JPS59216218A - High-speed computer system - Google Patents

Abstract

PURPOSE:To enhance the packing density of a computer main body by providing a cooling passage on a substrate which consists of materials having high thermal conductivity, and has IC chips fixed and flowing forcibly a very low-temperature fluid to this passage. CONSTITUTION:A computer body 3 is stored in a vacuum vessel 1. The body 3 is constituted by combining IC chips P incorporating Josephson junction elements. Chips are fixed to the surface of a substrate 10, and the substrate 10 is fixed to a board 11. A cooling fluid passage 12 is provided in each substrate 10 and the board 11, and one ends of pipes 13 and 14 and one ends of pipes 16 and 17 are connected to the entrance and the exit of the system of the passage 12 respectively, and the other ends of pipes 13, 14, 16, and 17 are connected to a liquid He supply device 15 through the wall of the vessel 1. In this case, the diameter of the passage 12 in the substrate 10 may be sufficiently small, and it is unnecessary to increase the thickness of the substrate 10 because of existence of the passage 12. No hindrance is placed even if intervals of substrates 10 are narrowed to such degree that chips P are not brought into contact with one another.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a high-speed computer system, and more particularly to a sieving speed computer system in which the main elements of the computer main body are composed of a combination of Josephson junction elements.

[Background technology of the invention and its problems]

In the field of science and technology, it is often necessary to perform a huge amount of calculations in a short period of time (P).To perform such calculations, high-speed computers are required, but current high-speed computers, In other words, computers that use transistor elements as logic elements or memory elements have a limited processing speed, making it difficult to obtain satisfactory results.

Therefore, in order to solve the above-mentioned problems, recently,
A high-speed meter J that uses Josephson junction elements as logic elements and memory elements, which operate several tens of times faster than transistor elements and consume less than 1/1000th the power.
M, machine research is being actively conducted, and has already reached the stage where it can be put into practical use, albeit only locally.

By the way, a Josephson junction element is a switching element that uses two physical phenomena: superconductivity and tunnel effect. Therefore, in order to operate this element, it is necessary to cool it to below the transition temperature of the metal constituting the element, specifically to a temperature of several degrees. For these reasons, in high-speed computer systems in which the main elements of the computer body are composed of a combination of Josephson elements, each of the above elements is generally housed in a cryogenic container, that is, a container containing liquid helium. A method was adopted in which each element was housed in an insulated container immersed in liquid helium, and only the power lead wires to the computer body and the signal wires used for communication with the outside were guided outside the cryogenic container. .

However, with this configuration, the following problems are expected to occur. That is, the main elements of the computer body are generally composed of a combination of integrated circuit chips incorporating Josephson junction elements. Then, the chip is fixed to the substrate. Therefore, in the case of a structure in which a chip-mounted substrate is immersed in liquid helium,
There are eight proposals for increasing the distance between the substrates in order to quickly float helium gas bubbles generated during operation. For this reason, the packaging density cannot be increased, and there is a risk that the main body of the computer including the cryogenic container will become larger.

[Purpose of the invention]

The present invention has been made in view of the above circumstances, and its purpose is to provide a high-speed computer system that can reduce the packaging density of the computer main body, thereby reducing the size of the entire system. It's about doing.

[Summary of the invention]

The present invention provides a high-speed computer system in which the main elements of the computer main body are composed of a combination of integrated circuit chips incorporating Josephson junction elements, in which the chips are thermally connected and fixed. The present invention is characterized in that it is provided with a substrate made of aluminum, a cooling fluid passage formed in the substrate, and means for passing a cryogenic fluid through the cooling fluid passage.

〔Effect of the invention〕

As is well known, cryogenic fluids, such as liquid helium,
Good flow through even extremely small diameter channels. Therefore, if a cooling fluid passage is provided in the substrate as described above and a cryogenic fluid is forced to flow through this passage, it is possible to widen the gap between the substrates without significantly increasing the thickness of the substrate. The chip can be cooled well through the substrate without any need for cooling.

