JPS59157765U - ultrasonic soldering equipment - Google Patents
ultrasonic soldering equipmentInfo
- Publication number
- JPS59157765U JPS59157765U JP4968283U JP4968283U JPS59157765U JP S59157765 U JPS59157765 U JP S59157765U JP 4968283 U JP4968283 U JP 4968283U JP 4968283 U JP4968283 U JP 4968283U JP S59157765 U JPS59157765 U JP S59157765U
- Authority
- JP
- Japan
- Prior art keywords
- ultrasonic soldering
- soldering equipment
- molten solder
- solder
- buried
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Molten Solder (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の超音波はんだ付は装置の断面図、第２図
は本考案−実施例の超音波はんだ付は装置に用いられる
振動板及び振動モードの図、第３図は本考案の超音波は
んだ付は装置の断面図、第４図は他の実施例の要部を示
す図である。
１：振動子、２，３：ホーン、５：はんだ槽、７：ヒー
タ、１０：振動板、１１：突出体、Ｗ：管材。Figure 1 is a cross-sectional view of a conventional ultrasonic soldering device, Figure 2 is a diagram of the diaphragm and vibration mode used in the device for ultrasonic soldering according to the present invention, and Figure 3 is a diagram of the vibration mode used in the device. The ultrasonic soldering is a sectional view of the device, and FIG. 4 is a diagram showing the main parts of another embodiment. 1: Vibrator, 2, 3: Horn, 5: Solder bath, 7: Heater, 10: Vibration plate, 11: Projection, W: Tube material.
Claims (1)
に設置された振動子およびこの振動子に取り付けられた
ホーンからなる超音波発振装置と、上記超音波発振装置
のホーンに取り付けられ、上記はんだ槽より高い位置に
ある部位をわん曲して形成し先端部を溶融はんだ中に埋
設する如く配置された振動板と、上記溶融はんだ中に埋
設された振動板に設けられた突出体とを有することを特
徴とする超音波はんだ付は装置。An ultrasonic oscillator consisting of a solder bath for storing molten solder, a vibrator installed outside the solder bath, and a horn attached to the vibrator; The vibrating plate has a curved portion located at a higher position than the tank and is arranged so that its tip is buried in the molten solder, and a protruding body provided on the vibrating plate buried in the molten solder. An ultrasonic soldering device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4968283U JPS59157765U (en) | 1983-04-05 | 1983-04-05 | ultrasonic soldering equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4968283U JPS59157765U (en) | 1983-04-05 | 1983-04-05 | ultrasonic soldering equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59157765U true JPS59157765U (en) | 1984-10-23 |
Family
ID=30180179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4968283U Pending JPS59157765U (en) | 1983-04-05 | 1983-04-05 | ultrasonic soldering equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59157765U (en) |
-
1983
- 1983-04-05 JP JP4968283U patent/JPS59157765U/en active Pending
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