JPS59169579A - Manufacture of metal formed body for vehicle - Google Patents

Manufacture of metal formed body for vehicle

Info

Publication number
JPS59169579A
JPS59169579A JP4562283A JP4562283A JPS59169579A JP S59169579 A JPS59169579 A JP S59169579A JP 4562283 A JP4562283 A JP 4562283A JP 4562283 A JP4562283 A JP 4562283A JP S59169579 A JPS59169579 A JP S59169579A
Authority
JP
Japan
Prior art keywords
polyamide resin
baking
temperature
baked
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4562283A
Other languages
Japanese (ja)
Other versions
JPS6144550B2 (en
Inventor
Motofumi Ishiwatari
石渡 素文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hashimoto Forming Industry Co Ltd
Original Assignee
Hashimoto Forming Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hashimoto Forming Industry Co Ltd filed Critical Hashimoto Forming Industry Co Ltd
Priority to JP4562283A priority Critical patent/JPS59169579A/en
Publication of JPS59169579A publication Critical patent/JPS59169579A/en
Publication of JPS6144550B2 publication Critical patent/JPS6144550B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE:To obtain the titled plastic metal body for a vehicle which does not deteriorate in external appearance, while inhibiting the formation of bubbles, by forming an epoxy resin coating film on the surface of a metal formed body by a cation electrodeposition method, and baking it above the baking temp. of polyamide resin to be applied thereon but below a specified temp. CONSTITUTION:An undercoat film of 10-50mum in thickness, for instance, is formed on the surface of a plastic metal body by a cation electrodeposition method using epoxy resin paint. Then, said undercoat film is baked at a temp. above the baking temp. of polyamide resin in the following step but below 250 deg.C. Thereafter, a powdery polyamide resin body is applied onto the baked coating film by an electrostatic coating method, for instance. Then, the applied powdery polyamide resin body is baked and melted above its melting point by the same method as that in a conventional manner, to form a coating film. The baking temp. at this time is above the melting point of the polyamide resin but below 250 deg.C, pref. 215+ or -5 deg.C. As a result, the obtd. finished product being free from bubbles exhibits excellent external appearance.

Description

【発明の詳細な説明】 この発明は車両用金属成形品の製造方法、特に表面に粉
体樹脂の溶融皮膜を形成した金属成形品の製造方法に関
するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a metal molded article for a vehicle, and more particularly to a method for manufacturing a metal molded article having a molten coating of powder resin formed on its surface.

自動車の外板、外装部品等の車両用金属成形品には、防
食性および装飾性を持たせるために、表面に粉体樹脂の
溶融皮膜を形成したものがある。
BACKGROUND OF THE INVENTION Some metal molded products for vehicles, such as outer panels and exterior parts of automobiles, have a molten coating of powder resin formed on their surfaces in order to provide anti-corrosion properties and decorative properties.

粉体樹脂としてはポリアミド樹脂が使用されるが、この
樹脂を直接鉄等の金属板に溶融、焼付けて皮膜を形成す
るこさはてきす、下塗り塗装が行われている。
Polyamide resin is used as the powder resin, and this resin is directly melted and baked on a metal plate such as iron to form a film, which is used for coating and undercoating.

従来の下塗り塗装は、ポリプクジエン系塗料を使用して
、アニオン電着塗装法により塗膜を形成しているが、塗
膜の防錆力は高くなかった。近年特に高い防錆力が要求
されるため、従来のアニオン電着塗装に代え、エポキシ
系樹脂塗料を使用してカチオン電着塗装法により、下塗
り塗装が行われている。
Conventional undercoating uses a polypucdiene paint to form a coating film by an anionic electrodeposition coating method, but the rust-preventing power of the coating film is not high. In recent years, particularly high rust prevention power has been required, so instead of the conventional anionic electrodeposition coating, undercoating is performed by a cationic electrodeposition coating method using an epoxy resin paint.

従来のエポキシ、系樹脂塗料を使用する方法は、カチオ
ン電着塗装法によりエポキシ系樹脂塗膜を形成した後、
エポキシ系樹脂の最適硬化温度である170〜180℃
で焼付けし、焼付塗膜上にポリアミド樹脂粉体を付着さ
せ、ポリアミド樹脂の一溶融温度以上の温度である20
0〜215°Cて焼付けし、ポリアミド樹脂の溶融皮膜
を形成していた。
The conventional method of using epoxy resin paint is to form an epoxy resin coating film by cationic electrodeposition coating method, and then
The optimum curing temperature for epoxy resin is 170-180℃
The polyamide resin powder is baked on the baked coating film at a temperature higher than the melting temperature of the polyamide resin at 20°C.
It was baked at 0 to 215°C to form a molten polyamide resin film.

