JPS59144146A - Manufacture of hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To reduce the number of manufacturing steps by sealing with protecting resin a semiconductor chip and soldering an electronic part only for good chip and part inspected in an intermediate characteristic inspection. CONSTITUTION:A semiconductor chip 3 is bonded with conductive bonding resin 4 on a die pad of wiring conductors 2 on an insulating substrate 1, an electronic circuit part 7 is bonded with the resin 4 on the conductors 2, and thermally cured. Subsequently, the chip 3 is wire bonded via fine metal wirings 3 to the conductors 2, and an intermediate characteristic inspection is achieved. The good chip 3 is covered with protective resin 5 at the part of the chip 3, thermally cured, and the part 7 is soldered to the conductors 2. The improper chip is replaced by the proper chip and similarly treated. In this manner, the number of manufacturing steps can be reduced, thereby improving the yield of the products.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an improvement in a method for manufacturing a hybrid integrated circuit device in which a semiconductor chip and electronic circuit components are mounted on an insulating substrate.

[Prior art]

BACKGROUND ART In recent years, electronic circuit components such as semiconductor elements and multilayer chip capacitors have been miniaturized, and hybrid integrated circuit devices (hereinafter abbreviated as rH-0j) in which these components are mounted on an insulating substrate have been used in large quantities. Recently, in order to further downsize HICs, semiconductor device manufacturers have mass-produced HIOs in which a single semiconductor chip is mounted on an insulating substrate, and these have come to be used in all fields.

A conventional HIC manufacturing method will be explained with reference to FIGS. 1 and 2. FIG. 1 is a sectional view of the HIC before the chip capacitor is attached. Wiring conductor (2) on insulating substrate (1)
) is formed. A semiconductor chip (3) is firmly bonded to the die pad portion on this wiring conductor (2) with a fixing resin (4), and then the resin is cured. Subsequently, the semiconductor chip (3) and the corresponding wiring conductor (2) are connected by wire bonding using a thin metal wire (5) such as a gold wire or an aluminum wire. next,
Cover the semiconductor chip (3) with the protective resin (6) and
Heat treatment is performed at a temperature of 5° C. for several hours to harden and seal.

Next, as shown in the cross-sectional view in Fig. 2, a multilayer chip capacitor (hereinafter abbreviated as "chip capacitor") (7)
An electronic circuit component such as the above is placed on the wiring conductor (2) and adhered onto the insulating substrate +1j with a temporary bonding resin (8), and the resin is heated and cured. The device in this state is immersed in a molten solder bath, the chip capacitor (7) is soldered to the wiring conductor (2),
He had completed HIC. (9) is a joining solder.

In the above conventional manufacturing method, the fixing resin (4), the protective resin (
In each step of heating and curing 6) and tacking resin (8), it is necessary to heat each of them at a temperature of 100° C. or more for about 1 hour or more. This takes a lot of time, and the surface of the wiring conductor (2) oxidizes due to long-term heating, resulting in poor wetting of the joining solder (9) when soldering the chip capacitor (7). The attachment was defective.

In addition, in the conventional method, the chip capacitor (7) is soldered after being covered with a protective resin (6) and cured by heating, and the H'IO
However, if the semiconductor chip (3) is defective, the semiconductor chip (3) sealed with the hardened protective resin (6) cannot be replaced with a good one, and this HIC
was a defective product. In the HIC, only one semiconductor chip (3) is shown for simplicity in Figures 1 and 2 above, but in reality, high-density packaging is required, and a large number of semiconductor chips (3) are required. Since the semiconductor chips are mounted on an insulating substrate +l+, the fact that defective semiconductor chips cannot be replaced has been a major problem, lowering the yield of products.

[Summary of the invention]

This invention was made in order to improve the drawbacks of the above-mentioned conventional methods. A semiconductor chip and an electronic circuit component are fixed to a wiring conductor on an insulating substrate with a bonding resin, and after the semiconductor chip is wire-bonded, an intermediate Characteristics are inspected and defective semiconductor chips are replaced with non-defective ones. Afterwards, the semiconductor chip is sealed with a protective resin and the electronic components are soldered together using solder immersion, reducing the number of manufacturing steps and the required time. It is an object of the present invention to provide a method for manufacturing a hybrid integrated circuit device that improves yield and reduces cost.

