JPS59201736A - Base plate fixing device - Google Patents

Abstract

PURPOSE:To prevent unstableness owing to dislocation of a base plate or warp or contraction of the same, by furnishing a basis, on which the base plate is placed, with a suction hole to attract the base plate by vacuum and a mechanically retaining member for fixing the base plate, and thereby increasing the strength of plate fixation greatly. CONSTITUTION:A basis to place a base plate 6 thereupon is furnished with a suction hole 4 for attracting the plate by vacuum, and a fastening member 3 is mounted by a screw 7 at one of the edges of the oversurface of said basis 1 in order to fix the plate 6 mechanically. At the other edge, a movable member 2 is mounted through a spring 5, wherein the strength of mechanical fixation of base plate 6 can be changed by changing the strength of said spring 5. A tapered part 3a is formed at the side face of fastening member 3, which faces the central part of the basis 1, while another tapered part 2a is formed at the side face of movable member 2, which faces the fastening member 3, in order to pinch the base plate 6 firmly.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a substrate fixing device used in an assembly device such as a hybrid IC (hereinafter abbreviated as HIC) bonding device or chip mount device.

[Technical Background of the Invention] As substrate fixing devices used in conventional bonding devices and chip mounting devices, there are two types of substrate fixing devices: one is a fixing device that uses a vacuum device to suction the substrate onto the base on which the substrate is placed, and the other is a mechanical fixing device. A fixation device was used to fix it in place.

[Problems in the Background Art] However, in assembly equipment such as 1" IC bonding equipment and chip mounting equipment, the conventional board fixing equipment moves at high speed on the XY table. Fixing methods using fixing devices can cause the board to shift on the base, and cannot absorb warping and shrinkage of the board, which can cause backlash in the board when bonding or mounting chip carriers, etc. This has disadvantages such as Vt stiffness, which lowers the yield and causes honding and misalignment of the mount.

[Object of the invention] The present invention has been made in response to such conventional circumstances.
To provide a substrate fixing device with high production yield, which securely fixes a substrate on a base part and prevents the substrate from shifting or wobbling on the base part.

``Summary of the Invention'' That is, the present invention provides a suction port for vacuum suctioning the substrate onto the base, approximately at the center of the base on which the substrate on which a semiconductor component such as a chip carrier is mounted is placed. The closing plate fixing device is characterized in that the opening is opened and a holding member for mechanically fixing the substrate is installed on the upper surface of the base portion.

1. EMBODIMENT OF THE INVENTION The details of the present invention will be described below with reference to an embodiment shown in the drawings.

FIGS. 1 and 2 are explanatory diagrams showing one embodiment of the present invention, FIG. 1 is a top view thereof, and FIG. 2 is an II--FIG.
FIG. 2 is a longitudinal cross-sectional view taken along line II. In the figure, a suction port 4 for vacuum suctioning the substrate 6 onto the base 1 is provided approximately at the center of the base 1 on which the substrate 6 is placed. A fixing member 3 for mechanically fixing the board 6 is fixed to one side end of the upper surface of the base 1 with screws 7, and the side end of the base 1 opposite to the fixed side end of the fixing member 3 is fixed to one end of the upper surface of the base 1. A movable member 2 is fixed on the side end via a spring 5. A tapered portion 3a is formed on the side surface of the fixed member 3 facing the center of the base portion 1, and a tapered portion 3a is formed on the end surface of the movable member 2 facing the fixed member 3 on the opposite side end portion of the base portion 1. A tapered portion 2a is formed.

The base portion 1 has a uniform upper surface so as to prevent air from leaking and to strengthen the suction force to the substrate 6 when vacuum suctioning the substrate 6.

The movable member 2 fixed to one end of the base 1 serves to change the strength of the spring 5 that fixes the movable member 2 onto the base 1; Fixation strength can be varied.

In order to fix the board 6 on the board fixing device of this embodiment, first, one end of the board 6 is fixed to the tapered part 3a of the fixing member 3 fixed on one side end of the base part 1, and the other end Pull up the movable member 2 and release the spring 5 of this movable member 2.
The movable member 2 is held by the tapered portion 2a of the movable member 2 by the downward tension and is mechanically fixed onto the base portion 1. The lower end 4a of the suction port 4 is vacuum-suctioned by a vacuum pump (not shown), so that the substrate 6 is vacuum-adsorbed onto the base portion 1.

In addition, since this embodiment is configured to be symmetrical with respect to the I[-H line of the first gate, it is possible to attach the substrate fixing device to the bonding device or chimp mount 1 by inverting it by 180 degrees. The handleability can be improved for both right-handed and left-handed workers.

The holding member of this embodiment has a fixed member 3 and a movable part Δ2.
Since it consists of two parts, it is easy to remove the board 6, and the positioning of the board 6 is also extremely easy, making the work more efficient.

1. Effect of Light] In the substrate fixing device of the present invention, a suction port for vacuum suctioning the substrate and a holding member for mechanically fixing the substrate are provided on the base portion on which the substrate is placed. The fixing strength of the board is significantly increased compared to conventional board fixing devices, and it is possible to prevent the board from shifting or wobbling due to warping and shrinking.
Bonding positional deviations and machint positional deviations during HIC manufacturing can be minimized, and production yields can be improved by more than 20% compared to conventional equipment.

[Brief explanation of drawings]

FIG. 1 is a top view of an embodiment of the substrate fixing device according to the present invention, and FIG. 2 is a sectional view taken along line -C in FIG. 1...Base part 2...Movable member 3...Fixed member 4...・・・・・・Suction port 5・・・・・・・・・Spring 6・・・・・・
・・・・・・Patent attorney representing the board Satoshi Suyama −

Claims (1)

[Claims] (1) A suction port for vacuum suctioning the substrate onto the base is opened approximately in the center of the base on which a board on which a semiconductor component such as a chip carrier is mounted is placed; A substrate fixing device characterized in that a holding member for mechanically fixing the substrate is provided on the upper surface. 2> The holding member consists of a fixed member fixed on one side end of the base part, and a movable member fixed via a spring on the side end opposite to the fixed side end of the fixed member. A substrate fixing device according to claim 1.