しかしながら、このような従来の製造方法においては、
ポリアミド樹脂皮膜の膜厚を厚くすると、外表面に微少
な気泡が多数発生し、外観を著しく損うという問題点か
あった。
However, in such conventional manufacturing methods,
When the thickness of the polyamide resin film was increased, many minute bubbles were generated on the outer surface, which caused a problem in that the appearance was significantly impaired.

この発明は上記σような従来の問題点に着目してなされ
たもので、エポキシ系樹脂塗膜を形成した後、ポリアミ
ド樹脂の焼料温度以上250℃以下で焼付けを行うこと
により、上記問題点を解決することを目的としている。
This invention was made by focusing on the conventional problems such as σ mentioned above, and after forming an epoxy resin coating film, baking is performed at a temperature higher than the firing temperature of polyamide resin and lower than 250°C, thereby solving the above problems. It aims to solve the problem.

この発明は、金属成形品の表面にカチオン電着塗装法に
よりエポキシ系樹脂塗膜を形成し、焼付けを行った後、
塗膜上にポリアミド樹脂粉体を付着させ、ポリアミドの
溶融温度以上の温度で焼付けを行う方法において、エポ
キシ系樹脂の焼付けをポリアミド樹脂の焼付温度以上2
50℃以下で行うことを特徴吉する車両用金属成形品の
製造方法である。
This invention involves forming an epoxy resin coating on the surface of a metal molded product using a cationic electrodeposition coating method, and then baking it.
In a method in which polyamide resin powder is attached to a coating film and baked at a temperature higher than the melting temperature of the polyamide, the epoxy resin is baked at a temperature higher than the baking temperature of the polyamide resin.
This is a method for manufacturing metal molded products for vehicles, which is characterized in that it is carried out at a temperature of 50°C or lower.

従来法において成形品の外表面に気泡が発生する原因を
調べたところ、ポリアミド樹脂の焼付けの際、下塗り塗
膜のエポキシ系樹脂が分解して水で焼付けを行うが、そ
の後さらに高い温度でポリアミド樹脂の焼付けを行うた
め、エポキシ系樹脂が分解し、発生する水素がポリアミ
ド(資)脂層との界面に集まって、気泡を形成するもの
である。
An investigation into the cause of air bubbles occurring on the outer surface of molded products using conventional methods revealed that when polyamide resin is baked, the epoxy resin in the undercoat decomposes and is baked with water, but then the polyamide resin is heated to a higher temperature. In order to bake the resin, the epoxy resin decomposes and the generated hydrogen collects at the interface with the polyamide resin layer, forming bubbles.

そこて気泡の発生を防止する方法を検討したところ、下
塗り塗膜の焼付けをポリアミド樹脂の焼イ」温度以上で
行うと、後工程としてポリアミド樹脂の焼付けを行って
も、エポキシ系樹脂は分解しないことがわかった。エポ
キシ系樹脂の最適の硬化湿層は170〜180℃であっ
て、一般にはこの範囲の温度で焼付けが行われており、
この範囲より高い温度で焼付けを行うと、塗膜の劣化が
起こる。
Therefore, we investigated a method to prevent the generation of bubbles, and found that if the undercoat film is baked at a temperature higher than the baking temperature of the polyamide resin, the epoxy resin will not decompose even if the polyamide resin is baked as a post-process. I understand. The optimal hardening wet layer of epoxy resin is 170 to 180°C, and baking is generally performed at a temperature within this range.
Baking at temperatures higher than this range will cause deterioration of the coating.

ところが車両用の成形品として使用する範囲においては
、250℃以下の温度で焼付けを行う限り、子分密着性
および防食性かあり、使用可能であることがわかった。
However, it has been found that as long as the molded product is used as a molded product for vehicles, it can be used as long as baking is performed at a temperature of 250° C. or lower, as it has good adhesion to molecules and anti-corrosion properties.

このため本発明ではポリアミド樹脂の焼付温度以上25
0℃以下の温度で下塗り塗膜の焼付けを行う。
Therefore, in the present invention, the baking temperature of polyamide resin is 25°C or higher.
The undercoat film is baked at a temperature below 0°C.

下塗り塗膜の形成は従来法と同様に、エポキシ系樹脂塗
料を使用し、カチオン重着塗装法により形成する。下塗
り塗膜の形成に先立って脱脂、水洗、化成皮膜処理等を
施すのも従来法と同様である。下塗り塗膜の厚さは特に
制限はないか、例えは10〜50μmとすることができ
る。
The undercoat film is formed by a cationic coating method using an epoxy resin paint, as in the conventional method. It is also the same as the conventional method that degreasing, washing with water, chemical conversion coating treatment, etc. are carried out prior to forming the undercoat film. The thickness of the undercoat film is not particularly limited, and may be, for example, 10 to 50 μm.

