JPS59159287A - Laser working device - Google Patents

Laser working device

Info

Publication number
JPS59159287A
JPS59159287A JP58030834A JP3083483A JPS59159287A JP S59159287 A JPS59159287 A JP S59159287A JP 58030834 A JP58030834 A JP 58030834A JP 3083483 A JP3083483 A JP 3083483A JP S59159287 A JPS59159287 A JP S59159287A
Authority
JP
Japan
Prior art keywords
lens
laser
condenser lens
optical path
condenser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58030834A
Other languages
Japanese (ja)
Inventor
Shuichi Ishida
修一 石田
Susumu Yahagi
進 矢作
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP58030834A priority Critical patent/JPS59159287A/en
Publication of JPS59159287A publication Critical patent/JPS59159287A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam

Abstract

PURPOSE:To decrease generation of splashes and to perform adequate laser working with deep penetration by disposing two pieces of condenser lenses on the optical path for laser light, and irradiating the condensing spot on a work. CONSTITUTION:The 1st condenser lens 10 is disposed on a laser oscillator 11 side on the optical path of laser light L which is released from a laser oscillator 11 and is advanced perpendicularly by a reflection mirror 12. The 2nd condenser lens 13 is disposed on the work 14 side coaxially with the lens 10 apart at a specified distance therefrom. Since the light L is once condensed by the lens 10, the incident angle on the surface of the lens 13 increases and an aberration is much larger than in the prior art. The preferable weld zone having a small dent with respect to the deep penetration is thus obtd.

Description

【発明の詳細な説明】 〔発明の技術分野〕 本発明はレーザ加工装置に関する。[Detailed description of the invention] [Technical field of invention] The present invention relates to a laser processing device.

〔発明の技術的背景とその問題点〕[Technical background of the invention and its problems]

一般にレーザ光により溶接、切断、穴あけ等の加工全行
う場合、第1図に示すようにレーザ発揚器(図示せず)
から放出されたレーザ光(L)の光路に集光レンズ(1
)を設け、被加工物(2)上に集光スポットを照射する
ようにしている。
Generally, when all processing such as welding, cutting, and drilling is performed using laser light, a laser projector (not shown) is used as shown in Figure 1.
A condenser lens (1
) is provided to irradiate a focused spot onto the workpiece (2).

ところで、上記従来装置によりて溶接加工を行    
□った場合、焦点位置およびその前後の外し量(J−)
と第2.図に示す療接加工後の溶瞬部(3)凹みの深さ
くDs)。
By the way, the welding process is not performed using the above conventional equipment.
□If the focus position and the amount of removal before and after it (J-)
and second. Depth of dent (Ds) of welded part (3) after therapeutic welding shown in the figure.

溶け、込み深、さくDJlや間係は第3図に示すように
なる。すなわち1.横軸に←>、、、←)方向の焦点外
し量(→。
The melting, penetration depth, drilling DJl, and spacing are as shown in Figure 3. That is, 1. The horizontal axis indicates the defocus amount (→) in the ←>, , ←) direction.

縦軸に上記両深さくDl)、(D2)をとりた第3図か
ら明らかなように、溶は込み深さくD2)が3mm(Q
とき凹みの深さくり、)は約↓、3m程度とな2す、、
、溶接には適さな、くなる。したがって、従来では、溶
は込み、深さく込)の増、加に伴ないスプラッシュの発
生が著しかつ、だ。
As is clear from Fig. 3, where the vertical axis shows both depths Dl) and (D2), the melt penetration depth D2) is 3 mm (Q
The depth of the recess is approximately ↓, approximately 3m.
, it becomes unsuitable for welding. Therefore, in the past, as the melt penetration and depth increased, the occurrence of splash was significant.

、〔発明、?目的)        ’  、、・スプ
ラッシュの発生を軽減し、溶は込み深さの深い好適々レ
ーザ加工の行える装置を提供すること、にある。   
              。
,〔invention,? Purpose) The purpose is to provide an apparatus that can reduce the occurrence of splash and suitably perform laser processing with a deep weld penetration depth.
.

〔、発、明9概、要、〕、、、。[,Invention,Invention 9,Summary,Summary],,,.

し、−ザ発振、器から放出肯れるレーザ光、の光路上、
、に、2.枚の集光しンズを配設して被加工物上に集光
スポットを照射せしめる。よう、に擲、成したもので:
ある。、、、、、。
-The optical path of the laser oscillation, the laser light emitted from the vessel,
, 2. A plurality of condensing lenses are arranged to irradiate a condensed spot onto the workpiece. This is what I accomplished:
be. ,,,,,.

