JPS59145774A - Continuous hot dipping method - Google Patents
Continuous hot dipping methodInfo
- Publication number
- JPS59145774A JPS59145774A JP58020370A JP2037083A JPS59145774A JP S59145774 A JPS59145774 A JP S59145774A JP 58020370 A JP58020370 A JP 58020370A JP 2037083 A JP2037083 A JP 2037083A JP S59145774 A JPS59145774 A JP S59145774A
- Authority
- JP
- Japan
- Prior art keywords
- salt
- furnace
- molten
- bath
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007598 dipping method Methods 0.000 title abstract 2
- 229910052751 metal Inorganic materials 0.000 claims abstract description 67
- 239000002184 metal Substances 0.000 claims abstract description 67
- 150000003839 salts Chemical class 0.000 claims abstract description 49
- 238000007747 plating Methods 0.000 claims abstract description 39
- 230000000630 rising effect Effects 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 21
- 230000001590 oxidative effect Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 229910001335 Galvanized steel Inorganic materials 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000008397 galvanized steel Substances 0.000 description 1
- -1 halide salt Chemical class 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/14—Removing excess of molten coatings; Controlling or regulating the coating thickness
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Coating With Molten Metal (AREA)
Abstract
Description
【発明の詳細な説明】
この発明は、金属帯表面に付着した溶融メッキ金属の払
拭効果の向上が図れる連続溶融メッキ方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a continuous hot-dip plating method that can improve the effect of wiping away hot-dip plated metal adhering to the surface of a metal strip.
一般に連続溶融メッキにおいて金属帯への溶融メッキ金
属の付着量制御方法として、ロール絞りによる方法とガ
スワイピングによる方法が知られている。ロール絞りに
よる方法は、金属帯両表面に対向設置した2個の溝付き
ロールで金属帯に付着した溶融金属を絞り落す方法であ
るが、下記の問題点があった。すなわち、
■ 制御要因が多く且つ複雑で要因把握がむつかしく、
自動制御ができない、
■ メッキ付着量分布の均一性が悪く、規格に合格する
ためには必要以上の溶融金属を付けざるを得ない、
■ コーディングロールの寿命が短く頻繁なロール替え
を必要とする、
■ フィンヌピードの上限が60〜80m/minであ
り、高速運転ができない、
■ 溶融金属付着量の薄目付化は50〜80 ?/rr
l(片面)が限界である、
■ コーティングロールの溝が金属帯表面にプリントさ
れ筋目状の模様となり表面品質を低下させる、
これらのことがらを−挙に解決する手段としてガスワイ
ピング方法が開発された。ガスワイピング方法は、メッ
キ浴表面から所定高さ位置に、金属帯の両表面に対向設
置した2個のノズルから高圧ガスを鋼板表面に吹きつけ
ガスジェットナイフで金属帯表面に付着した溶融金属を
絞りとる方法である。しかし、この方法にも下記の問題
点があった。すなわち、
■ 金属帯の通板速度上昇と共にメッキ浴から金属帯に
付着して持ち上る溶融金属の持ち上り量が著しく増加す
る。In general, methods using roll squeezing and gas wiping are known as methods for controlling the amount of hot-dip plated metal deposited on a metal strip in continuous hot-dip plating. The roll squeezing method is a method in which the molten metal adhering to the metal strip is squeezed out using two grooved rolls placed opposite to each other on both surfaces of the metal strip, but it has the following problems. In other words, ■ There are many and complex control factors, and it is difficult to understand the factors.
Automatic control is not possible, ■ The uniformity of the plating coating distribution is poor, and it is necessary to apply more molten metal than necessary in order to pass the standards. ■ The life of the coding roll is short, requiring frequent roll changes. , ■ The upper limit of Finnupede is 60 to 80 m/min, and high-speed operation is not possible. ■ Is it possible to reduce the weight of molten metal to 50 to 80 m/min? /rr
The gas wiping method was developed as a means to solve all of these problems. Ta. The gas wiping method involves blowing high-pressure gas onto the surface of the steel plate from two nozzles placed opposite each other on both surfaces of the metal strip at a predetermined height from the surface of the plating bath, and using a gas jet knife to wipe away the molten metal that has adhered to the surface of the metal strip. This is a method of narrowing it down. However, this method also had the following problems. Namely, (1) As the passing speed of the metal strip increases, the amount of molten metal that adheres to the metal strip and lifts up from the plating bath increases significantly.