こうして形成した下塗り塗膜は、後工程におけるポリア
ミド樹脂の焼付温度以上250℃以下の温度て焼付けを
行うが、ポリアミド樹脂の焼イ」温。
The undercoat film thus formed is baked at a temperature above the baking temperature of the polyamide resin in the subsequent process and below 250°C, but the temperature is higher than the baking temperature of the polyamide resin.

度より高い温度で焼付けを行うのが好才しく、この場合
ポリアミド樹脂の焼料温度より10℃以上高い温度が望
ましい。焼付時間は従来法と同様で、20〜40分間程
度である。
It is preferable to carry out baking at a temperature higher than 10°C, and in this case, a temperature higher than the baking temperature of the polyamide resin by 10°C or more is desirable. The baking time is the same as in the conventional method, and is approximately 20 to 40 minutes.

次いで、焼付塗膜上にポリアミド樹脂粉体を付着させる
方法も従来法と同様でよく、例えは静電塗装法により、
ポリアミド樹脂粉体を静電的に付着させる。ポリアミド
樹脂粉体の粒径は例えは80〜160μmとすることが
できる。
Next, the method for attaching polyamide resin powder onto the baked coating film may be the same as the conventional method, for example, by electrostatic coating method,
Electrostatically deposit polyamide resin powder. The particle size of the polyamide resin powder can be, for example, 80 to 160 μm.

付着したポリアミド樹脂粉体は、従来法と同様にその溶
融温度以上で焼付けを行うことにより、溶融させ、皮膜
を形成することができる。このときの焼付温度は前記下
塗り塗膜の焼付温度決定の基糸となるもので、ポリアミ
ド樹脂の溶融ど黒度以上250℃以下であり、215±
5℃か奸才しい。
The attached polyamide resin powder can be melted and formed into a film by baking at a temperature higher than its melting temperature as in the conventional method. The baking temperature at this time is the basis for determining the baking temperature of the undercoat film, and is the melting temperature of the polyamide resin or higher and 250°C or lower, and is 215±
It's 5 degrees Celsius.

焼付時間は60〜50分間程度である。完成品には発泡
はなX、優れた外観を有する。
The baking time is about 60 to 50 minutes. The finished product has a foam seal and an excellent appearance.

本発明の対象となる成形品は車両用の金属成形品てあり
、特に防食性が問題となる車体の外板や外装部品の製造
に適している。またエポキシ系伎↑脂塗料はエポキシ樹
脂を主体とするもので、エポキシ樹脂単独成分のほかに
、フェノールfit 脂環ノ他の樹脂成分を含んでいて
もよく、アミン類、ポリアミ・ド等を硬化剤とするもの
など、従来より使用されているものが使用できる。ポリ
アミド闇脂としでも、ナイロン6.11.12.66な
ど従来より使用されているものが使用可能である。
The molded product to which the present invention is applied is a metal molded product for vehicles, and is particularly suitable for manufacturing outer panels and exterior parts of vehicle bodies where corrosion resistance is a problem. In addition, epoxy-based paints are mainly made of epoxy resin, and in addition to the epoxy resin alone, they may also contain other resin components such as phenol-fit, alicyclic, etc., and harden amines, polyamides, etc. Those conventionally used, such as those used as agents, can be used. As the polyamide dark resin, conventionally used materials such as nylon 6.11.12.66 can be used.

以上説明したきたように、この発明によれは、その構成
を、金属成形品にエポキシ系闇脂塗嘆を形成した後、ポ
リアミド樹脂の焼付臨度以上、250℃以下で焼付けを
行い、その後ポリアミド樹脂粉体を付着させ、焼付けを
行うようにしたため、ポリアミド樹脂の焼付けに際して
、エポキシ系樹脂は分解せず、気泡発生による外観の低
下は起こらないという効果が得られる。
As explained above, according to the present invention, after forming an epoxy dark fat coating on a metal molded product, baking is performed at a temperature higher than the baking temperature of the polyamide resin and lower than 250°C, and then the polyamide Since the resin powder is attached and baked, the epoxy resin does not decompose when the polyamide resin is baked, and there is no deterioration in appearance due to the generation of bubbles.

次にこの発明の実施例について説明する。Next, embodiments of this invention will be described.

