JPS59169870A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPS59169870A JPS59169870A JP58043196A JP4319683A JPS59169870A JP S59169870 A JPS59169870 A JP S59169870A JP 58043196 A JP58043196 A JP 58043196A JP 4319683 A JP4319683 A JP 4319683A JP S59169870 A JPS59169870 A JP S59169870A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- thermal head
- heat
- crack
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 230000001681 protective effect Effects 0.000 claims description 14
- 229920006015 heat resistant resin Polymers 0.000 claims description 9
- 229920005989 resin Polymers 0.000 abstract description 16
- 239000011347 resin Substances 0.000 abstract description 16
- 238000010438 heat treatment Methods 0.000 abstract description 6
- 229920001721 polyimide Polymers 0.000 abstract description 3
- 239000009719 polyimide resin Substances 0.000 abstract description 3
- 239000004020 conductor Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005470 impregnation Methods 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000009965 odorless effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Landscapes
- Electronic Switches (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（１）発明の技術分野
本発明は電子計算装置等の出力装置として用いられるサ
ーマルプリンタのサーマルヘッドに関するものである。DETAILED DESCRIPTION OF THE INVENTION (1) Technical Field of the Invention The present invention relates to a thermal head for a thermal printer used as an output device for an electronic computing device or the like.
（２）従来技術と問題点
データや図形などの情報を記録するサーマルプリンタは
無衝撃形で騒音が少なく、無臭であり。(2) Prior art and problems Thermal printers that record information such as data and graphics are non-impact, generate little noise, and are odorless.
現像定着などの操作が不要で保守性が良いなどの特徴を
有することから情報端末機、ファクシミリ等に用いられ
ている。このブー４ルプリンタの記録方式は、加熱によ
り発色する特殊処理を施した感熱記録紙を用い、ドツト
状の発熱素子を有するサーマルヘッドにパルス状の電力
を印加して発熱させ、その熱エネルギを感熱記録紙に供
給して発色させるのである。この場合に用いられるサー
マルヘッドは第１図の断面図に示す如き構造を有してい
る。即ち基板１にはアルミナに熱伝導率の低いガラスを
コーティングしたグレーズドアルミナ基板を用い、その
上に抵抗体膜２を一様に形成し。It is used in information terminals, facsimiles, etc. because it does not require operations such as developing and fixing and is easy to maintain. The recording method of this Boolean printer uses specially treated thermal recording paper that develops color when heated. Pulse power is applied to a thermal head with dot-shaped heating elements to generate heat, and the thermal energy is transferred. It is supplied to heat-sensitive recording paper to develop color. The thermal head used in this case has a structure as shown in the sectional view of FIG. That is, a glazed alumina substrate made of alumina coated with glass having low thermal conductivity is used as the substrate 1, and the resistor film 2 is uniformly formed thereon.
その上に発熱抵抗体３となる部分を残し、該発熱抵抗体
３に電力を供給する導体部４７に形成し、さらにその上
に５ｉ０２により発熱抵抗体の酸化を防止する耐酸化層
５とＴ ａ ２０６による耐摩耗層６とによる保護膜を
形成している。A portion that will become the heating resistor 3 is left thereon, and a conductor portion 47 is formed to supply power to the heating resistor 3, and an oxidation-resistant layer 5 and T A 206 forms a protective film with the wear-resistant layer 6.
従来このような２層の保護膜を持つサーマルヘッドは、
第１層目に用いる抵抗体酸化防止層としての５ｉ０２の
熱膨張率が著しく小さいため、基板１との熱膨張率との
差によって、ひずみの多く入っている導体パターン４の
エツジ部分にクラック７が生じる。そして印字中に感熱
紙に含まれる水分が水蒸気となシ、ヘッドに付着した場
合、前記クラック７から導体と保護膜との間に水が入り
込み、その結果導体の電蝕が起こり、保護膜が浮きヘッ
ドの寿命を短かくするという欠点があった。Conventionally, thermal heads with two layers of protective film,
Since the coefficient of thermal expansion of 5i02 used as the resistor oxidation prevention layer used in the first layer is extremely small, the difference in the coefficient of thermal expansion with that of the substrate 1 causes cracks 7 at the edges of the conductor pattern 4 where there is a lot of strain. occurs. If the moisture contained in the thermal paper turns into water vapor during printing and adheres to the head, water will enter between the conductor and the protective film through the cracks 7, resulting in electrolytic corrosion of the conductor and the protective film. This had the disadvantage of shortening the life of the floating head.
