JPS59151782A - Method of fixing round hollow terminal - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] Industrial Application Field The present invention is a method for fixing a round hollow terminal used when a round hollow terminal for connection to a connector must be provided on the copper foil side of a printed circuit board. It is related to.

Conventional configuration and its problems Normally, when connecting a connector for communicating with electrical equipment, etc. to a printed circuit board, the connector is placed on the component side of the printed circuit board (hereinafter simply referred to as P board) 1, as shown in Figure 1. A connector is attached to a round hollow terminal (hereinafter simply referred to as a terminal) 2. At this time, as shown in FIG. 2, the tip of the terminal 2 is fixed on the copper foil land 3 side of the P plate 1 with caulking and solder 4. 6 is an electronic component such as a fixed resistor.

When the terminal 2 is placed on the component side in this way, it can be fixed by caulking on the copper foil land 3 side of the P board 1 and using normal soldering.

However, depending on the installation location of electrical equipment etc. connected to the connector, it may be necessary to erect the terminals 2 on the copper foil land 3 side of the P board 1. FIG. 3 shows a conventional terminal fixing structure in that case. That is, one terminal 2
After inserting the lead terminal 5a of the electronic component 6 from the copper foil land 3 side and caulking the tip of the terminal 2 on the component side, insert the lead terminal 5a of the electronic component 6 into the terminal 2.
The terminal 2 is fixed by connecting with the caulked portion and the solder 6.

In this conventional example, the terminal 2 is caulked to the P plate 1 in advance, and is generally fixed so as not to wobble. However, due to the difference in thermal expansion coefficient between the P board 1 and the terminal 2 due to soldering, looseness will occur between the P board 1 and the terminal 2, which may cause damage to the connected electronic component 6 or damage to the terminal 2. There was a risk of connector insertion failure due to distortion.

The structures shown in FIGS. 4 and 6 are conceivable as means for eliminating such looseness of the terminal 2. In FIG. 4, a copper foil land 7 is also provided on the component side of the P board 1, and the caulked portion of one terminal 2 is fixed to the copper foil land 7 portion with solder 6. In FIG. 6, after the caulking portion of the terminal 2 and the glued terminal f)a of the electronic component 6 are connected by the solder 6, the connection portion is reinforced with an adhesive 8. However, in the method shown in FIG. 4, it is necessary to make the P board 1 a substrate with conductive lands 3 and 7 on both sides, and in the method shown in FIG. However, it also had the disadvantage of an unavoidable increase in cost.

Purpose of the Invention The present invention was devised in view of the above-mentioned points, and it is an object of the present invention to eliminate wobbling of the terminal when the terminal is placed on the copper foil land side of the P board, and to achieve this without increasing costs. The purpose of this invention is to provide a method for fixing terminals that enables the following.

Structure of the Invention In order to achieve this object, the terminal fixing method of the present invention involves providing a copper foil land on the same side as other copper foil lands around a hole in a P board into which a terminal is to be inserted; After applying a preliminary coat to the copper foil land.

Insert the above terminal from the copper foil land side and caulk its tip on the opposite side. Apply heat from the caulked part to melt the 7mm solder on the copper foil land surface, and then connect the terminal and the copper foil of the P plate. The land portion is firmly fixed to the land portion. According to this configuration, the terminal and the P plate can be firmly fixed by soldering, and the wobbling of the terminal can be prevented. Therefore, it is possible to prevent insertion failure of the connector attached to the terminal. I can do it. Further, since the copper foil land for fixing the terminal is placed on the same surface as the other copper foil lands, and the number of man-hours required is almost the same as in the past, it is possible to prevent the terminal from wobbling without increasing costs.

DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 6 to 9, with the same numbers assigned to the same parts as above.

First, as shown in FIG. 6, a new copper foil land 9 is provided on the P plate 1 around the hole into which the terminal 2 is to be inserted so as to be on the same side as the copper foil land 3.

The copper foil lands 9 are provided around holes corresponding to the number of terminals of the connector, and of course the copper foil lands 3.9 are usually formed in the same process. Then, a preliminary/interchanger 10 is applied on the copper foil land 9 as shown in FIG. At this time, the electronic component 6 is attached to the side opposite to the copper foil land 3°9 of the P plate 1 by fixing one of the lead terminals 6a with the solder 4, but the above-mentioned spare /
Hender 1o is applied at the same time. A preliminary solder 10 may be applied on the copper foil land e in a separate process from the 4 parts of the mold, but at the same time as the 7% red dip for mounting the electronic component 6 as shown in Fig. 7. It is more efficient to provide one. Next, the terminal 2 is inserted into the hole of the P plate 1 from the side of the copper foil land 9, and the tip of the terminal 2 protruding from the component side is caulked as shown in FIG.

