JPS59201087A - Surface illuminator using led lamp - Google Patents

Surface illuminator using led lamp

Info

Publication number
JPS59201087A
JPS59201087A JP58076788A JP7678883A JPS59201087A JP S59201087 A JPS59201087 A JP S59201087A JP 58076788 A JP58076788 A JP 58076788A JP 7678883 A JP7678883 A JP 7678883A JP S59201087 A JPS59201087 A JP S59201087A
Authority
JP
Japan
Prior art keywords
led lamp
recess
substrate
head
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58076788A
Other languages
Japanese (ja)
Inventor
宗造 阿部
鈴木 広宣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP58076788A priority Critical patent/JPS59201087A/en
Publication of JPS59201087A publication Critical patent/JPS59201087A/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 く技術分野〉 本発明はLBDランプを用いた面照明装置に関する。[Detailed description of the invention] Technical fields> The present invention relates to a surface illumination device using an LBD lamp.

〈従来技術〉 LEDランプはその特性から従来より主として点光源と
して利用されていたが、最近になって面光源としても利
用されるようになってきた。LEDランプを面光源とし
ても利用されるようになってきた。LEDランプを面光
源とした装置として従来第1図(al、 (b)に示す
ものが提供されている。
<Prior Art> Due to its characteristics, LED lamps have traditionally been used primarily as point light sources, but recently they have also come to be used as surface light sources. LED lamps have also come to be used as surface light sources. As a device using an LED lamp as a surface light source, the device shown in FIGS.

すなわち、この装置は照明を行うP矢符方向と同方向に
LEDチップ1及びリードフレーム2を装着し、反射面
3をチップ1の前方を取巻く様に設けてたものである。
That is, in this device, an LED chip 1 and a lead frame 2 are mounted in the same direction as the P arrow direction in which illumination is performed, and a reflective surface 3 is provided so as to surround the front of the chip 1.

従って反射板4に高さが必要となり、全体として崇高と
なるため利用分野が制限されていた。
Therefore, the reflection plate 4 requires a height, and the overall height is high, which limits the field of use.

〈発明の目的〉 本発明は上記従来の欠点を解消し、薄型の各種装置にも
利用できる薄型の面照明装置の提供を目的とする。
<Objective of the Invention> An object of the present invention is to eliminate the above-mentioned conventional drawbacks and to provide a thin surface illumination device that can be used in various thin devices.

〈発明の構成〉 本発明は平板状の基板の上面に広範囲に亘る浅い凹所を
形成して反射面とすると共に、偏平に形成したLEDラ
ンプの頭部を前記基板の側壁部から嵌込んで前記凹所へ
臨ませた構成としている。
<Structure of the Invention> The present invention includes forming a wide range of shallow recesses on the upper surface of a flat substrate to serve as a reflective surface, and fitting the flat head of an LED lamp into the side wall of the substrate. The structure is such that it faces the recess.

〈実施例〉 第2図(a)、 (blは本発明の実施例を示す斜視図
、第3図はLEDランプの斜視図、第4図は基板のLE
Dランプ挿入部付近を示す斜視図、第5図は第2図(a
lのX−X断面図、第6図は第2図(alのY−Y断面
図である。
<Example> Figures 2(a) and (bl are perspective views showing examples of the present invention, Figure 3 is a perspective view of an LED lamp, and Figure 4 is a perspective view of an LED lamp on a board.
A perspective view showing the vicinity of the D-lamp insertion part, Figure 5 is similar to Figure 2 (a
FIG. 6 is a Y-Y cross-sectional view of FIG. 2 (al).

厚みを薄くして平板状にした基板11を用い、この上面
11aに凹所12を形成し、その凹所12の表面を反射
面13とする。基板41の平面形状は正方形、長方形、
その他の形状とすることができる。凹所12は浅く広範
囲に亘って形成する。
A substrate 11 made into a flat plate with a reduced thickness is used, a recess 12 is formed in the upper surface 11a, and the surface of the recess 12 is used as a reflective surface 13. The planar shape of the substrate 41 is square, rectangular,
Other shapes are possible. The recess 12 is formed shallowly and over a wide range.

この凹所12に対してLEDランプ14を基板11の側
壁部11bから嵌込んで凹所12内へ臨ませている。L
EDランプ14はその頭部14Aを透明の合成樹脂で偏
平に形成すると共に発光部が凹所12内へ多少突出する
よう先端部分14b番突出形成している。段部14cは
頭部14を嵌込む際の位置決めをなす。14dはリード
線である。
An LED lamp 14 is fitted into the recess 12 from the side wall 11b of the substrate 11 so as to face into the recess 12. L
The head 14A of the ED lamp 14 is formed flat from a transparent synthetic resin, and a tip portion 14b is formed to protrude so that the light emitting portion protrudes somewhat into the recess 12. The stepped portion 14c serves for positioning when the head 14 is fitted. 14d is a lead wire.