[Embodiments of the invention]

Hereinafter, a method for manufacturing HIC according to an embodiment of the present invention will be described.
This will be explained with reference to FIGS. 3 and 4. First, as shown in the cross-sectional view in Fig. 3, a semiconductor chip (3) is placed on a die pad part of a wiring conductor (2) formed on an insulating substrate (1) using a conductive adhesive resin (4). Once glued, place the chip capacitor (7) on the wiring conductor (2) and glue it with Xf resin (4).
and heat-cure both adhesive resins (4). Next, the semiconductor chip (3) is connected to the corresponding wiring conductor (2).
) with a thin metal wire (3). After that, H.I.
The intermediate characteristics of C are inspected, and those that are good are sent to the next process shown in FIG. Here, the semiconductor chip (3) portion is covered with a protective resin (5) and sealed by heating and curing at a temperature of about 25°C. The device in this state is immersed in molten solder, the chip capacitor (7) is soldered to the wiring conductor (2),
Complete HIC.

On the other hand, the semiconductor chips (3
) is replaced with a non-defective product, installed, re-inspected for characteristics to confirm that it is non-defective, and sent to the next process in the same manner as above, sealed with protective resin (5) and processed in the subsequent process.

In the above embodiment, the adhesive resin (4) to which the semiconductor chip (3) is die-bonded is conductive, but it can also be applied to an insulating resin. In this case, the characteristic test is performed by electrically welding the electrode portion of the electronic circuit component such as the chip capacitor (7) to the wiring conductor (2) during measurement.

Further, in the above embodiment, a case was shown in which a TEP capacitor (6) was installed as an electronic circuit component, but the present invention is not limited to this and can be applied to cases in which other types of electronic circuit components are installed.

[Effects of the Invention] As described above, according to the manufacturing method of the present invention, a semiconductor chip and an electronic circuit component are fixed to a wiring conductor on an insulating substrate in the same process with a fixing resin, and the semiconductor chip is After wire bonding, conduct an intermediate characteristic test. If there is a defective semiconductor chip or electronic circuit component, replace it with a good one and reinstall it. The semiconductor chip part is sealed with a protective resin, and the electronic circuit component is soldered by dipping in solder. By bonding, the number of manufacturing steps is reduced, the required time is shortened, the yield of the product is improved, the cost is reduced, and a highly reliable hybrid integrated circuit device can be obtained.

[Brief explanation of drawings]

Fig. 1 is a schematic cross-sectional view showing the state of a hybrid integrated circuit device manufactured by a conventional manufacturing method before chip capacitors are mounted, Fig. 2 is a schematic cross-sectional view showing the device constructed from the state shown in Fig. 1, and Fig. 3 is A schematic sectional view showing a state before resin sealing of a semiconductor chip portion of a hybrid integrated circuit device according to a manufacturing method according to an embodiment of the present invention, and FIG. 4 is a schematic sectional view showing a device constructed from the state shown in FIG. 3. It is. In the figure, 1... Insulated substrate, 2... Wiring conductor, 3
...semiconductor chip, 4. . . . Fixed resin, 5. Thin metal wire, 6. Protective resin, 7. Multilayer chip capacitor forming an electronic circuit component, 9. Bonding solder. Note that the same reference numerals in the figures indicate the same or equivalent parts. Agent Shin Kuzuno - (1 other person) Figure 1 Figure 2 Figure 3 Figure 4

Claims (1)

[Claims] A semiconductor chip is die-bonded with adhesive resin onto the die pad portion of the wiring conductor formed on the insulating substrate, and in the same process, electronic circuit components are temporarily attached onto the wiring conductor with adhesive resin to correspond to the semiconductor chip. The above wiring conductor is wire-bonded with a thin metal wire, and in this state, an intermediate characteristic test is performed, and if the above semiconductor chip is defective, it is replaced with a good one and installed, and the above semiconductor chip part is sealed with a protective resin. . A method for manufacturing a hybrid integrated circuit device, which comprises curing the protective resin and then soldering the electronic circuit components by solder dipping.