JPS59186286A - Electronic part socket - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] (a) Technical field of invention The present invention relates to an electronic component socket, and more particularly, to an electronic component socket.

The present invention relates to an electronic component socket in which an electronic component buff cage can be inserted and removed without insertion/extraction force by cooling an expandable plate made of a shape memory alloy.

(b) Background of the Technology In response to urgent demands for higher speed and smaller size of electronic devices, especially information processing electronic devices, high-density packaging of electronic components such as semiconductor integrated circuit devices is rapidly progressing.

(C1 Conventional technology and problems
) is often used, but as shown in the perspective view of Fig. 1, a mounting method using a multi-package 3 in which several LSI elements 1 are collectively arranged on a motherboard 2 made of a multilayer ceramic board, etc., is also widely adopted. It's starting to look like this.

The multi-package 3 described above has a large number of connection terminals 4 and is connected to an external circuit, but in some cases, it may be detachably connected to a printed circuit board via a socket. On this occasion.

The insertion/extraction force per l#4 connector is close to 100gr, so for example 1
The insertion/extraction force of multi-package 3 with 000 terminals is 10
0 Kg, posing major operational problems. In such cases, a connection without insertion/extraction force is necessary.

Naturally, the connection terminal structure of the multi-package 3 is numerous and delicate, so it cannot be handled by a normal mechanical mechanism. The appearance of a socket with a different idea has been long awaited.

(dl Purpose of the Invention The present invention has been made in view of the above-mentioned points, and it is an object of the present invention to provide an LSI socket that can mount a multi-package of semiconductor integrated circuits having a large number of delicate connection terminals as described above without any insertion/extraction force. That is.

(Structure of the 81 Invention The object of the above invention is to provide a socket having a socket base in which contacts are implanted in a predetermined arrangement, and terminal insertion openings arranged in one-to-one correspondence with the contacts. a movable socket plate that can slide on a base; an extensible plate made of a shape memory alloy that connects the socket base and the movable socket plate while maintaining a predetermined relative position; and the socket base and the movable socket. 1. By cooling the extensible plate, a puff cage of a semiconductor integrated circuit having multi-element pins can be inserted and removed without any force by cooling the extensible plate. This can be easily achieved using an LSI socket that is characterized by being able to be inserted and removed.

(fl Embodiments of the Invention Examples of the present invention will be described below with reference to the drawings.9 Before the explanation, let us describe the shape memory metal material used in the present invention.

Shape memory metal materials include nickel (Ni) and titanium (T).
It is an alloy with i). Although it depends on the component ratio of both metals, -
There is a transformation point corresponding to each temperature in the range from 50°C to room temperature, and at temperatures above the transformation point, the shape memory metal material has an austenitic structure and is hard, and at temperatures below the transformation point, it has a martensitic structure and is soft. be.

Figure 1 is a strain-8 stress curve of a shape memory metal material containing Ni-Ti, and curve A is above the transformation point (room temperature) 1
Curve B shows the characteristics below the transformation point temperature.

Now, when a stress of σ is applied to a shape memory metal material, there is only a strain of ε0 at room temperature, but when cooled with a refrigerant below the transformation point, the structure of the shape memory metal material undergoes a transformation,
The strain increases to ε1 (10%). The aim is to utilize this characteristic to form a socket that requires no insertion/extraction force.

FIG. 3 is a plan view and a sectional view showing the structure of an LSI socket based on the present invention, and FIG. 4 is a plan view showing an extensible plate for the LSI socket shown in FIG.

The socket base 5 is a component made of ceramic (or synthetic resin) in which contacts 6 are implanted in correspondence with the connection terminals 4 of the multi-package 3, and the socket movable plate 7 is made in correspondence with the contacts 6. This terminal has a terminal insertion opening 8 formed by the terminal insertion hole 8. The extensible plate 9 is a plate made of the shape-memory metal material described above, and has elongated holes 9a formed for each row of terminals so as not to contact the contacts 6 implanted in the socket base 5. I'm here.

