JPS5916436B2 - Method of forming patterns on circuit boards - Google Patents
Method of forming patterns on circuit boardsInfo
- Publication number
- JPS5916436B2 JPS5916436B2 JP12470176A JP12470176A JPS5916436B2 JP S5916436 B2 JPS5916436 B2 JP S5916436B2 JP 12470176 A JP12470176 A JP 12470176A JP 12470176 A JP12470176 A JP 12470176A JP S5916436 B2 JPS5916436 B2 JP S5916436B2
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- circuit boards
- electroless plating
- substrate
- photopolymerizable resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】
本発明は回路基板のパターン形成方法に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for forming a pattern on a circuit board.
従来の回路基板のパターン形成方法は、ガラスエポキシ
樹脂等の表面に１８ミクロンもしくは３５ミクロン等の
厚みを有する銅箔を張つた、いわゆる銅張積層板をフォ
トエッチング法にて、不必要な銅箔部分を取り除き、必
要とする電気回路のパターンを形成していた。The conventional method for forming patterns on circuit boards is to remove unnecessary copper foil by photo-etching a so-called copper-clad laminate, in which copper foil with a thickness of 18 microns or 35 microns is pasted on the surface of glass epoxy resin, etc. The parts were removed to form the required electrical circuit pattern.
この方法はフォトエッチング工程でフォトレジスト塗布
、フォトマスクとのセット・露光・現像・乾燥という工
程を必要とするので、多くの加工時間を必要とし、その
ため回路基板の単価も非常に高くなつていた。また、別
の従来方法として、トランスファーモールド加工で回路
基板の外形を形成した後、表面をホーニングもしくはク
ロム混酸のような強酸化剤で表面を粗化した後、活性化
処理、無電解メッキ処理をし、フォトエッチング加工に
より回路パターンを形成する、いわゆるアジテイブ法が
ある。この方法は無電解メッキと基板の密着が悪く品質
上問題が多い。本発明は以上の欠点を除去するため、外
形を形成した基板に光重合性の樹脂を用いて、容易に多
量生産が可能な回路基板のパターン形成方法を提供する
ことを目的とする。This method requires a lot of processing time because the photo-etching process requires photoresist coating, setting with a photomask, exposure, development, and drying, and as a result, the unit price of the circuit board was extremely high. . Another conventional method is to form the outline of the circuit board by transfer molding, then roughen the surface by honing or using a strong oxidizing agent such as chromium mixed acid, and then perform activation treatment and electroless plating. However, there is a so-called agitative method in which a circuit pattern is formed by photo-etching. This method has many quality problems due to poor adhesion between the electroless plating and the substrate. In order to eliminate the above-mentioned drawbacks, it is an object of the present invention to provide a pattern forming method for a circuit board that can be easily mass-produced by using a photopolymerizable resin for a board having an outer shape formed thereon.
以下図面に基づいて本発明の一実施例を説明すｊ０る。An embodiment of the present invention will be described below based on the drawings.
第１図はトランスファーモールドもしくは射出成型法で
製作した基板１である。この基板１はガラスエポキシ等
でプレス抜きしたものでも良く、外形が加工されている
。この基板１の断面は第２図のイのようになる。この基
板１を第２図口のよに５うに治具２にセットし、エポキ
シ系光重合性樹脂中に浸漬する。これにより第２図ハの
ように表面全体が光重合性樹脂３に覆われる。光重合性
樹脂をホエラーで均一にしたり、またはロールコーター
で塗布すると表面が平滑となり、商品価値の高■０い回
路パターンを得ることができる。次に第３図に示すよう
な光学系を有する露光機で紫外線を照射する。FIG. 1 shows a substrate 1 manufactured by transfer molding or injection molding. This substrate 1 may be pressed out of glass epoxy or the like, and its outer shape is processed. The cross section of this substrate 1 is as shown in FIG. This substrate 1 is set on a jig 2 in the direction shown in FIG. 2, and immersed in an epoxy photopolymerizable resin. As a result, the entire surface is covered with the photopolymerizable resin 3 as shown in FIG. 2C. When the photopolymerizable resin is uniformly coated with a Whaler or coated with a roll coater, the surface becomes smooth and a circuit pattern with high commercial value can be obtained. Next, ultraviolet rays are irradiated using an exposure machine having an optical system as shown in FIG.
この露光機はレンズ系８と光源９の中間に必要なパター
ンを有するフォトマスク１０を置き、光学系を通して結
ばれたフォト２５マスクの画像部分に前記基板１をセッ
トし、露光して紫外線の当つたパターンを硬化させる。
この露光機は光重合性樹脂と接触する個所がないため光
重合性樹脂が装置に付着するようなことはない。露光後
、基板１の表面は第２図二のように硬化３０した部分４
と未硬化の部分５ができる。次にこれらの工程を終了し
た基板１をカーボン粉末もしくは銅粉末等の導電性物質
を浮遊させた雰囲気中に入れ、第２図ホのように未硬化
部分５にカーボンや銅等の粉末６を付着させる。このカ
ーボン粉末３５もしくは銅粉末は後工程の無電解メッキ
を成長させる核となるものならば、他の粉末を用いても
良い。次に乾燥機等の加熱できるところへ入れ、未Ｉフ
７一硬化部分の光重合性樹脂を硬化させる。This exposure machine places a photomask 10 with a necessary pattern between a lens system 8 and a light source 9, sets the substrate 1 on the image area of the photo mask 25 connected through the optical system, and exposes it to ultraviolet rays. Harden the ivy pattern.
