niは耐消耗性
を向上させるだめに添加されるが、Nl力弓O%未満で
はその効果が引)れず、また3()%を越えると加]−
性が悪くなるので゛、10−・30%とした。また、Z
++酸化物は耐溶着性を向−]二させるために添加され
るもので、その添加量が金属Znに換算して1,7%未
満ではその添加効果が充分に達成されず、15%を越え
ると加工性が悪くなるので1,7〜15%とした。In
酸化物は接触抵抗を安定させるために添加されるもので
、その添加量か金属Inに換算して1.7%未満ではそ
の添加効果か充分に達成されず、5%を越えると接触抵
抗か増大し耐溶着性が悪くなるので1.7・〜5%とし
た。Cu酸化物は接触抵抗とN1の分散性を向]二させ
るために添加されるもので゛、その添加量が金属CLI
に換算して1.7%未満ではNiの分散性の改善かみら
れず、10%を越えると耐溶着性が劣化するので1.7
〜10%とした。
To explain the reason why the composition of the sintered material for electrical contacts according to the present invention is limited as described above, Ni is added to improve the wear resistance, but if the Nl strength is less than 0%, the effect is ), and if it exceeds 3()%, it will be added] -
Since the properties would be worse, it was set at 10-30%. Also, Z
++ Oxide is added to improve welding resistance, and if the amount added is less than 1.7% in terms of metal Zn, the effect of addition will not be fully achieved, and if the amount is less than 15% If it exceeds this, workability deteriorates, so it was set at 1.7 to 15%. In
Oxides are added to stabilize the contact resistance, and if the added amount is less than 1.7% in terms of metal In, the effect of the addition will not be sufficiently achieved, and if it exceeds 5%, the contact resistance will decrease. Since this increases, the welding resistance deteriorates, so it was set at 1.7% to 5%. Cu oxide is added to improve the contact resistance and the dispersibility of N1, and the amount of Cu oxide is determined by the metal CLI.
If it is less than 1.7%, no improvement in Ni dispersibility will be seen, and if it exceeds 10%, the welding resistance will deteriorate.
~10%.

前記成分組成の本発明方法に係る電気接点材料は、従来
のAgNi系焼結材料に比べ耐溶着性が大幅に改善され
、AgCd(−)系焼結材料と同等の耐溶着性を示す。
The electrical contact material according to the method of the present invention having the above-mentioned composition has greatly improved adhesion resistance compared to conventional AgNi-based sintered materials, and exhibits adhesion resistance equivalent to that of AgCd(-)-based sintered materials.

また、接触抵抗および耐消耗性に関しては、A3Ni;
l’、のものと同等“ぐあり、!Xg Cd O系のも
のに比べて弱干劣るが実用■−問題となる程度の差では
ない。しかも、本発明方法に係る電気接点材料は、A 
g Cd (’)系焼結材料に比べA8含有量を低減で
きるので安価に製造することかでと、有害なCdを含有
しないので公害発生の原因となることがない。
In addition, regarding contact resistance and wear resistance, A3Ni;
The electrical contact material according to the method of the present invention is slightly inferior to that of Xg Cd O-based material, but it is not a problem for practical use.Moreover, the electrical contact material according to the method of the present invention has a
The A8 content can be reduced compared to g Cd (')-based sintered materials, so it can be manufactured at low cost, and since it does not contain harmful Cd, it does not cause pollution.