実施例 鋼板製ガーニッシュに脱脂工程、水洗工程、リン酸亜鉛
化成皮膜処理工程、水洗工程、純水洗浄工程および乾燥
工程を施した後、エポキシ系樹脂塗料(関西ペイントK
K製ニレクロン9200、およヒ日本ペイントKK製パ
ワーコートU60)をカチオン電着塗装法により、20
μmの下塗り塗装皮膜を形成し、種々の温度で60分間
焼付けを行い、その後粒径80〜160μmのポリアミ
ド樹脂(ナイロン11)を静電塗装法により付着させ、
215℃で40分間焼付けを行って溶融、焼付皮膜を形
成し、自然乾燥させて完成品を得た。
Example After a steel plate garnish was subjected to a degreasing process, a water washing process, a zinc phosphate chemical conversion coating process, a water washing process, a pure water washing process and a drying process, an epoxy resin paint (Kansai Paint K
Nireclone 9200 (manufactured by K) and Powercoat U60 (manufactured by Nippon Paint KK) were coated with 20% by cationic electrodeposition coating method.
A µm primer coating film is formed, baked for 60 minutes at various temperatures, and then a polyamide resin (nylon 11) with a particle size of 80 to 160 µm is attached by electrostatic coating.
Baking was performed at 215° C. for 40 minutes to form a melted and baked film, which was then air-dried to obtain a finished product.

次表に下塗り塗膜の焼付温度ごとの完成品の外観を示す
。表中、×は完成品の表面に多数の発泡が生じ外観不良
、Oは完成品の表面が均質で発泡はなく外観良好、△は
両者の中間の外観を示す。
The following table shows the appearance of the finished product depending on the baking temperature of the undercoat film. In the table, × indicates that the surface of the finished product has a large number of bubbles and the appearance is poor, O indicates that the surface of the finished product is homogeneous and has no bubbles and has a good appearance, and Δ indicates that the appearance is intermediate between the two.

以上の結果より、下塗り塗膜の焼付温度はポリアミド樹
脂の焼付温度より高<、250℃以下が良いことがわか
る。
From the above results, it can be seen that the baking temperature of the undercoat film is preferably higher than the baking temperature of the polyamide resin and 250° C. or less.

代理人 弁理士 柳 原   成Agent: Patent attorney Sei Yanagi Hara

Claims (1)

【特許請求の範囲】 (1)金属成形品の表面にカチオン電1着塗装法により
エポキシ系樹脂塗膜を形成し、焼付けを行った後、塗膜
上にポリアミド樹脂粉体を付着させ、ポリアミドの溶融
温度以上の温度て焼付けを行う方法において、エポキシ
系樹脂の焼付けをポリアミド(資)脂の焼付温度以上2
50℃以下て行うことを特徴とする車両用金属成形品の
製造方法。 (2)  エポキシ系樹脂塗膜の焼伺昌度は225〜2
50℃である特許請求の範囲第1項記載の車両用金属成
形品の製造方法。 (6)  エポキシ系樹脂塗膜の焼付温度は2ろ0±5
℃である特許請求の範囲第1項記載の車両用金属成形品
の製造方法。 (4)  ポリアミド樹脂粉体の焼付温度は215±5
℃である特許請求の範囲第1項ないし第6項のいずれか
に記載の車両用金属成形品の製造方法。
[Claims] (1) An epoxy resin coating film is formed on the surface of a metal molded product by a cationic electrolyte coating method, and after baking, polyamide resin powder is attached on the coating film, and polyamide resin powder is attached on the coating film. In the method of baking the epoxy resin at a temperature higher than the melting temperature of polyamide resin,
A method for manufacturing a metal molded product for a vehicle, characterized in that the manufacturing method is carried out at a temperature of 50°C or lower. (2) The degree of burnout of the epoxy resin coating is 225 to 2.
The method for manufacturing a metal molded article for a vehicle according to claim 1, wherein the temperature is 50°C. (6) Baking temperature of epoxy resin coating is 200±5
The method for manufacturing a metal molded article for a vehicle according to claim 1, wherein the temperature is .degree. (4) Baking temperature of polyamide resin powder is 215±5
The method for manufacturing a metal molded article for a vehicle according to any one of claims 1 to 6, wherein the temperature is .degree.
JP4562283A 1983-03-18 1983-03-18 Manufacture of metal formed body for vehicle Granted JPS59169579A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4562283A JPS59169579A (en) 1983-03-18 1983-03-18 Manufacture of metal formed body for vehicle

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4562283A JPS59169579A (en) 1983-03-18 1983-03-18 Manufacture of metal formed body for vehicle

Publications (2)

Publication Number Publication Date
JPS59169579A true JPS59169579A (en) 1984-09-25
JPS6144550B2 JPS6144550B2 (en) 1986-10-03

Family

ID=12724468

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4562283A Granted JPS59169579A (en) 1983-03-18 1983-03-18 Manufacture of metal formed body for vehicle

Country Status (1)

Country Link
JP (1) JPS59169579A (en)

Also Published As

Publication number Publication date
JPS6144550B2 (en) 1986-10-03

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