JPS59174370A - Thermal printing head - Google Patents

Thermal printing head

Info

Publication number
JPS59174370A
JPS59174370A JP58050890A JP5089083A JPS59174370A JP S59174370 A JPS59174370 A JP S59174370A JP 58050890 A JP58050890 A JP 58050890A JP 5089083 A JP5089083 A JP 5089083A JP S59174370 A JPS59174370 A JP S59174370A
Authority
JP
Japan
Prior art keywords
heating element
insulating layer
print head
thermal print
method similar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58050890A
Other languages
Japanese (ja)
Inventor
Tatsuro Yoda
依田 達郎
Hoshun Akechi
明智 方俊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP58050890A priority Critical patent/JPS59174370A/en
Publication of JPS59174370A publication Critical patent/JPS59174370A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335Structure of thermal heads

Abstract

PURPOSE:To form a thermal printing head integrally with a heat dissipating plate, thereby reducing the manufacturing cost of the thermal print head, by forming a heating element on a heat dissipating plate through an insulating layer. CONSTITUTION:An insulating layer 12 with a predetermined thickness is formed on the upper surface of a heat dissipating plate 11 of, for example, iron or aluminum in an inert gas atmosphere by sputtering or vacuum evaporation. A heating element 13 of tantalum nitride is formed on the upper surface of the insulating layer 12 by a method similar to the above. After a conductor layer 14 is formed on the upper surface of the heating element 13 by a method similar to the above, a portion of the conductor layer 14 corresponding to a necessary portion of the heating element 13 is removed by photoetching. A protecting film 15 is formed on the exposed heating element 13 by a method similar to the above, thus forming a thermal print head 10.

Description

【発明の詳細な説明】 本発明は、熱印字ヘッドに関する。[Detailed description of the invention] The present invention relates to thermal printheads.

従来のこの種の熱印字ヘッドで特に中型、大型 。This type of conventional thermal print head is especially suitable for medium and large sizes.

のものになるさ放熱板は必要不可欠となる。このような
熱印字ヘッド1には、第1図に示すように、放熱板2の
上面に接着剤や、取付金具3.3(こより取付けるよう
にしたものがある。4.4Vi取付用ビスである。この
ような熱印字ヘッド1では、放熱板2と別体で製作しな
ければならないので、製造コストが高くつき、また取付
金具3,3等の付属部品をも必要とするとともに、製造
工程数も多いので、製造コストが更に高くつくものとな
っている。
A heat sink becomes essential. As shown in FIG. 1, some thermal printing heads 1 have adhesives or mounting brackets 3.3 (4.4Vi mounting screws) attached to the top surface of the heat dissipation plate 2. In such a thermal printing head 1, it must be manufactured separately from the heat dissipation plate 2, which increases the manufacturing cost, requires additional parts such as mounting brackets 3, and also reduces the manufacturing process. Since there are a large number of them, the manufacturing cost becomes even higher.

本発明は、製造コストが安くて済むようにすることを目
的とし、このため熱印字ヘッドを放熱板と一体化するよ
うにしている。
The present invention aims to reduce manufacturing costs, and for this purpose the thermal printing head is integrated with the heat dissipation plate.

以下、本発明を図面に示す各実施例に基づいて詳細に説
明する。
Hereinafter, the present invention will be described in detail based on each embodiment shown in the drawings.

第2図はこの実施例に係る熱印字ヘッドの断面図である
。この実施例は薄膜技術による熱印字ヘッドについて説
明する。この実施例の熱位字ヘッド10i−1:、鉄、
アルミニウム等でできた放熱板11を備える。この放熱
板11の上面には、窒素ガス等の不活性カス雰囲気中で
スパッタリングや真空蒸着の手法により絶縁層12が所
定の厚さく好ましくは5μ〜70μ)に形成式れる。こ
の絶縁層12の上面には上記と同様の手法で例えは望化
タンタルでできた発熱体13が形成σれる。この発熱体
13の上面に、導体層14が上記手法で形成されて後、
フォトエツチングの手法により発熱体13め所要の部分
に対応する導体層14の部分が除去σれる。この除去に
より露出した発熱体13に、耐摩耗性の保護膜15が上
記手法により形成きれる。したがって、この実施例によ
れば放熱板11が発熱体13を支持する基体としての役
割を有し、放熱板11と一体化されてなる熱印字ヘッド
10を構成することができる。
FIG. 2 is a sectional view of the thermal print head according to this embodiment. This example describes a thermal print head based on thin film technology. Heat position head 10i-1 of this embodiment: iron,
A heat sink 11 made of aluminum or the like is provided. An insulating layer 12 is formed on the upper surface of the heat sink 11 to a predetermined thickness (preferably 5 to 70 microns) by sputtering or vacuum deposition in an inert gas atmosphere such as nitrogen gas. A heating element 13 made of tantalum, for example, is formed on the upper surface of this insulating layer 12 using a method similar to that described above. After the conductor layer 14 is formed on the upper surface of this heating element 13 by the above method,
A portion of the conductor layer 14 corresponding to a desired portion of the heating element 13 is removed by photo-etching. A wear-resistant protective film 15 can be formed on the heating element 13 exposed by this removal by the above-described method. Therefore, according to this embodiment, the heat sink 11 has the role of a base supporting the heating element 13, and it is possible to configure the thermal print head 10 that is integrated with the heat sink 11.

