JPS59189069U - Cooling system - Google Patents
Cooling systemInfo
- Publication number
- JPS59189069U JPS59189069U JP8488183U JP8488183U JPS59189069U JP S59189069 U JPS59189069 U JP S59189069U JP 8488183 U JP8488183 U JP 8488183U JP 8488183 U JP8488183 U JP 8488183U JP S59189069 U JPS59189069 U JP S59189069U
- Authority
- JP
- Japan
- Prior art keywords
- dryer
- circulation circuit
- refrigerant circulation
- main body
- cooling system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Air-Conditioning For Vehicles (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
図面はこの考案の実施例を示し、第１図は冷却装置全体
を示す図、第２図は乾燥器を示す断面図である。
−１・・・・・・蒸発器、２
・・・・・・凝縮器、３・・・・・・圧縮機、４・・・
・・・冷媒循環回路、６・・・・・・乾燥器、８・・・
・・・乾燥器本体、９・・・・・・蓋、１０・・・・・
・乾燥剤、１１・・・・・・異物除去フィルタ。The drawings show an embodiment of this invention; FIG. 1 is a diagram showing the entire cooling device, and FIG. 2 is a sectional view showing the dryer.
-1...Evaporator, 2
...Condenser, 3...Compressor, 4...
...Refrigerant circulation circuit, 6...Dryer, 8...
...Dryer body, 9...Lid, 10...
- Desiccant, 11... Foreign matter removal filter.
Claims (1)
ら冷媒循環回路４で連結された冷却装置において、冷媒
循環回路４の途上に、他の機器とは独立しかつ内部に幹
乾燥剤１０および異物除去フィルタ１１が入れられた乾
燥器６が設けられ、乾燥器６が、乾燥器本体８と、乾燥
器本体８に着脱自在に取付けられた蓋９とよりなる冷却
装置。In the cooling device, which is equipped with an evaporator 1, a condenser 2, and a compressor 3, and which are connected by a refrigerant circulation circuit 4, a main desiccant is installed inside the refrigerant circulation circuit 4 independently of other equipment. 10 and a foreign matter removal filter 11, the dryer 6 comprises a dryer main body 8 and a lid 9 detachably attached to the dryer main body 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8488183U JPS59189069U (en) | 1983-06-02 | 1983-06-02 | Cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8488183U JPS59189069U (en) | 1983-06-02 | 1983-06-02 | Cooling system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59189069U true JPS59189069U (en) | 1984-12-14 |
Family
ID=30214848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8488183U Pending JPS59189069U (en) | 1983-06-02 | 1983-06-02 | Cooling system |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59189069U (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9123664B2 (en) | 2010-07-19 | 2015-09-01 | Tessera, Inc. | Stackable molded microelectronic packages |
| US9153562B2 (en) | 2004-11-03 | 2015-10-06 | Tessera, Inc. | Stacked packaging improvements |
| US9218988B2 (en) | 2005-12-23 | 2015-12-22 | Tessera, Inc. | Microelectronic packages and methods therefor |
| US9224717B2 (en) | 2011-05-03 | 2015-12-29 | Tessera, Inc. | Package-on-package assembly with wire bonds to encapsulation surface |
| US9252122B2 (en) | 2011-10-17 | 2016-02-02 | Invensas Corporation | Package-on-package assembly with wire bond vias |
| US9324681B2 (en) | 2010-12-13 | 2016-04-26 | Tessera, Inc. | Pin attachment |
| US9391008B2 (en) | 2012-07-31 | 2016-07-12 | Invensas Corporation | Reconstituted wafer-level package DRAM |
| US9412714B2 (en) | 2014-05-30 | 2016-08-09 | Invensas Corporation | Wire bond support structure and microelectronic package including wire bonds therefrom |
| US9502390B2 (en) | 2012-08-03 | 2016-11-22 | Invensas Corporation | BVA interposer |
| US9553076B2 (en) | 2010-07-19 | 2017-01-24 | Tessera, Inc. | Stackable molded microelectronic packages with area array unit connectors |
| US9583411B2 (en) | 2014-01-17 | 2017-02-28 | Invensas Corporation | Fine pitch BVA using reconstituted wafer with area array accessible for testing |
| US9601454B2 (en) | 2013-02-01 | 2017-03-21 | Invensas Corporation | Method of forming a component having wire bonds and a stiffening layer |
-
1983
- 1983-06-02 JP JP8488183U patent/JPS59189069U/en active Pending
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9153562B2 (en) | 2004-11-03 | 2015-10-06 | Tessera, Inc. | Stacked packaging improvements |
| US9570416B2 (en) | 2004-11-03 | 2017-02-14 | Tessera, Inc. | Stacked packaging improvements |
| US9218988B2 (en) | 2005-12-23 | 2015-12-22 | Tessera, Inc. | Microelectronic packages and methods therefor |
| US9553076B2 (en) | 2010-07-19 | 2017-01-24 | Tessera, Inc. | Stackable molded microelectronic packages with area array unit connectors |
| US9123664B2 (en) | 2010-07-19 | 2015-09-01 | Tessera, Inc. | Stackable molded microelectronic packages |
| US9570382B2 (en) | 2010-07-19 | 2017-02-14 | Tessera, Inc. | Stackable molded microelectronic packages |
| US9324681B2 (en) | 2010-12-13 | 2016-04-26 | Tessera, Inc. | Pin attachment |
| US9224717B2 (en) | 2011-05-03 | 2015-12-29 | Tessera, Inc. | Package-on-package assembly with wire bonds to encapsulation surface |
| US9252122B2 (en) | 2011-10-17 | 2016-02-02 | Invensas Corporation | Package-on-package assembly with wire bond vias |
| US9391008B2 (en) | 2012-07-31 | 2016-07-12 | Invensas Corporation | Reconstituted wafer-level package DRAM |
| US9502390B2 (en) | 2012-08-03 | 2016-11-22 | Invensas Corporation | BVA interposer |
| US9601454B2 (en) | 2013-02-01 | 2017-03-21 | Invensas Corporation | Method of forming a component having wire bonds and a stiffening layer |
| US9583411B2 (en) | 2014-01-17 | 2017-02-28 | Invensas Corporation | Fine pitch BVA using reconstituted wafer with area array accessible for testing |
| US9412714B2 (en) | 2014-05-30 | 2016-08-09 | Invensas Corporation | Wire bond support structure and microelectronic package including wire bonds therefrom |
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