JPS5917848B2 - IC chip mounting method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention provides a flexible tape having a circuit pattern.
The present invention relates to an IC chip mounting method for mounting a C chip.

2. Description of the Related Art In recent years, a mounting method called a film carrier method has been known as an IC chip mounting method in which an IC chip is mounted on a flexible tape having a circuit pattern.

The film carrier method uses a film 1 of thermosetting resin such as polyimide, as shown in the plan view and side sectional view showing the IC chip mounting method shown in Figures 1 and 2.
A circuit pattern 2 is provided by etching a copper foil, and an IC chip 6 having a plurality of bumps 5 is connected to the leads 4 extending from the opening 3 of the film 1.
This is an IC chip mounting method in which an IC chip is mounted from 1ζ by injecting a molding material 7 such as a curable resin, and a potting method or a transfer method is used as a molding method for the molding material 1. Furthermore, frame feed holes 8 are drilled on both sides of the film 1, which makes feeding and positioning possible and automated, and is an excellent feature that allows testing in the final process as a tape. This is an implementation method with However, film 1 must satisfy conditions such as thermal expansion, is expensive, and
In addition, many plastic chips such as polyimide contain metal ions, which can cause damage to adjacent ICs.
This had drawbacks such as the risk of contaminating the chip.

' The present invention aims to provide an IC chip mounting method that takes advantage of the excellent features of the film carrier method described above, eliminates the above drawbacks, lowers IC costs, and improves reliability. .

The present invention will be described below with reference to drawings of embodiments. : 3rd
4, 5, 6, and T show an embodiment of the IC chip mounting method according to the present invention.
is a flexible tape, for example, a thin metal plate such as copper, which can be easily bent, and the flexible tape 9 is provided with a circuit pattern 10, for example, by etching, and the flexible tape 9 and the circuit pattern 10 are is constructed in one piece. It is even better if the circuit pattern 10 is plated with gold or the like. In FIG. 3, a part of the circuit pattern 10 is provided with a lead 12 connected to the C chip 11 in FIG. 4, and is also provided with a lead 13 for fixing an IC chip. Reference numeral 14 denotes a frame feed hole, which is used to automatically feed and position the long pool-shaped flexible tape 9.

Figure 4 shows the bonding process, where the IC chip 1
The pump 15 and lead 12 prepared in advance in 1 are connected by thermocompression bonding or the like. 5 and 6 are a plan view and a side sectional view showing the molding process, in which a molding material 16 such as a thermosetting resin is molded around the IC chip 11 by a potting method or a transfer molding method. At this time, the IC chip fixing leads 13 are also molded with the molding material 16 at the same time. FIG. 7 shows a lead cutting process, in which only the leads 12 of the circuit pattern 10 including the leads 12 and the IC chip fixing leads 13 are cut by a press or the like. All the leads 12 can be separated from the flexible tape 9 and are therefore electrically separated. However, since the IC chip fixing lead 13 is not cut, the C chip 9 is attached to the flexible tape 9.
is fixed. Therefore, as it is, 1C
After testing, the flexible tape 9 can finally be rolled up and shipped. FIG. 8 shows another embodiment of the C chip mounting method according to the present invention, in which a part of the IC chip fixing lead 13 of the circuit pattern 10 provided on the flexible tape 9 is attached to one part of the IC chip 11. The IC chip fixing bump 17 and the IC chip fixing lead 13 are connected at the same time in the bonding process of the lead 12.

The IC chip fixing bumps 17 are not completely unnecessary for the operation of the IC chip 11, and may be connected to the substrate of the IC chip 11. In this case, since the IC chip fixing lead 13 is directly connected to the C chip 11, the positional accuracy is improved compared to that shown in FIG. FIG. 9 shows another embodiment of the IC chip mounting method according to the present invention, in which a film 18 made of, for example, polyimide is bonded to the circuit pattern 10 after the molding process.

If only the leads 12 are subjected to the lead extraction process in this state, the plurality of leads 12 will not touch each other due to the film 18 and will be strong, making it possible to make the flexible tape 9 thinner. In this case, unlike the conventional film carrier method described above, there is no fear of contamination since the film 18 is bonded after the molding process. The leads 12 of the flexible tape 9 in FIG. 3 can be easily integrated by making only the parts connected to the bumps 15 of the IC chip 11 thinner or thinner. As described above, the present invention:
Since the circuit pattern and the flexible tape are integrated, the cost of the IC is extremely reduced, and since it is made of plastic, there is no need to worry about contamination with metal ions, resulting in high reliability. Since it is made of only 100% polyurethane, it can be made a little thicker, making it stronger and better for heat diffusion.Furthermore, it is equipped with a lead for fixing the IC chip, so it can be used for the final test immediately after the lead removal process with the tape intact. Since it is possible to perform continuous production, it is possible to improve productivity, and the intended purpose can be fully achieved, and it has great practical effects.

[Brief explanation of the drawing]

FIGS. 1 and 2 are a plan view and a side sectional view showing a method of mounting a JC chip using a conventional film carrier method;
FIG. 3 is a plan view of a flexible tape showing an embodiment of the IC chip mounting method according to the present invention, FIG. 4 is a plan view after the bonding process, FIG. 5 is a plan view after the molding process, and FIG. 7 is a plan view showing the same after the lead extraction process; FIG. 8 is a plan view showing another embodiment of the IC chip mounting method according to the present invention; FIG. The figure is a plan view showing another embodiment of the IC chip mounting method according to the present invention. 9...Flexible tape, 10...
Circuit pattern, 11...C chip, 12...
...Lead, 13...IC chip fixing lead, 14...Frame feed hole, 15...Bump, 16...Mold material, 17.・・・・・・
IC chip fixing bump, 18...Finorem.

Claims (1)

[Scope of Claims] 1. In an IC chip mounting method of mounting an IC chip on a flexible tape having a circuit pattern, the flexible tape is composed of a metal plate integrated with the circuit pattern, and the lead of the circuit pattern is In addition, there is a bonding process in which leads for fixing the IC chip are provided and the IC chip is connected to the leads, a molding process in which a molding material is injected around the IC chip, and a process for fixing the IC chip when the leads are separated. An IC chip mounting method including a lead removal step, characterized in that the IC chip remains fixed to the flexible tape by leads. 2. A patent characterized in that the IC chip fixing lead extends to the IC chip fixing bump provided on the IC chip, and the IC chip fixing lead and the IC chip fixing bump are simultaneously connected in the bonding process. A method for mounting an IC chip according to claim 1. 3. The IC chip mounting method according to claim 1, which comprises a film bonding step of bonding a film to the circuit pattern between the molding step and the lead extraction step.