第3図は他の実施例(こ係る熱印字ヘッドの断面図であ
り、第2図に対応する部分には同一の符号が付をれる。
FIG. 3 is a sectional view of another embodiment (this thermal printing head), and parts corresponding to those in FIG. 2 are given the same reference numerals.

この実施例では厚膜技術による熱印字ヘッドの場合を示
す。この実施例の熱印字ヘッド10′は、各絶縁層12
、導体層14、発熱体13、保護層15が厚膜印刷σれ
て形成されている。この厚膜方式の場合は、望素焼成が
可能な材質を選定して上記各層を形成する。
This example shows the case of a thermal print head using thick film technology. The thermal print head 10' of this embodiment includes each insulating layer 12.
, the conductor layer 14, the heating element 13, and the protective layer 15 are formed by thick film printing σ. In the case of this thick film method, the above-mentioned layers are formed by selecting materials that can be fired as desired.

以上のように、本発明によれば、放熱板上に絶縁層を介
して発熱体を形成したので、熱印字ヘッドを放熱板と一
体化して構成することができる。
As described above, according to the present invention, since the heating element is formed on the heat sink via the insulating layer, the thermal print head can be integrated with the heat sink.

したがって、放熱板と熱印字ヘッドとを個別に製造する
必要がな(なり、熱印字ヘッドの製造コストを低減する
ことができるとともに、取付金具等の付属部品の不要化
ISらび(こ製造工程数の減少化等により史に製造コス
トを低減することができる。
Therefore, it is not necessary to manufacture the heat dissipation plate and the thermal print head separately (this makes it possible to reduce the manufacturing cost of the thermal print head, and eliminates the need for accessory parts such as mounting brackets). Manufacturing costs can be significantly reduced by reducing the number of parts.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来例の断面図、第2図は本発明の実施例の断
面図、第3図は本発明の他の実施例の断面図である。 10.10’・・・熱印字ヘット、11・・放熱板、1
2・・・絶縁層、13・・・発熱体、14・・・導体層
、15・保護層。 特許出願人   口 −ム株式会社
FIG. 1 is a cross-sectional view of a conventional example, FIG. 2 is a cross-sectional view of an embodiment of the present invention, and FIG. 3 is a cross-sectional view of another embodiment of the present invention. 10.10'... Thermal printing head, 11... Heat sink, 1
2... Insulating layer, 13... Heating element, 14... Conductor layer, 15... Protective layer. Patent applicant population -Mu Co., Ltd.

Claims (1)

【特許請求の範囲】[Claims] (1)放熱板上に絶縁層を形成し、この絶縁層の上に発
熱体を形成することにより放熱板と一体化σれてなる熱
印字ヘッド。
(1) A thermal print head that is integrated with the heat sink by forming an insulating layer on the heat sink and forming a heating element on the insulating layer.
JP58050890A 1983-03-24 1983-03-24 Thermal printing head Pending JPS59174370A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58050890A JPS59174370A (en) 1983-03-24 1983-03-24 Thermal printing head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58050890A JPS59174370A (en) 1983-03-24 1983-03-24 Thermal printing head

Publications (1)

Publication Number Publication Date
JPS59174370A true JPS59174370A (en) 1984-10-02

Family

ID=12871326

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58050890A Pending JPS59174370A (en) 1983-03-24 1983-03-24 Thermal printing head

Country Status (1)

Country Link
JP (1) JPS59174370A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4860030A (en) * 1987-12-14 1989-08-22 Xerox Corporation Resistive printhead arrays for thermal transfer printing

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57185170A (en) * 1981-05-09 1982-11-15 Toshiba Corp Heat dissipating base plate

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57185170A (en) * 1981-05-09 1982-11-15 Toshiba Corp Heat dissipating base plate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4860030A (en) * 1987-12-14 1989-08-22 Xerox Corporation Resistive printhead arrays for thermal transfer printing

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