JPS59181700A - Mount forming device of semiconductor enclosure - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an apparatus for forming a mounting part for a semiconductor envelope, and particularly for the alignment of a semiconductor device that requires alignment of 81 M degrees when incorporated into equipment. The present invention relates to a device for forming a reference notch or hole in a terminal.

[Technical background of the invention]

CCD (Charge Coupled Device)
Optical conductors such as e) need to be precisely positioned and fixed at the position where an optical image is formed, and highly accurate positioning is required when incorporating them into equipment.

Conventionally, for this alignment, a laminated ceramic package is used in which a reference notch is previously provided at the end. Then, the metallization of the die mount portion is formed to match the thick awn of the semiconductor chip, and alignment is performed when the semiconductor chip is mounted.

[Problems with background technology]

However, in this conventional method, when providing a notch in a ceramic package, the position of the notch is 46 degrees (±0
．． 1 van), positional accuracy when forming metallization on Ceraminokupaso queso (±〇, 2 wn),
and positioning accuracy (±0.1 m) when using chisozo mount
There was a problem in that the final accuracy was around ±0.25 to 0.3 m), and the required positional accuracy of ±0.05 m+n could not be obtained. Therefore, at the time of mounting on equipment, when fixing the notch portion with screws or the like, it was necessary to perform a combination of adjustment work.

In addition, in order to improve the accuracy of conventional ceramic pan cages, it is necessary to form the notches with high precision by machining, and to mount the semiconductor chip in a position based on the notches. An operator or mounting device that can be accurately fixed is required. However, machining the ceramic makes the pancage very expensive, and also makes very accurate mounting operations difficult.9 Increasing the accuracy of the mounting equipment reduces yield.

[Purpose of the invention]

This invention has been made in view of the above-mentioned circumstances, and an object thereof is to be able to form a reference notch or a reference hole precisely in the positioning terminal of a semiconductor device, so that it can be easily mounted on a device. An object of the present invention is to provide a method for forming a mounting part of a semiconductor envelope that does not require additional positioning adjustment work.
F]ru.

[Summary of the invention]

The present invention provides a device in which a reference notch or a reference hole is formed in a positioning terminal of a semiconductor device in which a semiconductor chip is fixed to an envelope in which a positioning terminal is integrated. A projection light pattern corresponding to the shape of the semiconductor chip is irradiated, and this projection light pattern is
(2) After aligning the positions of the semiconductor chips, the positioning terminal is fixed, and then a reference notch or hole is formed in the positioning terminal based on the position of the semiconductor chip. .

[Embodiments of the invention]

Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

This invention provides a reference cutter for positioning on the positioning terminal of the envelope in which the positioning terminal described in Japanese Patent Application No. 57-18966 (Method for Manufacturing Semiconductor Device) is integrated. This is an apparatus for forming a cutout or a reference hole, and the formation of the reference cutout or reference hole is performed after a semiconductor chip is fixed to an envelope, using the fixing position as a reference.

FIG. 1 shows the specific structure of this device for forming a number part of a semiconductor envelope. In the figure, a pattern projector 12 and a copying mirror 13 are fixed on a support stand 11, respectively. A die 14 is fixed below the microscope 13. As shown in FIG. 2, this die 14 is provided with a housing section 15, and a semiconductor device 16 is housed within this housing section 15 for alignment. The microscope 13 has a half mirror facing the pattern projector 12.
17 is attached. That is, the pattern light irradiated from the pattern projector 12 is shown in FIG.
As shown, the light is reflected by the nof mirror 17 and then projected onto the semiconductor device 16. Semiconductor device 1611-1: As described above, a semiconductor chip 20 such as a CCD is placed in an envelope 19 in which a positioning terminal 18 is integrated.
is fixed.