Therefore, compared to the so-called immersion method, the mounting density of the computer main body portion can be increased, and the overall system size can be reduced accordingly.

[Embodiments of the invention]

Embodiments of the present invention will be described below with reference to the drawings.

Note that the figure shows an example in which the present invention is applied to a high-speed computer system for control.

In FIG. 1, 1 is a vacuum container, and this vacuum container 1
The interior is always evacuated to a high vacuum by a vacuum pump 2. A computer main body l is housed within the vacuum container 1.

The main body of the computer has a configuration in which components suitable for control are assembled, for example, as shown in FIG. It consists of an integrated channel 9 and a data node. These elements are then constructed from a combination of integrated circuit chips incorporating Josephson junction elements. The chip is fixed in a thermally connected state to the surface of the substrate IO as indicated by P in FIG. 1, and the substrate 10 is fixed to the board 11.

Both the substrate 10 and the board 11 are made of a material having a good thermal conductivity, such as an aluminum plate, with an oxide film on the surface, and a valley element is formed on the surface of the oxide film by connecting the chips P to each other. Wiring made of superconducting material is formed to connect each element to each other. And each board 1
0 and board If, cooling fluid passages 12 are provided in a meandering manner, for example, as shown by broken lines in FIG. One end of piping 13.14 covered with a heat insulating material is connected to the entrance of the cooling passage system, and the other end of these piping 13.14 penetrates the wall of the vacuum vessel 1 in an airtight manner. One end of piping 16.17 covered with a heat insulating material is connected to the outlet of the cooling passage system, and the other end of these piping 16.17 is connected to the outlet of the liquid helium supply device 15. It airtightly penetrates the wall of the container 1 and is connected to the recovery port of the liquid helium supply device 15. Note that the connection system connecting the computer main body J and external devices is omitted in the figure.

With such a configuration, when liquid helium is flowed through the cooling passage system while the vacuum pump 2 is operated to maintain a high vacuum inside the vacuum container 1 to prevent heat from entering from the outside, each nap P is cooled to a cryogenic temperature through the substrate 10 to a temperature at which the Josephson junction device can operate well.

In this case, liquid helium, unlike common fluids,
Even when the flow cross-sectional area of a cooling passage system is very small, the flow can flow without any problem.

Therefore, the cooling fluid passage 12 provided in the substrate 10
may have a sufficiently small diameter, and the presence of this cooling fluid passage 12 does not significantly increase the thickness of the substrate IO. Further, unlike the immersion method, there is no problem even if the distance between the substrates 10 is narrowed to the extent that the mounted chips P do not touch each other. Therefore, compared to the immersion method, the computer body 3
The packaging density of the part can be increased (and the above-mentioned effect can be obtained after all).

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram of the main parts of a computer system according to an embodiment of the present invention, and FIG. 2 is a block diagram of the computer main body in the same system: l'F! The construction diagram and the origin diagram are side views of the board incorporated into the system. DESCRIPTION OF SYMBOLS 1... Vacuum container, 2... Vacuum pump, 3... Computer main body, 10... Substrate, 15... Liquid helium supply device. Applicant's agent Patent attorney Takehiko Suzue 4 Figure 2 Figure 3 Showa Year/Month Japan Patent Office Commissioner Kazuo Wakasugi 1. Indication of case Patent application No. 1988-90305 2. Name of invention High-speed computer system 3 , Who is making the amendment? What is the relationship between the case and the applicant? Patent applicant (307) Tokyo Shibaura Electric, Macedonian Company 4, Agent's complaint statement in full 7, Contents of amendment # TI engraving (no change in content)

Claims (1)

[Claims] In a high-speed computer system in which the main elements of the computer body are a combination of integrated circuit chips incorporating Josephson junction elements, the chips are thermally connected and fixed to a substrate made of a good heat conductive material; A high-speed computer system comprising: a cooling fluid passage formed in the substrate; and means for causing a cryogenic temperature body to flow through the cooling fluid passage.