〔発明、の実施、例〕[Invention, implementation, example]

発明者等は第4図に示すように集光レンズを透過した集
光ビームの被加工物(2)表面におけるパワー密度分布
と、加工特性を検討した結果、パワー密層分布における
ピーク値が同じならば、すその広い分布のスポット(4
)の万がすその狭い分布のスポット(5)よりもスズラ
ッシュの発生が少ないことを見出した。さらに、すその
広い分布を得るだめの手段として、集光光学系における
収゛差を大きくすることが有効であることも見出した。
As shown in Figure 4, the inventors investigated the power density distribution on the surface of the workpiece (2) of the condensed beam transmitted through the condensing lens and the machining characteristics, and found that the peak values in the power dense layer distribution were the same. Then, the spots with a wide distribution at the base (4
) was found to produce less tin rush than spot (5) with a narrow distribution. Furthermore, we have found that increasing the aberration difference in the condensing optical system is effective as a means to obtain a wide distribution of tails.

上記の背景のもとに、本発明をその一実施例である第5
図に基いて説明する。10)はレーザ発振器αDより放
出され反射鏡(121を介して垂直方向に進むレーザ光
(L)の光路上においてレーザ発振器αυ側に配設され
る第1の集光レンズである。(13)は被加工物I側に
なり第1の集光レンズ(10)と一定距離保って同軸に
配設される第2の集光レンズである。
Based on the above background, the fifth embodiment of the present invention has been developed.
This will be explained based on the diagram. 10) is a first condenser lens disposed on the laser oscillator αυ side on the optical path of the laser beam (L) emitted from the laser oscillator αD and traveling in the vertical direction via the reflecting mirror (121). (13) is a second condenser lens located on the side of the workpiece I and disposed coaxially with the first condenser lens (10) at a constant distance.

ところで、第5図において第1の集光レンズ00)の集
光点から第2の集光レンズ(13)の軸中心までの距離
をa、この軸中心から第2の集光レンズ(13)までの
距離(b)とし、第2の集光レンズ(13)の焦点距離
を(f)とすると、 1/a +17t) = 1/f
 (7)関係になる。ここで第1の集光レンズ(10)
のスボント径を(dI)、第2の集光レンズ(1□□□
の集光スポット径を(d2)とすると、d2−bxdI
/a、すなわちd、=fXd、/afの関係となり、第
2の集光レンズ(13)で集光するためには距離(a)
は第2の集光レンズ(ljの焦点距離fよシ長くしなけ
ればならなくなる。したがって、第1の集光レンズ00
)により集光したレーザ光(L)の第1の集光レンズの
焦点位置における像を第2の集光レンズ03)で結像さ
せて集光するように両レンズ10) 、 u3)は配置
される。
By the way, in FIG. 5, the distance from the condensing point of the first condensing lens 00) to the axial center of the second condensing lens (13) is a, and from this axial center to the second condensing lens (13) (b) and the focal length of the second condensing lens (13) is (f), then 1/a + 17t) = 1/f
(7) Be in a relationship. Here, the first condensing lens (10)
The diameter of the spont is (dI), and the diameter of the second condenser lens (1□□□
If the focused spot diameter of is (d2), then d2-bxdI
/a, that is, d, = fXd, /af, and in order to condense the light with the second condensing lens (13), the distance (a)
must be longer than the focal length f of the second condenser lens (lj. Therefore, the first condenser lens 00
Both lenses 10) and u3) are arranged so that the image of the laser beam (L) focused by ) at the focal position of the first focusing lens is formed and focused by the second focusing lens 03). be done.

上記の構成によシ、レーザ光(L)は第1の集光レンズ
(10)でいったん集光されているだめ、第2の集光レ
ンズ([3)の表面における入射角は大きくなシ、その
結果、収差は従来に比べて極めて大きなものとなる。ま
た、本構成による溶接結果を上記従来技術による結果を
示した第3図と同様に示してみると第6図のようになる
。この図からくぼみの深さくa)は従来に比べて格段に
小さくなっておシ、スプラッシュの発生が大幅に軽減さ
れていることが分る。
According to the above configuration, since the laser beam (L) is once condensed by the first condenser lens (10), the incident angle on the surface of the second condenser lens ([3) is small. As a result, the aberration becomes extremely large compared to the conventional one. Furthermore, when the welding results according to this configuration are shown in the same way as FIG. 3 showing the results according to the above-mentioned prior art, the result is shown in FIG. 6. From this figure, it can be seen that the depth of the recess (a) is much smaller than in the past, and the occurrence of splashes is greatly reduced.