（３）発明の目的
本発明は上記従来の欠点に鑑み、保護膜のクランクを樹
脂で埋めた長寿命のサーマルヘッドを提供することを目
的とするものである。(3) Purpose of the Invention In view of the above-mentioned conventional drawbacks, the present invention aims to provide a long-life thermal head in which the crank of the protective film is filled with resin.
（４）発明の構成
そしてこの目的は本発明によれば、絶縁基板上に発熱抵
抗体を有し、該発熱抵抗体上に保護膜を有するサーマル
ヘッドにおいて６該保護膜に生じたクラックに耐熱性樹
脂全真空含浸させたことを特徴とするサーマルヘッドを
提供することによって達成される。(4) Structure and object of the invention According to the present invention, in a thermal head having a heat generating resistor on an insulating substrate and a protective film on the heat generating resistor, 6 heat resistance is provided to prevent cracks occurring in the protective film. This is achieved by providing a thermal head characterized by full vacuum impregnation with a synthetic resin.
（５）発明の実施例 以下本発明実施例全図面によって詳述する。(5) Examples of the invention Embodiments of the present invention will be described in detail below with reference to all the drawings.
第２図は本発明によるサーマルヘッドを示す図である。FIG. 2 is a diagram showing a thermal head according to the present invention.
同図において、１０は基板、１１は抵抗体膜、１２は発
熱抵抗体部、１３は導体部、１４は保護膜、１５は耐熱
性樹脂をそれぞれ示す。In the figure, 10 is a substrate, 11 is a resistor film, 12 is a heating resistor part, 13 is a conductor part, 14 is a protective film, and 15 is a heat-resistant resin.
第２図に示す如く本発明は保護膜］４に生じたクラック
に耐熱性の樹脂（例えばポリイミド樹脂）］５を真空含
浸させたものである。もしこのときピンホールがあれば
同時にそのピンホールにも樹脂は含浸される。As shown in FIG. 2, in the present invention, cracks generated in the protective film 4 are vacuum impregnated with a heat-resistant resin (for example, polyimide resin) 5. If there is a pinhole at this time, the pinhole is also impregnated with the resin at the same time.
第３図は樹脂の真空含浸を行なう方法を説明するための
装置を示す図である。同図において、２０は真空可能な
チャンバー、２１はサーマルヘッド。FIG. 3 is a diagram showing an apparatus for explaining a method of vacuum impregnation with resin. In the figure, 20 is a vacuum capable chamber, and 21 is a thermal head.
２２は耐熱性樹脂２３を入れた槽、２４は試料上下機構
、２５はハンドルをそれぞれ示す。Reference numeral 22 indicates a tank containing a heat-resistant resin 23, 24 indicates a sample lifting mechanism, and 25 indicates a handle.
第３図により説明すると、先ず試料のサーマルヘッド２
１を試料上下機構２４に把持せしめ、槽２２には耐熱性
樹脂２３（例えばポリイミド樹脂）を入れておき、チャ
ンバー２０内の空気を抜き数Ｔｏｒｒ程度の真空とする
。次にハンドル２５を操作してサーマル−、ラド２工を
下降させ耐熱性樹脂２３の中に浸漬し、その状態でチャ
ンバー２０内に空気を導入して大気圧とする。その後サ
ーマルヘッド２１を耐熱性樹脂より引き上げ表面に付着
した余分な樹脂をぬぐい去り、次いで加熱して樹脂を硬
化させる。To explain with reference to FIG. 3, first, the thermal head 2 of the sample
1 is held by the sample up/down mechanism 24, a heat-resistant resin 23 (for example, polyimide resin) is placed in the tank 22, and the air in the chamber 20 is evacuated to create a vacuum of about several Torr. Next, by operating the handle 25, the thermal and rad 2 parts are lowered and immersed in the heat-resistant resin 23, and in this state, air is introduced into the chamber 20 to bring it to atmospheric pressure. Thereafter, the thermal head 21 is lifted from the heat-resistant resin, the excess resin adhering to the surface is wiped off, and then heated to harden the resin.