偏平にした頭部14aの厚みtlはLED構成に必要な
厚み及びリード線の厚みを限度として非常に薄くするこ
とができるが、強度や取扱いの点等から基板11のあつ
みt2より小さい範囲で適当な寸法とする。このことは
基板11の方がらみればその厚みt2を非常に薄くする
ことも可能ということである。
The thickness tl of the flattened head 14a can be made very thin within the limits of the thickness required for the LED configuration and the thickness of the lead wire, but from the viewpoint of strength and handling, it is suitable within a range smaller than the thickness t2 of the board 11. The dimensions shall be as follows. This means that the thickness t2 of the substrate 11 can be made very thin.

LEDランプ14の嵌込みは基板11の側壁部11bに
前記凹所12に連通する嵌合穴15を設けることにより
行う。嵌合穴15は前記LEDランプ14の頭部14 
aと相似形とし、頭部14aを嵌込んだ時にその先端部
14bが多少凹所12内へ突出した位置で位置決めさせ
れるようにしている。LEDランプ14は基板11に対
して平行に嵌込まれ、接着材で固定される。すまわちL
EDランプ14の挿入方法は照明面である基板上面11
aと平行である。
The LED lamp 14 is fitted in by providing a fitting hole 15 in the side wall portion 11b of the substrate 11 that communicates with the recess 12. The fitting hole 15 is connected to the head 14 of the LED lamp 14.
The shape is similar to that of the head 14a, so that when the head 14a is fitted, the tip 14b of the head 14a is positioned at a position where it slightly protrudes into the recess 12. The LED lamp 14 is fitted in parallel to the substrate 11 and fixed with an adhesive. Sumachi L
The method of inserting the ED lamp 14 is to
It is parallel to a.

前記基板11に形成した凹所12はその深さを、LED
ランプ14が臨む位置を一番深くし、そこから凹所12
の周縁へゆくにしたがい浅くなるようにしている。これ
は凹所12の底面でもある反射面13を傾斜させること
により、該反射面13での反射光を面照明として有効に
とりだすためである。傾斜の態様は完全な曲面だけで傾
斜を構成してもよいし、傾斜平面の組合せでもよい。
The depth of the recess 12 formed in the substrate 11 is determined by the depth of the recess 12 formed in the substrate 11.
The position where the lamp 14 faces is the deepest, and from there the recess 12
It becomes shallower toward the periphery. This is because by tilting the reflective surface 13, which is also the bottom surface of the recess 12, the reflected light from the reflective surface 13 can be effectively taken out as surface illumination. The inclination may be formed of only a completely curved surface, or may be a combination of inclined planes.

前記凹所にはLEDランプの頭部14aを形成した樹脂
と伯父透明の樹脂16を充填するのが好ましい。これに
よりLEDランプ14と充填用樹脂16との屈折率の差
による反射などが生じないため、LEDランプ14から
の光を効率よく照明光として取出すことができる。
Preferably, the recess is filled with a resin forming the head 14a of the LED lamp and a transparent resin 16. As a result, reflection due to a difference in refractive index between the LED lamp 14 and the filling resin 16 does not occur, so that the light from the LED lamp 14 can be efficiently extracted as illumination light.

LEDランプ14は予め成形しておくが、これについて
はLEDチップを嵌合穴15へ入れた後に凹所に充填用
の合成樹脂16を流込む際に同時に成形することもでき
る。ただし予め成形しておくことによりLEDランプの
成形条件がよくなること、他の用途にも共用できること
、凹所充填用の樹脂16を流し込むときに樹脂16が嵌
合穴15から流出する虞れがないので成形が容易である
等の利点がある。
The LED lamp 14 is molded in advance, but it can also be molded at the same time as filling the synthetic resin 16 into the recess after inserting the LED chip into the fitting hole 15. However, molding the LED lamp in advance improves the molding conditions for the LED lamp, it can also be used for other purposes, and there is no risk of the resin 16 flowing out from the fitting hole 15 when pouring the resin 16 for filling the recess. Therefore, it has advantages such as easy molding.

前記基板11は白色の樹脂で成形することができる。そ
して反射面13はAj2やAg等の反射率の高い金属を
メッキ又は熱着して形成することができる。また基板は
前記白色の樹脂の代わりに反射率の高いAβ、又はAg
メッキした鉄等の金属を反射板の機能をもたせるように
プレス加工したものを用いることができる。
The substrate 11 can be molded from white resin. The reflective surface 13 can be formed by plating or thermally bonding a metal with high reflectivity such as Aj2 or Ag. In addition, the substrate is made of Aβ or Ag, which has a high reflectance, instead of the white resin.
It is possible to use plated metal such as iron that is pressed so as to function as a reflector.

