JPS59182841A - Polyester composition - Google Patents

Abstract

PURPOSE:The titled composition having improved soldering resistance, kneading properties, and moldability, obtained by blending a polyester consisting essentially of a repeating unit of ethylene terephthalate with specific amounts of polyphenylene sulfide and a specific polyoxyalkylene compound. CONSTITUTION:(A) A polyester containing preferably >=80mol% repeating unit of ethylene terephthalate is blended with (B) 5-100wt% polyphenylene sulfide [preferably having >=90mol% repeating unit shown by the formula I (m is 1-4)], and (C) 0.1-10wt% polyoxyalkylene compound [preferably a compound having one or more groups reactive with polyester, containing polyoxyalkylene chain and epoxy group, for example, a polyalkylene glycol glycidyl ether shown by the formula II (A is 1-5C aliphatic hydrocarbon, H, or glycidyl; R is 2-5C aliphatic hydrocarbon; n is >=2)] having compatibility with the polyester, to give the desired composition.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a polyester composition having excellent heat resistance, particularly solder resistance, mechanical properties, and crosstalk and moldability.

Polyethylene terephthalate) fl has excellent heat resistance, chemical resistance, mechanical properties, electrical properties, etc., and is used in many applications as fibers and films. In recent years, it has attracted attention as an engineering plastic due to its excellent properties, and its usage is increasing. Polyethylene terephthalate has a higher melting point and better heat resistance than polypterene terephthalate, so attempts have been made to apply it to electrical and electronic parts, but its solder resistance is still insufficient.
Application to this field is also greatly limited, and improvement in solder resistance is strongly desired. As a result of intensive research aimed at developing a polyester composition with excellent mechanical properties, we finally arrived at the composition of the present invention. That is, the present invention combines polyester mainly containing ethylene terephthalate repeating units (7, polyphenylene sulfide 5 to 100
Weight = % 0.1 to 10% by weight of a polyoxyalkylene compound compatible with polyester. Features.

Polyphenylene sulfide is known as a resin with excellent heat resistance, flame retardancy, and mulberry resistance.In order to improve the processability of the resin, polyester is added in a small proportion (7
A composition has also been disclosed in JP-A-55-135160@. -1.

A composition in which polyphenylene sulfide is blended with an all-aromatic polyester (7) is also disclosed in JP-A-53-57255. However, the present inventors have found that simply blending polyphenylene sulfide with polyester results in poor kneading properties and poor extrusion properties. (7) In addition to the fact that strand breakage occurs during pellet production and the operability is extremely poor, the composition of the present invention has problems with the obtained molded product. This improves kneading properties, solves problems such as strand breakage, significantly improves operability, and improves moldability and uniformity of mechanical and thermal properties of molded products.

It is particularly useful as a molding material for electrical or electronic parts that requires further improved heat resistance and solder resistance.

It also has excellent surface properties even when molded at low temperatures, heat resistance, especially solder resistance, morphological stability at high temperatures, and mechanical properties.

The polyester used in the present invention is a polyester mainly composed of ethylene terephthalate repeating units, and preferably has 5 repeating units. The resulting copolymerization components (7) may include acid components such as inphthalic acid, naphthalene dicarboxylic acid, adipine, sebacic acid, dienyl ether 4,4'-dicarboxylic acid, cyclohexane dicarboxylic acid, propylene glycol, Butylene glycol, diethylene glycol, neopentyl glycol, cyclohexane dimetatool, 2
．． Examples include glycol components such as 2-his(4-hydroxyphenyl)furopane, oxyacids such as P-oxybenzoic acid, P-hydroxyethoxybenzoic acid, and @franic acid. In addition, the polyester has a phenol/tetrachloroethane mixed solvent (volume ratio of 6/4) as a side liquid.
! , L <σ0.5 or less. Further, the polyester may be partially branched within a range that does not impair moldability, or may be a mixed polyester that becomes an ethylene terephthalate repeating material by blending a plurality of polyesters.

The polyphenylene sulfide used in the present invention has repeating (7 units + Ph-8)'> W resin as the main structural unit, and preferably has 90 mol% or more of this structural unit. The molecular weight is usually over 10,000 and the melting point is 275.
A temperature of ~29008 degrees is preferred. In the general formula, -Ph--C1-Br, an alkyl group, a cycloalkyl group, and m is an integer of 1 to 4, for example. A particularly suitable phenylene sulfide is 4/C5-1'14 m.

In addition, both are illustrated.