Both ends thereof are fixed to the socket base 5 and the socket movable plate 7 by screws 10, respectively. In order to allow the 8-socket base 5 and the socket movable plate 7 to slide without separating from each other, the presser plate 11 is fixed to the surface of the convex portion 5a of the socket base 5 with screws 10, and the socket movable plate 7 is Press the surface 7b.

The elastic plate 12 has a leaf spring shape, and the convex portion 5 of the socket base 5
a and the end face 7a of the socket movable plate 7.

The socket movable plate 7 is biased to be pushed in the sliding direction.

Next, the operating mechanism of this LSI socket will be explained.

When an LSI socket at room temperature is cooled with a refrigerant such as liquid carbon dioxide gas (dry ice), the shape-memory metal material of the expandable plate 9 undergoes transformation and its properties change from hard to soft. The extensible plate 9, which is constantly being pulled through the socket movable plate 7 which is being pushed, suddenly becomes strained and stretches.

As is clear from FIG. 3, the socket movable plate 7 is a telescopic plate 9.
As a result, the gap between the inner wall surface of the terminal insertion hole 8 and the contact surface of the contactor 6 widens, as shown in the enlarged sectional view of FIG. The connection terminal 4 of the package 3 can be inserted into the LSI socket without any insertion force.

When the whole body returns to room temperature except for the refrigerant, the shape memory metal material becomes hard again as shown in Fig. 5 fb), so the contact 6
The contact surface of the multi-package 3 and the wall surface of the terminal insertion opening 8 come close to each other and press the connection terminals 4 of the already inserted multi-package 3 with considerable contact pressure to complete a good electrical connection.

To remove the multi-package 3 that has been inserted once from the LSI socket, use the refrigerant again to remove the expandable plate 9 of the LSI socket.
It is obvious that it is sufficient to cool the

The temperature at which the refrigerant is used for cooling depends on the constituent components of the shape memory metal material that is the material of the expandable plate 9. Practical convenience can be obtained by selecting a component of the shape memory metal material that is lower than the current room temperature, provides sufficient contact pressure with the connection terminal, and has a cooling temperature that is preferably not low.

+g) Effects of the invention As is clear from the above explanation, an LSI based on the present invention
By using a socket, a multi-package containing multiple LSI elements and a large number of delicate connection terminals can be mounted on the socket without any insertion force, which eliminates the conventional problem of the force required to insert and remove multi-packages into sockets. This has the effect of being able to solve the problem.

[Brief explanation of the drawing]

Fig. 1 is a perspective view showing the structure of a multi-package equipped with a plurality of LSI elements, Fig. 2 is a mechanical characteristic diagram of a shape memory metal material, and Fig. 3 is a diagram of the structure of an LSI socket based on the present invention. A plan view and a sectional view showing one embodiment, FIG. 4 is the same <Extensible plate used for LSI socket, FIG. 5 is the same <
FIG. 3 is an enlarged cross-sectional view of a contact portion for explaining the operation of the LSI socket. In the figure, 1 is an LSI element and 2 is a motherboard. 3 is a multi-package, 4 is a connection terminal, 5 is a socket base, 6 is a contact, 7 is a socket movable plate, 8 is a terminal insertion slot, 9 is an extensible plate, 10 is a kneader, 11 is a holding plate, 12 indicate elastic plates, respectively.

Claims (1)

[Claims] A socket base in which contacts are implanted in a predetermined arrangement. a socket movable plate having terminal insertion holes disposed in one-to-one correspondence with the contacts and capable of sliding on the socket base; It is composed of an extensible plate made of a shape memory alloy that maintains and connects the socket base and the socket movable plate, and an elastic plate that biases the socket movable plate in the sliding direction so as to separate the socket base and the socket movable plate from each other. 7. An electronic component inserter, characterized in that, by cooling the expandable plate, a semiconductor integrated circuit package having a multi-element bottle can be inserted and removed without any insertion/extraction force.