〔発明の効果〕〔Effect of the invention〕

以上詳述したように2枚の集光レンズをレーザ光路上に
配置した簡単な構成により、例えば溶接加工では溶は込
みの深い割にくぼみの小さい好ましい溶接部を得られる
ことができた。このことは許容するくぽみの深さを基準
にすると、従来に比べてエネルギを小にして深い溶は込
みを得ることが可能である。したがって、エネルギを無
理に大きくする必要がなくなることから、パルスYAG
レーザの場合では励起ランプの寿命が長くなるという効
果も得られる。
As described in detail above, by using a simple configuration in which two condensing lenses are arranged on the laser optical path, it is possible to obtain a preferable welded part with a small depression in spite of the deep welding process, for example, in welding processing. Based on the allowable depth of the depression, this means that it is possible to obtain deep weld penetration with less energy than in the past. Therefore, since there is no need to forcefully increase the energy, pulse YAG
In the case of a laser, the effect of lengthening the life of the excitation lamp can also be obtained.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来例を示す構成図、第2図は溶接部の状態を
示す断面図、第3図は従来装置で溶接加工に実施した場
合の溶接部におけるくほみおよび溶は込み両深さと焦点
外し食との関係を示した図、第4図は本発明の詳細な説
明するためのエネルギ密度の分布図、第5図は本発明の
一実施例を示す構成図、第6図は本発明を溶接加工に実
施した場合の溶接部におけるくほみおよび溶は込み両深
さと焦点外し量との関係を示した図である。 00・・・第1の集光レンズ Uυ・・・レーザ発振器 Uり・・・反射鏡 θ(支)・・・第2の集光レンズ 代理人 弁理士  則 近 憲 佑 (ほか1名)
Figure 1 is a configuration diagram showing a conventional example, Figure 2 is a sectional view showing the state of a welded part, and Figure 3 is a welded part when welding is carried out using conventional equipment. FIG. 4 is an energy density distribution diagram for explaining the present invention in detail, FIG. 5 is a configuration diagram showing an embodiment of the present invention, and FIG. 6 is a diagram showing the relationship between FIG. 3 is a diagram showing the relationship between the depths of both the depth of the weld and the depth of the weld and the amount of defocus when the present invention is applied to welding. 00...First condensing lens Uυ...Laser oscillator Uri...Reflector θ (support)...Second condensing lens Agent Patent attorney Noriyuki Chika (and one other person)

Claims (2)

【特許請求の範囲】[Claims] (1)レーザ発揚器と、このレーザ発勢器から放出され
るレーザ光を集光する第1の集光レンズと、この第1の
集光レンズ今通過しだレー、ザ光を集光する第2の集光
レンズを備えることを特徴とするレーザ加工装置。
(1) A laser emitter, a first condenser lens that condenses the laser beam emitted from the laser emitter, and a first condenser lens that condenses the laser beam that has just passed through the first condenser lens. A laser processing device comprising a second condensing lens.
(2)第2の集光レンズは第1の集光レンズの焦点位置
より後方に配置されることを特徴とする特許請求の範囲
第1項記載のレーザ加工装置。
(2) The laser processing apparatus according to claim 1, wherein the second condenser lens is arranged behind the focal point position of the first condenser lens.
JP58030834A 1983-02-28 1983-02-28 Laser working device Pending JPS59159287A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58030834A JPS59159287A (en) 1983-02-28 1983-02-28 Laser working device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58030834A JPS59159287A (en) 1983-02-28 1983-02-28 Laser working device

Publications (1)

Publication Number Publication Date
JPS59159287A true JPS59159287A (en) 1984-09-08

Family

ID=12314723

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58030834A Pending JPS59159287A (en) 1983-02-28 1983-02-28 Laser working device

Country Status (1)

Country Link
JP (1) JPS59159287A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101036878B1 (en) 2008-08-27 2011-05-25 주식회사 이오테크닉스 Drilling apparatus and drilling method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101036878B1 (en) 2008-08-27 2011-05-25 주식회사 이오테크닉스 Drilling apparatus and drilling method

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