The semiconductor chip 7'16 is mounted on a rotary table 22 provided at the tip of an X-=Y-θ table 21. X-
The Y-θ table 21 allows the micro head 23 to move the position of the rotary table 22 in the X direction, the micro head 24 in the Y direction, and the micro head 25 to finely adjust the rotation of the rotary table 22. It has become. As a result, the position of the semiconductor device 16 is finely adjusted, and the semiconductor chip 2
This is to match the position of 0 with the pattern projection light. Two punches 27 (one not shown) held by a punch holder 26 are disposed above the die 14, and the pattern source is projected at the absolute center position between these punches 27. It has become so. Punch holder 2
A clamp 28 that also serves as an IJ buckle and moves up and down is provided between the die 14 and the clamp 2.
The punch 27 is configured to move up and down through a guide hole 29 provided at 8. The punch holder 26 and the clamp 28 are driven by a cylinder 32 via levers 3θ and 31, respectively.

In addition, in FIG. 2, for convenience of explanation, the rotary table 22 of the Reference numeral 22 is arranged such that the person 9 is placed in the housing portion 15, and the lower surface of the positioning terminal J8 and the upper surface of the die 14 are aligned.

In other words? In the "B7'jilh outer envelope" part forming device, 5. Second
A patterned light 33 corresponding to the shape of the semiconductor chip 2θ as shown in FIG. This pattern light 33 is projected onto the absolute center position of the punch 27, and when the operator aligns the position of the p semiconductor chip 20 with the pattern light 33 using the micro heads 23 to 25 while looking at the microscope Mt and @zs. The notch (or hole) formed in the positioning terminal 18'' will necessarily be based on the semi-folded chip 20.

Once such alignment is completed, the clamp 28 is then
is lowered, and the alignment terminals 18 of the semiconductor device 16 are fixed onto the die 14. Once the positioning terminal 18 is fixed, the punch 27 descends together with the punch holder 26 to punch out the positioning terminal 18. As a result, a reference notch (or reference hole) having the same cross-sectional shape as the punch 27 is formed in the alignment terminal 18.

As described above, in this semiconductor envelope mounting part preforming device, a cut is made on the semiconductor device 16, in which the semiconducting chip 20 is fixed to the envelope 19 in advance, with the position of the semiconductor chip 7°20 as a reference. It is used to form a notch (or hole), which allows for accurate processing (±0.05 ttan). Therefore, the original alignment adjustment work that was conventionally required at the time of mounting becomes unnecessary. Also, compared to the method of forming notches in Ceraminokpanokeno by machining etc.
The envelope can be made inexpensive, and the mount sheath itself can be relatively poor, so the sheath is not required and the trade-off is not reduced.

In the above embodiment, the operator adjusts the micro heads 23 to 25 while visually observing the microscope mirror 13 to achieve the + or -position of the semiconductor chip 20. : However, it is also possible to perform alignment automatically by combining opto-electrical devices. Also, punch 27
The number of P reference holes is not limited to two, and may be provided in accordance with the number of terminals 18 for lock matching. ``j'' may be used.

〔Effect of the invention〕

As described above, according to the present invention, the reference notch or reference hole of the positioning terminal of the semiconductor device can be formed at an angle of 18 degrees relative to the semiconductor chip, so that it is possible to There is no need to perform alignment work again.

[Brief explanation of drawings]

FIG. 1 is a perspective view of an apparatus for forming a mounting portion of a semiconductor envelope according to an embodiment of the present invention, and FIG. 2 is an enlarged perspective view of the main part of FIG. 1. 12... Pattern projector, 13... Tsugu imitation sharp, 14.
...Die, 16...Semiconductor device, 17...Half mirror 118...Positioning terminal, 19...Envelope,
20... Semiconductor chip, 2... X-Y-θ table, 23-25... Micro head, 27... Punch, 28... Clamp.

Claims (1)

[Claims] In a semiconductor device in which a semiconductor chip is fixed to an envelope in which a positioning terminal is integrated, a reference notch or a reference hole is formed in the positioning terminal, and a projection light pattern for positioning is projected into a predetermined position. a pattern projector that illuminates a position; a moving mechanism that moves the semiconductor device so that the semiconductor chip matches the projected light pattern;
means for detecting a positional deviation between the projection light/turn and the semiconductor chip and controlling the moving mechanism so that the two coincide; It is characterized by comprising a fixing biomembrane for fixing the alignment terminal, and a means for completely forming a reference notch or a reference hole in the fixed alignment terminal based on the position M'fc of the semiconductor chip. A mounting part forming device for semiconductor envelopes.