In the present invention, it is important to blend a polyoxyalkylene compound compatible with the polyester in order to improve the kneading properties and extrusion stability of the polyester and polyphenylene sulfide. Examples of compounds that can be used include polyethylene glycol, polypropylene glycol,
Polyether glycols with polyoxyalkylene chains such as polytetramethylene glycol, polyneopentyl glycol, ethylene oxide-propylene oxide random or block copolymers, polyhydric alcohol alkylene oxide adducts-alkylene oxide adducts of polyhydric carboxylic acids Anionic end of polyoxyalkylene chain such as those mono- or polyethers, mono-selected sigma polyesters, phthalic esters of polyether glycols, diglycolic acid esters, and polyoxyalkylene phenyl ether sulfonic acids. Compounds in which all groups have been introduced - 4 Metal salts thereof, esters obtained by esterifying the anionic group of the metal with benzyl alcohol, etc., unsaturated alcohol ethers of polyether glycol, unsaturated acid esters, etc. Polyethers with saturated groups [Hymonyl compounds, partial polymers of carbonic acid group-containing polymers; Examples include 11 compounds having a chain and an epoxy group. The compound preferably has at least one group reactive with polyester.1. stomach. Polyether glycols, which are not common to polyester (7), such as polymeric compounds (11) that completely improve antistatic properties, have a poor effect on improving extrusion stability (7), and also have poor moldability and solder resistance. The molecular weight of the polyoxyalkylene compound used in the present invention varies depending on the type, but is usually 5000 or less, and is preferably 1
't 150~3000. Among them, 200 to 1500 is particularly preferable (7). Particularly preferable polyoxyalkylene (e) compounds include polyoxyalkylene compounds and compounds having epoxy groups (7) which form the compound during kneading or molding.
It is used in combination with a compound. For example, in the general formula, A: C, ~C6 aliphatic carbon specific water group, water group or glycidyl group. Examples include glycol glycidyl ethers, specifically mono- or diglycidyl ethers of polyethylene glycol.

Mono- or diglycidyl ether of polypropylene glycol, mono- or diglycidyl ether of polytetramethylene glycol, mono- or diglycidyl ether of polyneopentyl glycol 5 Mono- or diglycidyl ether of polyethylene glycol/polypropylene gel IJ copolymer, polyethylene Monostraddle diglycidyl ether of glycol/polytetramethylene glycol copolymer, methokida polyethylene glycol (
7J) Monoglycidyl ether, monoglycidyl ether of ethoxypolyethylene glycol, etc. are added.

In addition to the general formula, glycerin, alkylene ether, etc. are also preferable.
．． A polyglycidyl compound having 2 to 2 epoxy fundamentals is preferred, and the epoxy value (f compound 100y-VCC
The number of equivalents of the oxirane ring present is particularly preferably about o, i to 0.7.

The blending ratio of the above components in the present invention is 5 to 100% by weight of 7 polyphenylene sulfide to polyester;
Preferably it is 8 to 80i critical.

If it is less than 5% by weight, the effect of improving heat resistance, especially solder resistance, will be insufficient, and if it exceeds 100% by weight, the extrusion stability will be poor and the appearance of the molded product will be poor. On the other hand, the blending ratio of polyoxyalkylene compound to polyester is 0.1 to 10% by weight, preferably 0.5 to 10% by weight.
Weight%. If the blending ratio is less than 0.1% by weight, the cross-wire processability of polyester and polyphenylene sulfide decreases, and stable workability cannot be obtained.9. Not only will strand breakage occur in the extruded pellets and it will be difficult to blend them uniformly, but the heat resistance, especially the solder resistance, of the molded product will become partially non-uniform, making it difficult to achieve the objective. What are the drawbacks that make it difficult to obtain molded products with excellent surface properties and thermal dimensional stability using molds? arise, 10
If it exceeds % by weight, mechanical properties, thermal stability over time, etc. will deteriorate and noise will be produced.

If desired, a mold release agent may be used in combination with the composition of the present invention to further improve moldability. Particularly preferable mold release agents include esters of higher fatty acids, and I of the periodic table of amphoteric fatty acids.
Examples of group A or group IIA metal salts include dimer acid metal salts and polyhydric alcohol fatty esters such as sodium stearate, calcium stearate, magnesium stearate, calcium montanate, and monotanoic acid esters. Formula #7 is 1,10 to polyester
It is less than the weight ratio, and it is conveniently ido, ot~3 weight ratio.

If desired, the composition of the present invention may be provided with a strong additive to further improve its heat resistance, moldability and mechanical properties. One of the reinforcing agents that can be used is fibrous, granular, or a mixture of both. Chichi Jflf #Noko's strong 1st drug is glass fiber - shirasu glass fiber.

alumina fiber, charcoal f hysilicon fiber I, gypsum fiber yarn) (,
Examples include metal fibers, whiskers, and other @-free fibers X11-, carbon fibers, and the like. Particulate strong IL agents include citric acid such as talc, wollastonite, kaolin, clay-sericite, mica, bentonite, and asbestos alumina silicate.

Acid 1 Hysilicon, Acid F Magnesium 2 Acid 1 H2 A, Conium Acid, Titanium and other metals
Carbonate '4T-value acid power/L such as calcium and magnesium carbonate, ffjpet salts such as sium and barium sulfate, glass peas.

Examples include boron nitride, carbon dioxide, etc. - these may also be hollow. The above-mentioned strengthening agent may be treated with a silane-based, titanium-based, or other coupling agent if necessary. , preferred L<ke5~150
The weight section is especially suitable for 10 ~ 130 weight sections.
If the blending amount of the agent is 200% by weight or more, the extrusion stability will be insufficient, and the surface gloss of the molded product will tend to be significantly impaired.1. <Favorable [7] Not good.