■ 溶融金属持ち上り量の増加に対応してワイピングガ
ス圧の増大とともに猛烈に溶融金属のスプツッシュが発
生する。これが金属帯表面に付着し、品質低下をもたら
すと共にノズルを局部的に閉塞しメッキ作業を不能にす
る。又、これら噴霧状溶融金属は再びメッキ浴中に溶解
せずメッキ機周辺に堆積し、作業性を損うのみならず、
溶融金属原単位の著しい悪化をもたらす。■ In response to an increase in the amount of molten metal lifted, the wiping gas pressure increases and a violent splash of molten metal occurs. This adheres to the surface of the metal strip, causing quality deterioration and locally blocking the nozzle, making plating operations impossible. In addition, these atomized molten metals do not dissolve in the plating bath again and accumulate around the plating machine, which not only impairs work efficiency, but also
This results in a significant deterioration of the molten metal consumption rate.
■ ワイピングガス圧の増大に伴いノズルから発生ずる
騒音はますます大となり、作業環境が悪化する。■ As the wiping gas pressure increases, the noise generated from the nozzle becomes louder and the working environment worsens.
■ 厚目付高製造時(金属帯表面の溶融メッキ金属付着
量の多い物を製造する時)m板エッヂ部でエッヂオーバ
ーコートが著しくなり、溶融金属の歩留低下、平坦不良
(耳のび発生)をもたらす。■ When manufacturing thick sheets (when manufacturing products with a large amount of molten plated metal deposited on the surface of the metal strip), edge overcoat becomes noticeable at the edge of the m plate, resulting in a decrease in the yield of molten metal and poor flatness (occurrence of selvage). bring about.
このため、ガスワイピング方法による連続溶融メッキに
おいては、金属帯の通板スピード(ラインスピード)は
150〜200 m/min 、又、溶融金属付着量の
薄目付化は80〜40 ?/rd (片面)がほぼ限界
とされている。For this reason, in continuous hot-dip plating using the gas wiping method, the metal strip passing speed (line speed) is 150 to 200 m/min, and the weight of the molten metal deposited is 80 to 40 m/min. /rd (single-sided) is considered to be almost the limit.
この発明は、ロール絞り方法、ガスワイピング方法がも
つ上記欠点を解決する溶融金属付着量制御方法を提案す
るもので、この発明は還元焼鈍を行った金属帯を酸化さ
せることなく連続的にメッキ浴内に導き引き続いてメッ
キ浴から連続的に引出して行う連続溶融メッキにおいて
、メッキ浴表面の金属帯立上り部を溶融塩によって囲繞
し、該溶融塩により金属帯表面の溶融メッキ金属付着量
を払拭調整する連続溶融メッキ方法であり、安価で経済
的に、溶融亜鉛メッキ鋼板の亜鉛付着量の制御を行う方
法を提案するものである。This invention proposes a method for controlling the amount of molten metal deposited to solve the above-mentioned drawbacks of the roll drawing method and the gas wiping method. In continuous hot-dip plating, which is performed by introducing the metal into the plating bath and then continuously pulling it out from the plating bath, the rising part of the metal band on the surface of the plating bath is surrounded by molten salt, and the molten salt wipes and adjusts the amount of hot-dip plated metal on the surface of the metal band. This is a continuous hot-dip plating method for controlling the amount of zinc deposited on hot-dip galvanized steel sheets at low cost and economically.
次に、この発明の詳細を図面に基いて説明する。Next, details of the invention will be explained based on the drawings.
第1図は、メッキ浴(2)から引き出される金属帯(3
)への溶融メッキ金属(4)の付着持ち上り状態を示す
もの、第2図はフィンスピードと溶融メッキ金属持ち上
り量との関係を示すものであり、金属帯(3)の速度が
速いほど溶融メッキ金属の付着厚みχが増加し、金属帯
(3)の溶融メッキ金属(4)の持ち上げ量が多くなる
ことを示している。Figure 1 shows the metal strip (3) drawn out from the plating bath (2).