またLEDランプ14を嵌込む嵌合穴15は、凹所12
に樹脂16を充填する際に漏れないようにしておけば上
方に開放した溝状としてもよい。
Further, the fitting hole 15 into which the LED lamp 14 is fitted is formed in the recess 12.
If the resin 16 is filled with the resin 16 to prevent leakage, the groove may be opened upward.

また、反射面13に細まがい凹凸をつけ(梨地仕上げと
いわれるもの)、LEDランプ14の光を乱反射するこ
とにより、又は凹所12に充填する樹脂16に屈折率の
異なる粒子を入れるか、又はその充填する樹脂16の表
面に凹凸をつけることによって凹所12から出る光を散
乱して装飾性を高めることもできる。
Alternatively, the reflective surface 13 may be provided with fine irregularities (referred to as a matte finish) to diffusely reflect the light from the LED lamp 14, or particles with different refractive indexes may be added to the resin 16 filled in the recess 12, or By making the surface of the filled resin 16 uneven, it is possible to scatter the light emitted from the recess 12 and improve the decorativeness.

なお基板11には穴17や切欠き18を設けて、装置に
組込むときの位置決めや、この装置を用いて照明する液
晶やスイッチ等のマークを記入したプレートの位置決め
に使うこともできる。
Note that holes 17 and notches 18 may be provided in the substrate 11 and used for positioning when incorporating into a device, and for positioning a plate on which a mark is written for a liquid crystal, a switch, etc. to be illuminated using this device.

第7図は本発明の他の実施例を示す。FIG. 7 shows another embodiment of the invention.

この例は基板11の1側を形成する側壁部11b。In this example, a side wall portion 11b forming one side of the substrate 11 is shown.

18から複数個のランプ14を凹所12内へ臨ましたも
のである。この様にすることによりLEDランプ14の
配線が容易で大きい面積を照明することが出来る。
A plurality of lamps 14 are viewed from 18 into the recess 12. By doing so, the wiring of the LED lamp 14 is easy and a large area can be illuminated.

第8図はLEDランプ14を細長い基板11の対抗する
短径の側壁部14bに夫々嵌込んだ例を示す。この例で
は、LEDランプ14.14を結ぶ線上が最も深く、そ
の線から直角方向へ離れるにしたがい浅くなるような凹
所12を形成している。細長い面を照明することができ
るので、例えば電卓やデジタル時計の液晶表示装置を照
明(ハックライトとして)するのに用いることができる
FIG. 8 shows an example in which the LED lamps 14 are fitted into opposing short-diameter side wall portions 14b of the elongated substrate 11, respectively. In this example, the recess 12 is formed such that it is deepest on a line connecting the LED lamps 14, 14 and becomes shallower as it moves away from the line in a perpendicular direction. Since it can illuminate a long and narrow surface, it can be used, for example, to illuminate the liquid crystal display of a calculator or digital watch (as a hack light).

なおLEDランプ14は照明したい面積に応して2以上
の適当な数とすることもできる。
Note that the number of LED lamps 14 may be two or more depending on the area to be illuminated.

第9図はさらに他の例を示す。これはLEDランプ14
を取付けるのに該ランプが取付けられる嵌合穴15の部
分だけを基板11からの突出部19として設けたもので
ある。この例によれば基板11の上面11aのほぼ全面
を面光源として利用できる。
FIG. 9 shows yet another example. This is LED lamp 14
Only the fitting hole 15 into which the lamp is attached is provided as a protrusion 19 from the substrate 11. According to this example, almost the entire upper surface 11a of the substrate 11 can be used as a surface light source.