Since this exposure machine has no parts that come into contact with the photopolymerizable resin, there is no possibility that the photopolymerizable resin will adhere to the apparatus. After exposure, the surface of the substrate 1 has a hardened portion 30 as shown in FIG.
An uncured portion 5 is formed. Next, the substrate 1 that has undergone these steps is placed in an atmosphere in which a conductive substance such as carbon powder or copper powder is suspended, and powder 6 of carbon, copper, etc. is applied to the uncured portion 5 as shown in FIG. Make it adhere. Other powders may be used as the carbon powder 35 or copper powder, as long as they serve as the core for growing electroless plating in the subsequent process. Next, it is placed in a place where it can be heated, such as a dryer, to harden the photopolymerizable resin in the uncured portions.
１２０℃１時間の加熱で十分硬化することができる。It can be sufficiently cured by heating at 120° C. for 1 hour.
加熱硬化することによつてカーボン粉末や銅粉末が光重
合性樹脂にバインドされ、次の無電解メツキによつてメ
ツキを形成する核となる。次に水の噴射や刷毛によりバ
インドされない部分のカーボン粉末や銅粉末等をきれい
に除去し、無電解メツキ浴に浸漬する。それにより第２
図へのようにメツキ膜７が析出する。無電解メツキは銅
またはニツケルで良好な結果が得られた。さらに金メツ
キ等のメツキを行い第４図のような基板上に電気の回路
を有するパターンの回路基板が完成する。？上のように
、本発明によれば、簡単な工程で回路のパターンを形成
でき、基板と形成したパターンとの密着も良く、安価で
良好な回路基板を量産することができる。By heating and curing, the carbon powder and copper powder are bound to the photopolymerizable resin and become the core that forms the plating in the next electroless plating. Next, carbon powder, copper powder, etc. from unbound areas are thoroughly removed by spraying water or using a brush, and the material is immersed in an electroless plating bath. Therefore, the second
A plating film 7 is deposited as shown in the figure. Electroless plating gave good results with copper or nickel. Further, plating such as gold plating is performed to complete a circuit board having a pattern having an electric circuit on the board as shown in FIG. ? As described above, according to the present invention, a circuit pattern can be formed in a simple process, the formed pattern has good adhesion to the substrate, and inexpensive and high-quality circuit boards can be mass-produced.
第１図は本発明の方法に使用する基板の平面図、第２図
は本発明の一実施例である加工工程を示す断面図、第３
図は本発明に使用する露光機の断面図、第４図は本発明
により製作された回路基板を示す平面図である。
１・・・・・・基板、２・・・・・・治具、３・・・・
・・光重合性樹脂、４・・・・・・硬化部分、５・・・
・・・未硬化部分、６・・・・・・粉末、７・・・・・
・メツキ膜、８・・・・・・レンズ系、９・・・・・・
光源、１０・・・・・・フオトマスク。FIG. 1 is a plan view of a substrate used in the method of the present invention, FIG. 2 is a sectional view showing a processing step according to an embodiment of the present invention, and FIG.
The figure is a sectional view of an exposure machine used in the present invention, and FIG. 4 is a plan view showing a circuit board manufactured according to the present invention. 1... Board, 2... Jig, 3...
...Photopolymerizable resin, 4...Cured part, 5...
...Uncured portion, 6...Powder, 7...
・Metal film, 8... Lens system, 9...
Light source, 10...Photomask.
Claims (1)
ーン外を紫外線により光重合型樹脂を硬化した後、無電
解メッキで成長の核となるような粉末を未硬化部分に付
着させ加熱硬化させた後、その上に無電解メッキを成長
させることを特徴とする回路基板のパターン形成方法。1 Apply a photomask with a predetermined pattern, harden the photopolymerizable resin outside the pattern with ultraviolet rays, and then apply electroless plating to attach powder that will become the growth nucleus to the unhardened parts and heat and harden it. A method for forming a pattern on a circuit board, characterized by growing electroless plating thereon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12470176A JPS5916436B2 (en) | 1976-10-18 | 1976-10-18 | Method of forming patterns on circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12470176A JPS5916436B2 (en) | 1976-10-18 | 1976-10-18 | Method of forming patterns on circuit boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5350471A JPS5350471A (en) | 1978-05-08 |
| JPS5916436B2 true JPS5916436B2 (en) | 1984-04-16 |
Family
ID=14891943
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12470176A Expired JPS5916436B2 (en) | 1976-10-18 | 1976-10-18 | Method of forming patterns on circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5916436B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4411980A (en) * | 1981-09-21 | 1983-10-25 | E. I. Du Pont De Nemours And Company | Process for the preparation of flexible circuits |
-
1976
- 1976-10-18 JP JP12470176A patent/JPS5916436B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5350471A (en) | 1978-05-08 |
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