JPS59186388U - ドア用基枠 - Google Patents
ドア用基枠Info
- Publication number
- JPS59186388U JPS59186388U JP8147683U JP8147683U JPS59186388U JP S59186388 U JPS59186388 U JP S59186388U JP 8147683 U JP8147683 U JP 8147683U JP 8147683 U JP8147683 U JP 8147683U JP S59186388 U JPS59186388 U JP S59186388U
- Authority
- JP
- Japan
- Prior art keywords
- screw
- receiving groove
- base frame
- screw receiving
- door
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 3
- 229910052782 aluminium Inorganic materials 0.000 claims 3
- 238000001125 extrusion Methods 0.000 claims 1
Landscapes
- Joining Of Corner Units Of Frames Or Wings (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8147683U JPS59186388U (ja) | 1983-05-30 | 1983-05-30 | ドア用基枠 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8147683U JPS59186388U (ja) | 1983-05-30 | 1983-05-30 | ドア用基枠 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59186388U true JPS59186388U (ja) | 1984-12-11 |
JPH0115832Y2 JPH0115832Y2 (enrdf_load_stackoverflow) | 1989-05-11 |
Family
ID=30211442
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8147683U Granted JPS59186388U (ja) | 1983-05-30 | 1983-05-30 | ドア用基枠 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59186388U (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8968006B1 (en) | 2008-03-18 | 2015-03-03 | Metrospec Technology, Llc | Circuit board having a plated through hole passing through conductive pads on top and bottom sides of the board and the board |
US9341355B2 (en) | 2008-03-06 | 2016-05-17 | Metrospec Technology, L.L.C. | Layered structure for use with high power light emitting diode systems |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS571284U (enrdf_load_stackoverflow) * | 1980-06-03 | 1982-01-06 |
-
1983
- 1983-05-30 JP JP8147683U patent/JPS59186388U/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS571284U (enrdf_load_stackoverflow) * | 1980-06-03 | 1982-01-06 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9341355B2 (en) | 2008-03-06 | 2016-05-17 | Metrospec Technology, L.L.C. | Layered structure for use with high power light emitting diode systems |
US8968006B1 (en) | 2008-03-18 | 2015-03-03 | Metrospec Technology, Llc | Circuit board having a plated through hole passing through conductive pads on top and bottom sides of the board and the board |
US9357639B2 (en) | 2008-03-18 | 2016-05-31 | Metrospec Technology, L.L.C. | Circuit board having a plated through hole through a conductive pad |
Also Published As
Publication number | Publication date |
---|---|
JPH0115832Y2 (enrdf_load_stackoverflow) | 1989-05-11 |
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