). Figure 2 shows the relationship between the fin speed and the amount of hot-dip plated metal lifted up. The faster the speed of the metal strip (3), the more This shows that the adhesion thickness χ of the hot-dip plated metal increases, and the amount of lift of the hot-dip plated metal (4) on the metal band (3) increases.
第8図は、この発明によるものでメッキ浴表面の金属帯
立上り部を溶融塩(5)で囲繞し、該溶融塩(5)と溶
融メッキ金属(4)との界面での抵抗及び界面張力によ
りワイピングし、付着厚みχbを減少し、溶融メッキ金
属(4)の持ち上り量を抑制している状況を委すもので
ある。尚、溶融メッキ金属付着厚みχbは溶融塩の厚み
、溶融塩の種類を適宜変えることにより調整可能であり
、第4図(A)は溶融塩の種類を変化させた場合、第4
図(B)は溶融塩の厚みTを変化させた場合の溶融メッ
キ金属の持ち上り量変化を示す実験結果である。FIG. 8 shows a device according to the present invention in which the rising part of the metal band on the surface of the plating bath is surrounded by molten salt (5), and the resistance and interfacial tension at the interface between the molten salt (5) and the molten plated metal (4) are wiping, reducing the adhesion thickness χb, and suppressing the amount of lifting of the hot-dip plated metal (4). Incidentally, the hot-dip plating metal adhesion thickness χb can be adjusted by appropriately changing the thickness of the molten salt and the type of molten salt.
Figure (B) shows experimental results showing changes in the amount of lifting of the hot-dip plated metal when the thickness T of the molten salt is changed.
第4図(A)において溶融塩a、 b、 cはa;硝酸
塩、b:ハロゲン化塩、C:炭酸塩であり、速度はV、
< V2< V、の関係となっている。この実験結果
から、溶融塩Cを用いた場合、ガスワイピングメッキ時
の付着量と同一付着量を得るためには、フィンスピード
を■、→■2迄高速化できることが判る。又、第4図(
B)から溶融塩厚みTを変えても溶融メッキ金属持ち上
り量を制御できることがわかる。In FIG. 4(A), molten salts a, b, and c are a: nitrate, b: halide salt, C: carbonate, and the velocity is V,
The relationship is <V2<V. From this experimental result, it is clear that when molten salt C is used, the fin speed can be increased to ①→■2 in order to obtain the same deposition amount as that during gas wiping plating. Also, Figure 4 (
It can be seen from B) that even if the molten salt thickness T is changed, the amount of lifting of the molten plated metal can be controlled.
第5図は、この発明の1実施例を示している。FIG. 5 shows one embodiment of the invention.
この発明は、還元焼鈍を行った金属帯(3)をスナウト
(6)を介して酸化させることなく連続的にメッキ浴(
2)に導き、ジンクロール(7)を経て浴面から垂直に
引きあげる際、塩浴炉(9)内の溶融塩(5)の界面で
の抵抗及び界面張力により金属帯(3)への溶融メッキ
金属付着量(4)の払拭調整を行い、所定の付着厚さχ
bに調整するものである。In this invention, the reduction annealed metal band (3) is passed through the plating bath (6) continuously without being oxidized.
2), and when pulled vertically from the bath surface via the zinc roll (7), the resistance and interfacial tension at the interface of the molten salt (5) in the salt bath furnace (9) causes the metal strip (3) to be pulled up vertically from the bath surface. Adjust the amount of hot-dip plated metal adhesion (4) to reach the predetermined adhesion thickness χ
b.
なお、第5図の設備構成は以下の通りである。The equipment configuration shown in FIG. 5 is as follows.
(1)はメッキ槽、(2)はメッキ浴、(9)はメッキ
浴表面の金属帯(3)立上り部を囲繞する如く設けた塩
浴炉である。(1) is a plating tank, (2) is a plating bath, and (9) is a salt bath furnace provided so as to surround the rising portion of the metal band (3) on the surface of the plating bath.
