JPS59193188U

JPS59193188U - Electronic component packaging structure

Info

Publication number: JPS59193188U
Application number: JP8831883U
Authority: JP
Inventors: 哲男日野
Original assignee: 日本電気ホームエレクトロニクス株式会社
Priority date: 1983-06-08
Filing date: 1983-06-08
Publication date: 1984-12-21
Also published as: JPH0331744Y2

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

第１図及び第２図は電子部品の一例としての水晶振動子
用ヘッダを示す側面図及び平面図、第３図及び第４図は
従来の電子部品包装構体の一例を示す部分省略平面図及
びＡ−Ａ線沿う拡大断面図、第５図は第４図のＢ−Ｂ線
に沿う断面図、第６図、　及び第７図は本考案の一実施
例を示す部分省略平面図及びＣ−Ｃ線に沿う拡大断面図
、第８図は第７図のＤ−Ｄ線に沿う断面図、第９図は第
６図の包装構体の部分拡大分割斜視図、第１０図は本考
案の他の実施例を示す部分断面図である。１・・・電子部品（水晶振動子用ヘッダ）、８・・・第
１ガイド板、８ａ・・・凹部、８ｂ・・・凸部、９，９
′・・・第２ガイド板、９ａ・・・凸部、９ｂ、　　９
ｂ’・・・凹部、１０・・・中間ガイド板、１１・・・
透孔。1 and 2 are a side view and a plan view showing a header for a crystal resonator as an example of an electronic component, and FIGS. 3 and 4 are a partially omitted plan view and a plan view showing an example of a conventional electronic component packaging structure. FIG. 5 is an enlarged sectional view taken along line A-A, FIG. 5 is a sectional view taken along line B-B in FIG. FIG. 8 is an enlarged sectional view taken along line C, FIG. 8 is a sectional view taken along line D-D in FIG. 7, FIG. 9 is a partially enlarged perspective view of the packaging structure shown in FIG. 6, and FIG. It is a partial sectional view showing an example of. DESCRIPTION OF SYMBOLS 1... Electronic component (crystal resonator header), 8... First guide plate, 8a... Concave portion, 8b... Convex portion, 9, 9
'...Second guide plate, 9a...Protrusion, 9b, 9
b'... Recessed portion, 10... Intermediate guide plate, 11...
Through hole.

Claims

[Scope of utility model registration request]

a first guide plate having a plurality of parallel concave portions or convex portions into which the lower portions of the plurality of electronic components are fitted in a line on the upper surface; and a first guide plate having convex portions or concave portions on the lower surface into which the upper portions of the plurality of electronic components are fitted in a line; In a direction perpendicular to the concave portion or convex portion of the first guide plate,
A second guide plate having a plurality of parallel strips, and a plurality of grooves interposed between the first and second guide plates and corresponding to the intersection portions of the concave portions or convex portions of the first guide plate and the convex portions or concave portions of the second guide plate. an intermediate guide plate having through holes through which individual electronic components are inserted, and a plurality of electronic components inserted through the through holes of the intermediate guide plate are held between the first and second guide plates from above and below. An electronic component packaging structure characterized by being packaged in one package.