このように処理されたサーマルヘッドは、その保護膜に
あるクラックあるいはピンホールに樹脂が押し込まれ、
そのクラックあるいはピンホールは埋められている。従
って感熱紙の水分による導体の電蝕は皆無となり従来品
に比して著しく長寿命となる。Thermal heads treated in this way have resin pushed into the cracks or pinholes in the protective film.
The crack or pinhole has been filled. Therefore, there is no electrolytic corrosion of the conductor due to moisture in the thermal paper, resulting in a significantly longer life than conventional products.
（６）発明の効果
以上、詳細に説明したように本発明のサーマルヘッドは
、その保護膜に生ずるクラックあるいはピンホールに耐
熱性樹脂を真空含浸させることにより２導体の電蝕を防
止し、サーマルヘッドの長寿命化を実現し得るといった
効果大なるものである。(6) Effects of the Invention As explained in detail above, the thermal head of the present invention prevents electrolytic corrosion of the two conductors by vacuum impregnating the cracks or pinholes that occur in the protective film with a heat-resistant resin. This has a great effect of making it possible to extend the life of the head.
第１図は従来のサーマルヘッドを説明するための図、第
２図は本発明によるサーマルヘッドを説明するための図
、第３図は本発明によるサーマルヘッドを形成するとき
の樹脂含浸装置の１例を説明するための図である。
図面において、１０は基板、１１け抵抗体膜。
１２は発熱抵抗体部、１３は導体部、１４は保護膜、１
５は耐熱性樹脂をそれぞれ示す。
特許出願人
富士通株式会社
特許出願代理人
弁理士 宮 木 朗
弁理士 西 舘 和 之
弁理士 内 １） 幸 男
弁理士 山 口 昭 之
第 １図
第 ３図FIG. 1 is a diagram for explaining a conventional thermal head, FIG. 2 is a diagram for explaining a thermal head according to the present invention, and FIG. 3 is a diagram for explaining a resin impregnation apparatus for forming a thermal head according to the present invention. FIG. 3 is a diagram for explaining an example. In the drawing, 10 is a substrate and 11 is a resistor film. 12 is a heating resistor part, 13 is a conductor part, 14 is a protective film, 1
5 each represents a heat-resistant resin. Patent Applicant Fujitsu Limited Patent Application Agent Patent Attorney Akira Miyagi Patent Attorney Kazuyuki Nishidate 1) Yukio Patent Attorney Akira Yamaguchi Figure 1 Figure 3
Claims (1)
保護膜を有するす〜マルヘノドにおいて。 該保護膜に生じたクラックに耐熱性樹脂を真空含浸させ
たことを特徴とするサーマルヘッド。[Scope of Claims] 1. A device having a heat generating resistor on an insulating substrate and having a protective film on the heat generating resistor. A thermal head characterized in that cracks generated in the protective film are vacuum impregnated with a heat-resistant resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58043196A JPS59169870A (en) | 1983-03-17 | 1983-03-17 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58043196A JPS59169870A (en) | 1983-03-17 | 1983-03-17 | Thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59169870A true JPS59169870A (en) | 1984-09-25 |
Family
ID=12657166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58043196A Pending JPS59169870A (en) | 1983-03-17 | 1983-03-17 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59169870A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63251255A (en) * | 1987-04-08 | 1988-10-18 | Tdk Corp | Thermal head |
| WO2017170800A1 (en) * | 2016-03-29 | 2017-10-05 | 京セラ株式会社 | Thermal head and thermal printer |
-
1983
- 1983-03-17 JP JP58043196A patent/JPS59169870A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63251255A (en) * | 1987-04-08 | 1988-10-18 | Tdk Corp | Thermal head |
| WO2017170800A1 (en) * | 2016-03-29 | 2017-10-05 | 京セラ株式会社 | Thermal head and thermal printer |
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