Depending on the purpose of use, the composition of the present invention may further contain polyester stabilizers such as acid famine inhibitors, ultraviolet absorbers, and hydrolysis stabilizers, as well as plasticizers, lubricants, and slidability improvers.
Foaming agent, antistatic agent, antifouling agent.

Total combination of additives such as colorants and flame retardants (may be 7).

If desired, the polyester composition of the present invention may be supplemented with 2 deviations from the gist of the present invention (7 additional amounts and types of other thermoplastic resins, such as polyolefin, polyamide 2 polyacetal, polycarbonate, polysulfone, polyphenylene oxide, etc.) 2 is fine.

The glass transition point is below O'0, especially good 1[7kke-
Resins for improving impact resistance of 2()C or less, such as polyester elastomers, polyamide elastomers, polycarbonate elastomers, ionic group-containing primary nophine rubbers, epoxy-modified olefin rubbers, etc. can also be blended as appropriate.

Thus, the composition obtained in step 7 has excellent moldability and surface properties not only when molded in high-temperature molds but also in low-temperature molds, and has good heat resistance, especially solder resistance, and mechanical properties. Since it gives an excellent molded product, it is particularly suitable for molding parts that are subjected to solder processing, such as electrical and electronic parts.
It is useful as an extrusion molding material in the form of a film, a blow molding material, etc.

The method for producing the composition of the present invention is limited to 1 (it can be carried out by any method other than 1).For example, the polyester and all other components are mixed in advance and compounded using an extruder. The method is the so-called electric wire coating method, in which all components except the polyester and fiber reinforcement are mixed and put into an extruder, the molten mixture is coated around a glass roving, etc., cooled, and then cut into appropriate lengths. Examples include a method in which a fibrous and/or granular reinforcing agent is added during or after the polymerization of polyester, and then all other components are mixed therein.However, the mixing method and timing are not necessarily limited to these. isn't it.

The present invention will be explained below with reference to Examples. Note that parts and parts in the examples are based on weight.

Example 1 Polyethylene terephthalate (hereinafter referred to as PET with an intrinsic viscosity of 0.
60), polyphenylene sulfide (hereinafter referred to as PPS Phillips Petroleum Co., Rydon P-4), and various other compounding agents were tri-blended in a tumble blender in the proportions shown in Table 1, and then extruded into a cylinder using a 30wR twin-screw extruder. The composition was melt-kneaded at a temperature of 280 to 295° C., and the extruded strand of the composition was pelletized using a strand cutter.

The extrusion stability was evaluated by comparing the occurrence of strand breakage at 9 strands when the strand was taken up. The obtained compound pellet was dried under reduced pressure at 130°C for 4 hours, and the pellet obtained using an injection molding machine (model FS-75 manufactured by Nissei Jushi Kogyo Co., Ltd.) was heated at a cylinder temperature of 280-290-295°C and a total mold temperature of #95. ℃
A disk with a diameter of 100 m and a thickness of 3 mm, and test pieces with a length of 5 inches, a width of 1/2 inch, and thicknesses of 1/4 inch, 1/8 inch, and 1716 inches were molded. The mold release property was determined by mold separation and sprue removal during disk molding, and the surface characteristics were determined by the surface gloss and flow pattern of the disk. Bending strength and heat distortion temperature were evaluated using ASTM D-790 and ASTIviD-648 test methods, respectively. For solder resistance, a 1/16-inch thick specimen was screwed with a tapping screw of type 3/σ4 by the thickness, and only the screw part was immersed in a solder bath set at 300°C for various lengths of time, then immediately pulled up and the screw fell out. The immersion time was determined and measured. The results are shown in Table 1.

As is clear from Table 1, the composition of the present invention has good extrusion stability, and molded products with excellent mold releasability and surface properties can be obtained in low-temperature molds of 100°C or less. The product exhibits good mechanical properties, high heat distortion temperature and excellent solder resistance.

Comparative examples where the polyoxyalkylene compound is not blended or the amount blended is too small are unsatisfactory in extrusion stability and moldability, and the heat distortion temperature of the molded product is low and the solder resistance also varies widely. (This confirms that PET and PPS lack uniform blendability.

Example 2 Same composition as Example 1A2 except for changing the type of polyoxyalkylene compound. A test piece was molded in the same manner as above, and the moldability and characteristics of the molded product were evaluated, and the results shown in Table 2 were obtained.

As a result, the composition of the present invention containing a polyoxyalkylene compound compatible with PET provided excellent extrusion stability and moldability, and stable and improved solder resistance.

Patent applicant: Toyobo Co., Ltd.

Claims (1)

[Claims] 1. Polyphenylene sulfide 5 to x for polyester mainly composed of ethylene terephthalate repeating units
A polyester composition characterized in that it contains a polyoxyalkylene compound compatible with the polyester in an amount of 10 to 10% by weight. 2. The polyester composition according to claim 1, wherein the polyoxyalkylene compound is a polyoxyalkylene compound having at least one group reactive with polyester. 3. The polyester composition according to claim 2, wherein the polyoxyalkylene compound has a polyoxyalkylene chain and an epoxy group.