JPS59148357A - Package of integrated circuit - Google Patents

Abstract

PURPOSE:To unnecessitate the light shielding of an element unfavorable to light irradiation by providing an element containing recess which opens in the surface on the side of the direction to which lead terminal tips extend. CONSTITUTION:The element containing recess 5 opens in the package surface 10 vertical to the direction of the tip of the lead terminals 2 extending by rectangular bending from the side surface of the titled package 3. When these packages 3 are loaded on e.g, a socket 11 on a printed substrate 1 so that the side of the lead terminal tip becomes opposed to said substrate, light shielding can be attained as the result of the hiding of the element containing aperture 5 and the contained semiconductor element 6. For example, if the element contained in the package aperture is a memory element, the package is removed from the socket 11 in the case of the necessity to erase the memory, thus exposing the element surface 10, which is then irradiated with ultraviolet rays. Thereby, the erasure is easily enabled.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an IC package having a recess for accommodating an element operated by light irradiation, such as a light receiving element or a memory element.

When such an IC package is attached to a printed circuit board l using lead terminals 2 as shown in FIG.
An element accommodating part 5 is opened in the upper surface 4 of the package 3 on the opposite side, and a semiconductor element, for example, a memory element 6 is housed inside the element accommodating part 5.

If you want to erase the memory of memory element 6 in this state,
For example, ultraviolet light 7 is irradiated from above the package 3. However, if multiple IC packages containing such semiconductor elements housed in recesses with openings on the top are mounted on a single printed circuit board, there may be problems with the memory of the elements whose memory you do not want to erase, or with characteristics such as leakage current caused by light irradiation. For IC packages containing elements whose fluctuations should be avoided, the opening must be shielded from light, which requires a considerable amount of man-hours in the case of large-area printed circuit boards, and it is expensive to apply a beam of light only to the desired elements. It takes.

The present invention eliminates the above-mentioned drawbacks and provides an I
The purpose is to provide a C package.

This objective is achieved by the IC package having a recess for accommodating an element that opens on the side surface in the direction in which the tips of the lead terminals extend.

Embodiments of the present invention will be described below with reference to the drawings. In FIG. 2, a lead terminal 9 is drawn out perpendicularly from the opening surface 8 of the recess 5 for accommodating the element 6 of the IC package 3, and in FIG. An element housing recess 5 is opened in the package surface 10 perpendicular to the direction of the tip of the terminal 2.

When these packages 3 are mounted on, for example, a socket 11 on a printed circuit board l so that the leading end of the lead terminal faces the printed circuit board as shown in FIG. As a result, shading is achieved. For example, if the element housed in the package opening is a memory element, if the memory needs to be erased, the package can be removed from the socket 11, the element surface 10 exposed and irradiated with ultraviolet light. easily possible. The opening of the element housing recess 5 may be hermetically closed, for example, with a quartz glass plate that transmits ultraviolet rays. Also, if you want to irradiate light while mounted on a printed circuit board mounted on an element housed in a specific IC package, make a hole in the part of the circuit board facing the housing part 5 of the package 3 or in the socket if necessary. In other words, it is possible to irradiate light without impairing the light shielding effect on other packages.

As described above, the present invention opens the element storage recess of the IC package on the surface facing the substrate after mounting.
As a result, light shielding can be easily achieved when mounted on a board, and if it is mounted in a socket on a board, it can be easily removed from the board as necessary to expose the opening surface and irradiate light. Furthermore, by providing a light entrance hole in the substrate, it is possible to irradiate light with the same package, so the range of use is wide, and the effects obtained by the present invention are extremely large.

[Brief explanation of drawings]

FIG. 1 is a partially exploded front view of a conventional example of an IC package having a recess for storing an element, FIG. 2 is a partially exploded front view of an embodiment of the present invention, and FIG. 3 is a partially exploded front view of another embodiment. FIG. 4 is a front view showing an example of the mounted state of the IC package shown in FIG. 3. 2.9... Lead terminal, 3... IC package, 5
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Claims (1)

[Claims] 1) An IC package characterized by having a recess for storing an element that opens on the side in the direction in which the tip of the IJ-do terminal extends.