〈発明の効果〉 本発明によれば、平板状の基板の上面に広範囲に亘る浅
い凹所を形成して反射面とすると共に、偏平に形成した
LEDランプの頭部を基板側壁部から凹所内へ臨ませる
ようにしたから、非常に嵩の低い薄型の装置で広範囲の
面照明を行うことができる。したがって電卓やその他、
液晶表示装置などの薄型の装置に組込んでハックライト
照明等として利用する途も可能となる。
<Effects of the Invention> According to the present invention, a wide range of shallow recesses are formed on the upper surface of a flat substrate to serve as a reflective surface, and the head of an LED lamp formed flat is inserted into the recess from the side wall of the substrate. Since it is designed to face the surrounding area, it is possible to illuminate a wide area with a very small and thin device. Therefore, calculators and other
It is also possible to incorporate it into a thin device such as a liquid crystal display device and use it as a hack light.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図(alは従来例を示す断面図、第1図(blはそ
の斜視図、第2図(a)、 (blは夫々本発明の実施
例を異なる方向からみた斜視図、第3図はLEDランプ
の斜視図、第4図は基板のLEDランプ挿入部付近を示
す斜視図、第5図は第2図(a)のX−X断面図、第6
図は第2図(alのY−Y断面図、第7図。 第8図は夫々の実施例を示す斜視図、第9図はさらに他
の実施例を示す平面図である。 11−−−−−−一基板     11 a−浦基板の
上面1 l b−基板の側壁部 1 ’ 2−−−−−
−−凹所13−−−−−・反射面    14・−’−
L E Dランプ14 a −頭部     14b−
先端部15−−−−−−一嵌合穴    16−−−−
−−−充填用樹脂特許出願人   シャープ株式会社 代理人 弁理士西1)新
Figure 1 (al is a sectional view showing the conventional example, Figure 1 (bl is a perspective view thereof, Figure 2 (a), (bl is a perspective view of the embodiment of the present invention viewed from different directions, Figure 3) is a perspective view of the LED lamp, FIG. 4 is a perspective view showing the vicinity of the LED lamp insertion part of the board, FIG. 5 is a sectional view taken along line XX in FIG.
The figures are FIG. 2 (al Y-Y sectional view, FIG. 7). FIG. 8 is a perspective view showing each embodiment, and FIG. 9 is a plan view showing still another embodiment. 11-- ---- One board 11 a- Ura upper surface of the board 1 l b- Side wall part of the board 1 ' 2 ----
---Concavity 13--Reflecting surface 14・-'-
LED lamp 14a - head 14b -
Tip part 15------ One fitting hole 16------
---Filling resin patent applicant Sharp Corporation agent Patent attorney Nishi 1) Arata

Claims (4)

【特許請求の範囲】[Claims] (1)平板状の基板の上面に広範囲に亘る浅い凹所を形
成して反射面とすると共に、偏平に形成したLEDラン
プの頭部を前記基板の側壁部から嵌込んで前記凹所内へ
臨ませていることを特徴とするLEDランプを用いた面
照明装置。
(1) A shallow recess is formed over a wide range on the upper surface of a flat substrate to serve as a reflective surface, and the head of the LED lamp, which is formed flat, is inserted into the side wall of the substrate to face the inside of the recess. A surface illumination device using an LED lamp, characterized in that:
(2)凹所はLEDランプの臨む位置から周縁へ行くに
したがい浅くなるよう形成されている特許請求の範囲第
1項記載のLEDランプを用いた面照明装置
(2) A surface illumination device using an LED lamp according to claim 1, wherein the recess is formed to become shallower as it goes from the position where the LED lamp faces toward the periphery.
(3)複数個のLEDランプを側壁部の複数個所から凹
所内に臨ませている特許請求の範囲第1項又は第2項記
載のLEI)ランプを用いた面照明装置。
(3) A surface illumination device using an LEI) lamp according to claim 1 or 2, wherein a plurality of LED lamps are made to face into the recess from a plurality of locations on the side wall portion.
(4)凹所はLEDランプの頭部を形成する材料と同材
料で充填されている特許請求の範囲第1項から第3項の
いずれかに記載のLEDランプを用いた面照明装置。
(4) A surface lighting device using an LED lamp according to any one of claims 1 to 3, wherein the recess is filled with the same material as the material forming the head of the LED lamp.
JP58076788A 1983-04-30 1983-04-30 Surface illuminator using led lamp Pending JPS59201087A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58076788A JPS59201087A (en) 1983-04-30 1983-04-30 Surface illuminator using led lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58076788A JPS59201087A (en) 1983-04-30 1983-04-30 Surface illuminator using led lamp

Publications (1)

Publication Number Publication Date
JPS59201087A true JPS59201087A (en) 1984-11-14

Family

ID=13615351

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58076788A Pending JPS59201087A (en) 1983-04-30 1983-04-30 Surface illuminator using led lamp

Country Status (1)

Country Link
JP (1) JPS59201087A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60169853U (en) * 1984-04-18 1985-11-11 舶用電球株式会社 Surface light emitter using light emitting diode lamp
JPS63139709U (en) * 1987-03-05 1988-09-14
JP2007329137A (en) * 1995-06-27 2007-12-20 Solid State Opto Ltd Light-emitting panel assembly
JP2016177871A (en) * 2015-03-18 2016-10-06 シロキ工業株式会社 Light decoration tool

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60169853U (en) * 1984-04-18 1985-11-11 舶用電球株式会社 Surface light emitter using light emitting diode lamp
JPS63139709U (en) * 1987-03-05 1988-09-14
JP2007329137A (en) * 1995-06-27 2007-12-20 Solid State Opto Ltd Light-emitting panel assembly
JP2016177871A (en) * 2015-03-18 2016-10-06 シロキ工業株式会社 Light decoration tool

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