この塩浴炉上部には金属帯通過用の開口(8)を有し、
底面は解放されその下部はメッキ浴(2)中に常時浅漬
されている。又、この塩浴炉内部には溶融塩(5)が浮
遊状態に置かれており、図示省略した電気ヒーター、誘
導加熱装置、燃焼バーナー等の加熱装置で加熱され、常
時適温にコントロールされている。01はメッキ槽(1
)の外部に設けたもう1つの塩浴炉であり、メッキ浴面
上の塩浴炉(9)に供給する溶融塩(5)を貯蔵するも
のであり、図示していないが適当な加熱装置で、内部溶
融塩(5)を適温にコントロールしている。0])は上
記塩浴炉(9)、QO内の溶融塩(5)、 (5)に連
通ずるパイプ、P、は該パイプ配管部に設けたポンプで
あり、塩浴炉00から塩浴炉(9)へ溶融塩(5)を供
給・排出し、塩浴炉(9)内の溶融塩層の厚みTの調整
を行うものである。The upper part of this salt bath furnace has an opening (8) for passing the metal band,
The bottom surface is open and the lower part is always shallowly immersed in the plating bath (2). Also, molten salt (5) is placed in a floating state inside this salt bath furnace, and is heated by heating devices such as an electric heater, an induction heating device, and a combustion burner (not shown), and is constantly controlled at an appropriate temperature. . 01 is the plating tank (1
) is another salt bath furnace installed outside the plating bath, which stores the molten salt (5) to be supplied to the salt bath furnace (9) on the surface of the plating bath, and is equipped with a suitable heating device (not shown). The internal molten salt (5) is controlled at an appropriate temperature. 0]) is a pipe that communicates with the salt bath furnace (9) and the molten salt (5) in the QO (5), and P is a pump installed in the pipe, which connects the salt bath furnace 00 to the salt bath. The molten salt (5) is supplied to and discharged from the furnace (9), and the thickness T of the molten salt layer in the salt bath furnace (9) is adjusted.
次に、この発明の溶融塩ワイピング法と従来のガスワイ
ピング法との払拭効果の比較試験結果を第6図に、又、
巾方向のメッキ付着量分布の均一性調査結果を第7図に
示す。Next, the results of a comparative test of the wiping effect between the molten salt wiping method of the present invention and the conventional gas wiping method are shown in FIG.
Figure 7 shows the results of an investigation on the uniformity of the distribution of plating deposits in the width direction.
試験ハ、0,8朋厚X914fflll巾の冷間圧延箔
コイルを無酸化炉方式連続溶融亜鉛メッキテストフィン
に、ラインスピード50〜400m/minの範囲で通
板し、第1表の条件で行った。Test C: A cold-rolled foil coil with a thickness of 0.8 mm and a width of 914 ffllll was passed through a continuous hot-dip galvanized test fin using a non-oxidizing furnace at a line speed of 50 to 400 m/min, and was conducted under the conditions shown in Table 1. Ta.
第 1 表
第1表の結果から、この発明が高速運転のもとで、亜鉛
付着量の制御を可能にした安価な溶融メッキ方法である
ことがわかる。Table 1 From the results shown in Table 1, it can be seen that the present invention is an inexpensive hot-dip plating method that makes it possible to control the amount of zinc deposited under high-speed operation.
この発明による効果をまとめると、次の通りである。The effects of this invention can be summarized as follows.
■ 溶融メッキ金属の付着量制御設備のコスト及び操業
経費が、従来のガスワイピング法に比し、安価である。■ The cost and operating expenses of the equipment for controlling the amount of hot-dip plated metal are lower than those of the conventional gas wiping method.
■ 金属帯の通板スピードが200 m/min以上の
高速になっても、極めてワイピング力が強く、高速メッ
キに適している。■ Even when the metal strip passes at a speed of 200 m/min or more, the wiping force is extremely strong, making it suitable for high-speed plating.
■ 溶融メッキ金属の付着量コントロールは、溶融塩の
厚みコントロールのみでよく、制御要因の把握が簡単で
自動制御に適している。■ Controlling the adhesion amount of hot-dip plated metal requires only controlling the thickness of the molten salt, making it easy to understand the control factors and suitable for automatic control.
