JPS59189069U - - Google Patents

Info

Publication number
JPS59189069U
JPS59189069U JP8488183U JP8488183U JPS59189069U JP S59189069 U JPS59189069 U JP S59189069U JP 8488183 U JP8488183 U JP 8488183U JP 8488183 U JP8488183 U JP 8488183U JP S59189069 U JPS59189069 U JP S59189069U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8488183U
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8488183U priority Critical patent/JPS59189069U/ja
Publication of JPS59189069U publication Critical patent/JPS59189069U/ja
Application status is Pending legal-status Critical

Links

JP8488183U 1983-06-02 1983-06-02 Pending JPS59189069U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8488183U JPS59189069U (en) 1983-06-02 1983-06-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8488183U JPS59189069U (en) 1983-06-02 1983-06-02

Publications (1)

Publication Number Publication Date
JPS59189069U true JPS59189069U (en) 1984-12-14

Family

ID=30214848

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8488183U Pending JPS59189069U (en) 1983-06-02 1983-06-02

Country Status (1)

Country Link
JP (1) JPS59189069U (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9123664B2 (en) 2010-07-19 2015-09-01 Tessera, Inc. Stackable molded microelectronic packages
US9153562B2 (en) 2004-11-03 2015-10-06 Tessera, Inc. Stacked packaging improvements
US9218988B2 (en) 2005-12-23 2015-12-22 Tessera, Inc. Microelectronic packages and methods therefor
US9224717B2 (en) 2011-05-03 2015-12-29 Tessera, Inc. Package-on-package assembly with wire bonds to encapsulation surface
US9252122B2 (en) 2011-10-17 2016-02-02 Invensas Corporation Package-on-package assembly with wire bond vias
US9324681B2 (en) 2010-12-13 2016-04-26 Tessera, Inc. Pin attachment
US9391008B2 (en) 2012-07-31 2016-07-12 Invensas Corporation Reconstituted wafer-level package DRAM
US9412714B2 (en) 2014-05-30 2016-08-09 Invensas Corporation Wire bond support structure and microelectronic package including wire bonds therefrom
US9502390B2 (en) 2012-08-03 2016-11-22 Invensas Corporation BVA interposer
US9553076B2 (en) 2010-07-19 2017-01-24 Tessera, Inc. Stackable molded microelectronic packages with area array unit connectors
US9583411B2 (en) 2014-01-17 2017-02-28 Invensas Corporation Fine pitch BVA using reconstituted wafer with area array accessible for testing
US9601454B2 (en) 2013-02-01 2017-03-21 Invensas Corporation Method of forming a component having wire bonds and a stiffening layer

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9570416B2 (en) 2004-11-03 2017-02-14 Tessera, Inc. Stacked packaging improvements
US9153562B2 (en) 2004-11-03 2015-10-06 Tessera, Inc. Stacked packaging improvements
US9218988B2 (en) 2005-12-23 2015-12-22 Tessera, Inc. Microelectronic packages and methods therefor
US9553076B2 (en) 2010-07-19 2017-01-24 Tessera, Inc. Stackable molded microelectronic packages with area array unit connectors
US9570382B2 (en) 2010-07-19 2017-02-14 Tessera, Inc. Stackable molded microelectronic packages
US9123664B2 (en) 2010-07-19 2015-09-01 Tessera, Inc. Stackable molded microelectronic packages
US9324681B2 (en) 2010-12-13 2016-04-26 Tessera, Inc. Pin attachment
US9224717B2 (en) 2011-05-03 2015-12-29 Tessera, Inc. Package-on-package assembly with wire bonds to encapsulation surface
US9252122B2 (en) 2011-10-17 2016-02-02 Invensas Corporation Package-on-package assembly with wire bond vias
US9391008B2 (en) 2012-07-31 2016-07-12 Invensas Corporation Reconstituted wafer-level package DRAM
US9502390B2 (en) 2012-08-03 2016-11-22 Invensas Corporation BVA interposer
US9601454B2 (en) 2013-02-01 2017-03-21 Invensas Corporation Method of forming a component having wire bonds and a stiffening layer
US9583411B2 (en) 2014-01-17 2017-02-28 Invensas Corporation Fine pitch BVA using reconstituted wafer with area array accessible for testing
US9412714B2 (en) 2014-05-30 2016-08-09 Invensas Corporation Wire bond support structure and microelectronic package including wire bonds therefrom

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