Temporarily fix the terminal 2 to the P plate 1. Next, insert the other lead terminal 5a of the electronic component 6 into the caulked part of the terminal 2, and
As shown in the figure, connect between terminal 2 and lead terminal 5a...
This is done by the printer 11. At this time, the preliminary solder 1o is indirectly melted by heat conduction of the terminal 2, and the copper foil land 9 and the terminal 2 are fixed by the melted preliminary solder 1o.

therefore.

Terminal 2 can be connected to P without wobbling due to its 7-nder connection.
It will be fixed to plate 1. At this time, without soldering the lead terminal 52L of the electronic component 6 to the terminal 2, heat is applied from the caulked part of the terminal 2 to melt the preliminary solder 1o on the surface of the copper foil land 9 and connect the terminal 2 to the P board 1. It may be fixed to .

As shown in FIGS. 10A and 10H, by providing one or more cut portions in the copper foil land 9 of the P plate 1, it is possible to prevent the hole into which the terminal 2 is inserted from being blocked by the solder 1o. The amount of solder 10 attached to the surface of the copper foil land 9 can be made uniform. The same effect can be obtained by cutting the copper foil land 9 by separating it using a ruler resist.

Effects of the Invention The terminal fixing method according to the present invention is configured as described above, and has the following effects. First, one terminal and the P board can be firmly fixed by soldering, and wobbling of the terminal can be prevented. Therefore, it is possible to prevent insertion failure of the connector attached to the terminal. In addition, the copper foil land for fixing the terminal is placed on the same surface as other copper foil lands, and the number of man-hours required is almost the same as before, so terminal wobbling can be prevented without increasing costs. . Then, by making one or more cuts in the copper foil land provided around the hole where the terminal is to be inserted... When performing preliminary soldering by soldering,
It is possible to prevent the terminal insertion hole from being blocked by solder, and to even out the amount of solder on the land surface, which makes it easier to insert the terminal and prevents the terminal from being crimped due to variations in the amount of solder. The slope can be reduced. Therefore, it is possible to prevent connector insertion failures due to the inclination of one terminal. moreover.

By directly soldering the lead terminal of the electronic component placed on the component side of the P board to the caulked part of the terminal, the heat of the time melts the preliminary solder on the copper foil land surface and the terminal is attached to the P board. It can be soldered to the plate, reducing the number of man-hours and eliminating the need to separately provide lead terminal connection holes for electronic components on the P plate, thereby saving LPa space.

[Brief explanation of drawings]

Fig. 1 is a perspective view showing the terminal fixed to the component side of the P plate in the conventional example, Fig. 2 is a cross-sectional view of the same, and Fig. 3 is the same (terminal fixed to the copper foil land side of the P plate in the conventional example). 4 and 6 are respectively sectional views showing the conventional improvement plan of FIG. 3, and FIG. 6 is a perspective view of the P plate for explaining the fixing method of the present invention. Figures 7 to 9 are cross-sectional views showing the terminal fixing state in the process order of the method of the present invention;
Figures A and B are bottom views of P plates showing other embodiments of the method of the present invention. 1... Printed circuit board, 2... Original hollow terminal, 3... Other copper foil land, 5...
Electronic components - 5a...Lead terminal, 9...
・Copper foil land, 10. Old... Spare solder, 11. River...
Solder. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
figure? Figure 2 Figure 3 Figure 6 Figure 7 Figure 9 Figure 10

Claims (3)

[Claims] (1) Place a copper foil land on the same side as other copper foil lands around the hole of the printed circuit board into which the round hollow terminal is to be inserted, and after pre-soldering the copper foil land, Insert the hollow terminal from the copper foil land side and swage its tip to the opposite side, apply heat from the swaged portion to melt the solder on the copper foil land side, and connect the round hollow terminal to the printed circuit board. A method for fixing a round hollow terminal, which is characterized by firmly fixing the copper foil land part. (2) A method for fixing a round hollow terminal according to claim 1, wherein the copper foil land is cut at one or more places. (3) A method for fixing a round hollow terminal according to claim 1, wherein a lead terminal of an electronic component is directly connected to the caulked portion of the round hollow terminal by soldering.