■ 溶融塩でメッキ浴面が覆われるため、トップドロス
の発生が減少する。又、溶融塩の作用により金属帯全巾
に渡り均一にワイピング力が働くため、溶融メッキ金属
付着量の中方向分布の均一性が良く、余分に溶融メッキ
金属を着ける必要がなく、メッキ金属の使用原単位が向
上する。■ Since the plating bath surface is covered with molten salt, the occurrence of top dross is reduced. In addition, because the wiping force acts uniformly over the entire width of the metal strip due to the action of the molten salt, the distribution of the amount of molten metal deposited in the middle direction is more uniform, and there is no need to apply extra molten metal. Usage intensity improves.
第1図は溶融メッキ金属の付着状態を示す説明図、第2
図は金属帯の速度と溶融メッキ金属の持ち上り特性を示
す線図、第8図は溶融塩による溶融メッキ金属の払拭状
況を示す説明図、第4図(A)は溶融塩の種類と溶融メ
ッキ金属の持ち上り特性を示す線図、第4図(B)は溶
融塩の厚みと溶融メッキ金属の持ち上り特性を示す線図
、第5図はこの発明の実施例を示す装置の説明図、第6
図は溶融塩ワイピング法とガスワイピング法の払拭効果
比較試験データを示す線図、第7図は溶融塩ワイピ属、
5・・・溶融塩、9.lO・・・塩浴炉、11・・・パ
イプ、P、・・・ポンプ。
出願人 住友金属工業株式会社
代理人 押 1) 良 久
第1図
T
第2図
ライシンし一団→
第3図
↑
第4図
(A) (B)ノ]C
ノソ 71cmノア
第5図
370
第6図
ライシンし一ド(w/wiw)
市方向イ立置Figure 1 is an explanatory diagram showing the state of adhesion of hot-dip plated metal, Figure 2
The figure is a diagram showing the speed of the metal strip and the lifting characteristics of hot-dip plated metal, Figure 8 is an explanatory diagram showing the wiping status of hot-dip plated metal by molten salt, and Figure 4 (A) is a diagram showing the type of molten salt and the molten metal. A diagram showing the lifting characteristics of plated metal, FIG. 4(B) is a diagram showing the thickness of molten salt and lifting characteristics of molten plated metal, and FIG. 5 is an explanatory diagram of an apparatus showing an embodiment of the present invention. , 6th
The figure is a diagram showing comparative test data on the wiping effects of the molten salt wiping method and the gas wiping method.
5... Molten salt, 9. lO...Salt bath furnace, 11...Pipe, P,...Pump. Applicant Sumitomo Metal Industries Co., Ltd. Agent Press 1) Yoshihisa Figure 1 T Figure 2 Raishin group → Figure 3 ↑ Figure 4 (A) (B) ノ] C
Noso 71cm Noah Figure 5 370 Figure 6 Raishin Shiichido (w/wiw) Standing in the direction of the city
Claims (1)
メッキ浴内に導き引き続いてメッキ浴から連続的に引出
して行う連続溶融メッキにおいて、メッキ浴表面の金属
帯立上り部を溶融塩によって囲繞し、該溶融塩により金
属帯表面の溶融メッキ金属付着量を払拭調整することを
特徴とする連続溶融メッキ方法。In continuous hot-dip plating, in which a reduction-annealed metal strip is continuously introduced into a plating bath without being oxidized and then continuously pulled out of the plating bath, the rising part of the metal strip on the surface of the plating bath is surrounded by molten salt. A continuous hot-dip plating method, characterized in that the amount of hot-dip plating metal deposited on the surface of a metal strip is adjusted by wiping with the molten salt.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58020370A JPS59145774A (en) | 1983-02-09 | 1983-02-09 | Continuous hot dipping method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58020370A JPS59145774A (en) | 1983-02-09 | 1983-02-09 | Continuous hot dipping method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59145774A true JPS59145774A (en) | 1984-08-21 |
Family
ID=12025181
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58020370A Pending JPS59145774A (en) | 1983-02-09 | 1983-02-09 | Continuous hot dipping method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59145774A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6160873A (en) * | 1984-08-31 | 1986-03-28 | Hitachi Cable Ltd | Hot dipping method |
-
1983
- 1983-02-09 JP JP58020370A patent/JPS59145774A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6160873A (en) * | 1984-08-31 | 1986-03-28 | Hitachi Cable Ltd | Hot dipping method |
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