前記電気接点材料は、本発明によれば、原料どしてAg
、Ni、Zn酸化物、In酸化物および’Cu酸化物の
各微粉末を用い、これらを所定比で配合し、加圧成形後
、分解アンモニアガス(N、、+02)などの還元性雰
囲気中700〜i300 ℃で1〜20時間焼結する方
法により製造されるが、ユれは原料としてA8、Ni、
金属7口、Inおよび(、−i+を用いた場合に比べ、
焼結過程で前記酸化物の少なくとも一部が還元されNi
中に固溶し、Ni合金の微細化加工が行なわれるため、
より微細なNi合金粒子のAgマ)・リツクス・\の分
散を得ることかで・きるからである。なお、還元された
Zn、InおよびCuの一部はAg中にも固溶し、純A
gに比べて若干抵抗を増大させるが、電気接点材料とし
て特に問題となることはない。また、焼結後、得られた
焼結体にザイジング、コイニングなどの再加工を施すの
が好ましい。
According to the present invention, the electrical contact material is made of Ag as a raw material.
, Ni, Zn oxide, In oxide, and 'Cu oxide fine powders are mixed in a predetermined ratio, and after pressure molding, in a reducing atmosphere such as decomposed ammonia gas (N, +02). It is manufactured by a method of sintering at 700 to 300 °C for 1 to 20 hours, and the raw materials are A8, Ni,
Compared to the case of using 7 metal ports, In and (, -i+,
During the sintering process, at least a portion of the oxide is reduced and Ni
Since Ni is solid-solved in the Ni alloy and micro-processing is carried out,
This is because it can be achieved by obtaining finer Ni alloy particle dispersion. Note that some of the reduced Zn, In, and Cu are also dissolved in Ag, resulting in pure A.
Although it increases the resistance slightly compared to g, it does not pose any particular problem as an electrical contact material. Further, after sintering, it is preferable to subject the obtained sintered body to reprocessing such as sizing and coining.

原料粉末としては、通常、0.1〜N)3p、好ましく
は0.5〜20μのちのか使用でbるが、これらは市販
のものをそのまま使用すればよい。
The raw material powder is usually 0.1 to 3p, preferably 0.5 to 20μ, and commercially available powders may be used as they are.

以下、本発明の実施例について説明する。Examples of the present invention will be described below.

実施例 原料粉末をAg(平均粒径:1.08μ) 70重景%
、Ni(平均粒径:2.2μ) 15重量%、Zn0(
平均粒径: 5 、tt :  5重量%(Z11換算
)、  111203(平均粒径:5μ) 5重量%(
I n換算)、Cu20(平均粒径:0,5μ) 5重
量%(Cu換算)の割合で配合してボールミルにて均一
に混合し、その混合粉末を4L/can’の圧力下で直
径20 ++on、長さ30InII+に成形し、得ら
れた成形水を還元性ガス雰囲気(N2+02)中750
 ’Cで2時間加熱して焼結させ電気接点用焼結体を得
た。この焼結体を7()0〜800℃に加熱し、押出機
を用いて直径6munの棒状体に成形しlこ後、伸線ヘ
ラグーにて加工して得y、−H点をリレーに組み込み、
供試品とし、た5、比較例 1 原料として実施例で用いtAHbよびt、’、) a 
Oの粉末を用い、実施例と同様1こしてAg−12%(
、dOからなる焼結体を得て接点とな12、−れをリレ
ーに組み込み供試品とした。
Example raw material powder was Ag (average particle size: 1.08μ) 70%
, Ni (average particle size: 2.2μ) 15% by weight, Zn0 (
Average particle size: 5, tt: 5% by weight (Z11 conversion), 111203 (average particle size: 5μ) 5% by weight (
Cu20 (average particle size: 0.5μ) 5% by weight (Cu conversion) was mixed uniformly in a ball mill, and the mixed powder was milled under a pressure of 4L/can' with a diameter of 20 ++on, molded to a length of 30 InII+, and the resulting molding water was heated to 750 mm in a reducing gas atmosphere (N2+02).
The sintered body was heated and sintered at C for 2 hours to obtain a sintered body for an electrical contact. This sintered body is heated to 7()0 to 800°C, formed into a rod-shaped body with a diameter of 6 mun using an extruder, and then processed with a wire drawing machine to make the obtained points y and -H into relays. built-in,
Comparative Example 1 tAHb and t,',) a used as raw materials in Examples
Using O powder, 1 strain as in the example and Ag-12% (
A sintered body made of , dO was obtained, and a contact point (12, -) was assembled into a relay as a test product.

比較例 2 原料として実施例で用いプこA3およびNiの粉末を用
い、これらをA810%、I鳩131)%の重量比で混
合し、実施例と同様に1.てABNi系焼結体を得て接
点となし、これをリレ〜に糾み込み供試品とした。
Comparative Example 2 The powders of Puco A3 and Ni used in the Examples were used as raw materials, and these were mixed at a weight ratio of 10% A and 131% by weight, and 1. An ABNi-based sintered body was obtained and used as a contact, and this was stuffed into a relay to prepare a sample.

