JPS59145003U - Chip-shaped electronic components - Google Patents
Chip-shaped electronic componentsInfo
- Publication number
- JPS59145003U JPS59145003U JP3884483U JP3884483U JPS59145003U JP S59145003 U JPS59145003 U JP S59145003U JP 3884483 U JP3884483 U JP 3884483U JP 3884483 U JP3884483 U JP 3884483U JP S59145003 U JPS59145003 U JP S59145003U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- electronic components
- shaped electronic
- ceramic substrate
- conductive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Details Of Resistors (AREA)
- Adjustable Resistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のチップ状半固定抵抗器の平面図である。
第２図は第１図のチップ状半固定抵抗器のｎ−ｎ線に沿
う矢印方向の断面図である。第３図はこの考案の一実施
例であるチップ状半固定抵抗器の平面図である第４図は
第３図のチップ状半固定抵抗器のＩＶ−ＩＶ線に沿う矢
印方向の断面図である。
１・・・セラミック基板、１ａ・・・−主面、１ｂ・・
・他主面、６・・・電子部品要素（抵抗層）、７・・・
摺動子、１４．１５・・・端子部、１６．１７・・・導
電層、１８゜１９・・・半田、２０．２１・・・金属端
子。FIG. 1 is a plan view of a conventional chip-shaped semi-fixed resistor. FIG. 2 is a cross-sectional view of the chip-shaped semi-fixed resistor of FIG. 1 taken along line nn in the direction of the arrow. FIG. 3 is a plan view of a chip-shaped semi-fixed resistor that is an embodiment of this invention. FIG. 4 is a cross-sectional view of the chip-shaped semi-fixed resistor in FIG. 3 along the line IV-IV. be. 1...Ceramic substrate, 1a...-main surface, 1b...
・Other main surface, 6... Electronic component element (resistance layer), 7...
Slider, 14.15... Terminal portion, 16.17... Conductive layer, 18°19... Solder, 20.21... Metal terminal.
Claims (1)
端を導電ペーストで形成された導電層に接続し、各導電
層に断面コ字形の金属端子をその凹部でセラミック基板
を挾持するように固着してなるチップ状電子部品。Both ends of the electronic component element formed on one main surface of the ceramic substrate are connected to a conductive layer made of conductive paste, and a metal terminal with a U-shaped cross section is fixed to each conductive layer so that the ceramic substrate is held in its recess. Chip-shaped electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3884483U JPS59145003U (en) | 1983-03-17 | 1983-03-17 | Chip-shaped electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3884483U JPS59145003U (en) | 1983-03-17 | 1983-03-17 | Chip-shaped electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59145003U true JPS59145003U (en) | 1984-09-28 |
Family
ID=30169510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3884483U Pending JPS59145003U (en) | 1983-03-17 | 1983-03-17 | Chip-shaped electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59145003U (en) |
-
1983
- 1983-03-17 JP JP3884483U patent/JPS59145003U/en active Pending
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