JPS5916172U - Mounting structure of electronic components on insulated substrates - Google Patents
Mounting structure of electronic components on insulated substratesInfo
- Publication number
- JPS5916172U JPS5916172U JP11020182U JP11020182U JPS5916172U JP S5916172 U JPS5916172 U JP S5916172U JP 11020182 U JP11020182 U JP 11020182U JP 11020182 U JP11020182 U JP 11020182U JP S5916172 U JPS5916172 U JP S5916172U
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- electronic components
- mounting structure
- insulated substrates
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Details Of Resistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図及び第２図は従来の電子部品の取付外観説明図、
第３図は本考案の一実施例を示す説明図であり、第３図
イは、取付外観説明図、第３図口は絶縁基台の下面図、
第３図ハは絶縁基板上の取 ′付荷の配置を示す平面図
である。
１・・・・・・絶縁基台、１ａ・・・・・・突起、１ｂ
・・・・・・絶縁基台の下面、ＩＣ・・・・・・凹部、
２・・・・・・絶縁カバー、３・・・・・・端子、３ａ
・・・・・・膨出部、４・・・・・・中間端子、４ａ・
・・・・・屈曲部、４ｂ・・・・・・広幅部、５・・・
・・・軸部、６・・・・・・絶縁基板、５ａ、 ６ａ
工、６ａ２・・・・・・溝。Figures 1 and 2 are explanatory diagrams of the installation appearance of conventional electronic components;
FIG. 3 is an explanatory view showing one embodiment of the present invention, FIG. 3A is an explanatory view of the installation appearance, and FIG.
FIG. 3C is a plan view showing the arrangement of the mountings on the insulating substrate. 1...Insulating base, 1a...Protrusion, 1b
・・・・・・Bottom surface of insulation base, IC・・・・・・Recess,
2... Insulation cover, 3... Terminal, 3a
...Bulge, 4...Intermediate terminal, 4a.
...Bent part, 4b...Wide part, 5...
...Shaft portion, 6...Insulating substrate, 5a, 6a
Engineering, 6a2...groove.
Claims (1)
少くとも一方の端子には膨出部を、該端子と直交して配
置された他方の端子には屈曲部を形成し、一方の端子は
絶縁基板に予め設けた前記膨出部を遊嵌する溝に、他方
の端子は、前記屈曲部の屈曲高さより狭幅の溝にそれぞ
れ挿通して取付けたことを特徴とする電子部品の絶縁基
板への取付構造。Forming a bulge in at least one of the plurality of terminals implanted in the insulating base of the electronic component, and forming a bent part in the other terminal disposed orthogonally to the terminal, An electronic device characterized in that one terminal is inserted and attached to a groove provided in advance on an insulating substrate into which the bulged portion is loosely fitted, and the other terminal is inserted and attached to a groove narrower than the bending height of the bending portion. A structure for mounting components on an insulating board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11020182U JPS5916172U (en) | 1982-07-22 | 1982-07-22 | Mounting structure of electronic components on insulated substrates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11020182U JPS5916172U (en) | 1982-07-22 | 1982-07-22 | Mounting structure of electronic components on insulated substrates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5916172U true JPS5916172U (en) | 1984-01-31 |
Family
ID=30256392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11020182U Pending JPS5916172U (en) | 1982-07-22 | 1982-07-22 | Mounting structure of electronic components on insulated substrates |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5916172U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6420473U (en) * | 1987-07-27 | 1989-02-01 |
-
1982
- 1982-07-22 JP JP11020182U patent/JPS5916172U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6420473U (en) * | 1987-07-27 | 1989-02-01 |
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