比較例 3 実施例で用いた原料粉末をAg 7(1%、Ni15%
、In  5%、Zn  5%、Cu  5%の重量比
で混合し、実施例と同様にして焼結体を得て接点となし
、これをリレーに組み込み供試品とし前記各実施例およ
び比較例で得た供試品について、下記の条件で接触抵抗
、耐消耗性および溶着特性を測定した。それらの結果を
表に示す。なお、耐消耗性に−)いては35万回開閉動
作させた時、接点の接触力か5g以下になったリレーの
個数で表わしである。
Comparative Example 3 The raw material powder used in the example was Ag 7 (1%, Ni 15%).
, In 5%, Zn 5%, and Cu 5% by weight were mixed, a sintered body was obtained in the same manner as in the example, and used as a contact.This was incorporated into a relay and used as a test sample for each of the above examples and comparison. The contact resistance, abrasion resistance, and welding characteristics of the sample obtained in the example were measured under the following conditions. The results are shown in the table. In addition, wear resistance (-) is expressed as the number of relays whose contact force was 5 g or less after 350,000 opening and closing operations.

[試験条1!+ 1 供試品:   リレー(2C)各5個 電圧:     AC22(IV 電流=4A 負荷:    抵抗負荷 接触カニ   初期20〜3()g 開閉頻度:  30回/分 1表 1】 接触抵抗 耐消耗性 溶着寿命 (mΩ)   (個)   (方間) 実施例   〜67   2    45比較例1 〜
40   1    45比較例2 〜70   2 
   38比較例3 〜69   2    42表1
に示す結果から明らかなように、本発明に係る電気接点
材料は、比較例2や比較例3のものに比べ耐溶着性が大
幅に改善され、比較例1のものと同等の特性を示してい
る。また、接触抵抗や耐消耗性については、比較例1の
ものに比べてわずかに劣るものの、実用上あまり問題と
ならない程度の差であることかわかる。
[Test article 1! + 1 Test product: 5 relays (2C) each Voltage: AC22 (IV Current = 4A Load: Resistance load contact crab Initial 20~3()g Opening/closing frequency: 30 times/min 1 Table 1) Contact resistance Wear resistance Welding life (mΩ) (pcs) (distance) Example ~67 2 45 Comparative example 1 ~
40 1 45 Comparative example 2 ~70 2
38 Comparative Example 3 ~69 2 42 Table 1
As is clear from the results shown in , the electrical contact material according to the present invention has significantly improved adhesion resistance compared to those of Comparative Example 2 and Comparative Example 3, and exhibits the same characteristics as that of Comparative Example 1. There is. Furthermore, although the contact resistance and abrasion resistance are slightly inferior to those of Comparative Example 1, it can be seen that the difference is such that it does not pose much of a problem in practice.

特 許 出 願 人 立石電磯株式会社代 理 人 弁
理士 青白 葆ばか2名手続補正書篩幻 1、事件の表示 昭和58年特許願第  94603     号2、発
明の名称 電気接点材料の製造方法 3、補正をする者 事件との関係 特許出願人 4、代理人 5、補正命令の日付 (自発補正) 6補正の対象 (1)明細書の「発明の詳細な説明」の欄。Q7、補正
の内容 1)明細書中、次の箇所を訂正する。
Patent applicant: Tateishi Deniso Co., Ltd. Agent: Patent attorney: Blue and white, two idiots Procedural amendment phantom 1, Indication of the case: Patent application No. 94603 filed in 1982 2, Name of the invention: Process for manufacturing electrical contact materials 3 , Relationship with the case of the person making the amendment Patent applicant 4 Patent agent 5 Date of amendment order (voluntary amendment) 6 Subject of amendment (1) "Detailed description of the invention" column of the specification. Q7. Contents of the amendment 1) The following parts in the specification are to be corrected.

゛(1)第4頁13行および第5頁19〜20行にrN
2+o2Jとあるを、「N2+H2」とそれぞれ訂正す
る。
゛(1) rN on page 4, line 13 and page 5, lines 19-20
2+o2J should be corrected to "N2+H2".

(2)第5頁16行「o、5μ」とあるを、「5μ」と
訂正する。
(2) On page 5, line 16, "o, 5μ" should be corrected to "5μ."

(3)第6頁17〜19行「実施例・・・・混合し、」
とあるを、次の通り訂正する。
(3) Page 6, lines 17-19 “Example...mixed,”
The statement is corrected as follows.

1実施例で用いた原料粉末AgおよびNiを金属In、
CuおよびZnと共にAg70%、Ni  15%、I
n(平均粒径:5μ) 5%、Zn(平均粒径:5μ)
5%、Cu(平均JR径:5μ) 5%の重量比で混合
し、」 以上
The raw material powders Ag and Ni used in Example 1 were replaced with metal In,
Ag 70%, Ni 15%, I along with Cu and Zn
n (average particle size: 5μ) 5%, Zn (average particle size: 5μ)
5%, Cu (average JR diameter: 5μ) mixed at a weight ratio of 5%,

Claims (1)

【特許請求の範囲】[Claims] (1)  Ni  141〜30%、In酸化物 In
換算で1.7〜5%、Zn酸化物 Zn換算で・1.7
〜15%、Cu酸化物 CLI換算で1.7−10%、
残部実質的にABからなる混合粉末を加圧成形した後、
還元性雰囲気中で゛焼結させるとともに、前記酸化物の
少なくとも−・部を還ノCして、A8およびN1中に金
属の形態で・固溶させることを特徴と4−る電気接点材
料の製造方法。
(1) Ni 141-30%, In oxide In
1.7 to 5% in terms of Zn oxide ・1.7 in terms of Zn
~15%, Cu oxide CLI equivalent: 1.7-10%,
After pressure-molding the mixed powder, the remainder of which consists essentially of AB,
4. An electrical contact material characterized in that it is sintered in a reducing atmosphere and at least a part of the oxide is reduced and dissolved in the form of a metal in A8 and N1. Production method.
JP58094603A 1983-05-27 1983-05-27 Production of electrical contact material Pending JPS59219428A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58094603A JPS59219428A (en) 1983-05-27 1983-05-27 Production of electrical contact material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58094603A JPS59219428A (en) 1983-05-27 1983-05-27 Production of electrical contact material

Publications (1)

Publication Number Publication Date
JPS59219428A true JPS59219428A (en) 1984-12-10

Family

ID=14114826

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58094603A Pending JPS59219428A (en) 1983-05-27 1983-05-27 Production of electrical contact material

Country Status (1)

Country Link
JP (1) JPS59219428A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110250089A1 (en) * 2010-04-09 2011-10-13 Mitsubishi Materials Corporation Clayish composition for forming sintered silver alloy body, powder for clayish composition for forming sintered silver alloy body, method for manufacturing clayish composition for forming sintered silver alloy body, sintered silver alloy body, and method for manufacturing sintered silver alloy body

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110250089A1 (en) * 2010-04-09 2011-10-13 Mitsubishi Materials Corporation Clayish composition for forming sintered silver alloy body, powder for clayish composition for forming sintered silver alloy body, method for manufacturing clayish composition for forming sintered silver alloy body, sintered silver alloy body, and method for manufacturing sintered silver alloy body
US8308841B2 (en) * 2010-04-09 2012-11-13 Mitsubishi Materials Corporation Clayish composition for forming sintered silver alloy body, powder for clayish composition for forming sintered silver alloy body, method for manufacturing clayish composition for forming sintered silver alloy body, sintered silver alloy body, and method for manufacturing sintered silver alloy body
US8496726B2 (en) 2010-04-09 2013-07-30 Mitsubishi Materials Corporation Clayish composition for forming sintered silver alloy body, powder for clayish composition for forming sintered silver alloy body, method for manufacturing clayish composition for forming sintered silver alloy body, sintered silver alloy body, and method for manufacturing sintered silver alloy body
US9399254B2 (en) 2010-04-09 2016-07-26 Mitsubishi Materials Corporation Clayish composition for forming sintered silver alloy body, powder for clayish composition for forming sintered silver alloy body, method for manufacturing clayish composition for forming sintered silver alloy body, sintered silver alloy body, and method for manufacturing sintered silver alloy body

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