JPS5914336U - Pressure contact type semiconductor device - Google Patents
Pressure contact type semiconductor deviceInfo
- Publication number
- JPS5914336U JPS5914336U JP10911982U JP10911982U JPS5914336U JP S5914336 U JPS5914336 U JP S5914336U JP 10911982 U JP10911982 U JP 10911982U JP 10911982 U JP10911982 U JP 10911982U JP S5914336 U JPS5914336 U JP S5914336U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- type semiconductor
- contact type
- pressure contact
- outer ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Die Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来の圧接型半導体装置の断面図、第2図a、
b、 cは本考案の一実施例に係る圧接型半導体
装置の組立手順を説明するためのスタッド外周リングの
部分側面図a1上面図b1部分断面図Cである。
1・・・・・・スタッド、1a、11a・・・・・・ス
タッド外周リング、2・・・・・・絶縁リング、3・・
・・・・半導体素子、4・・・・・・カソード端子、5
・・・・・・絶縁板、6・・・・・・平ワツシヤ、7・
・・・・・皿ばね、15.25・・・・・・係止爪、1
6・・・・・・貫通溝。Figure 1 is a cross-sectional view of a conventional pressure contact type semiconductor device, Figure 2a,
b and c are a partial side view a1 a top view b1 a partial sectional view C of a stud outer ring for explaining the assembly procedure of a pressure contact type semiconductor device according to an embodiment of the present invention; 1...Stud, 1a, 11a...Stud outer ring, 2...Insulation ring, 3...
... Semiconductor element, 4 ... Cathode terminal, 5
...Insulating plate, 6...Flat washers, 7.
... Disc spring, 15.25 ... Locking claw, 1
6......through groove.
Claims (1)
を介して前記半導体素子をスタッド台部に圧接固定した
圧接型半導体装置において、前記スタッド外周リングに
予じめ縦方向に平行する2個の短い貫通溝の組を少くと
も3個所に形成しておき、この2個の貫通溝の間を前記
スタッド外周リング内側に押し出すことにより前記加圧
部材を圧縮状態で係止したことを特徴とする圧接型半導
体装置。In a press-contact type semiconductor device in which a semiconductor element is housed inside a stud outer ring and the semiconductor element is press-fitted to a stud base via a pressure member, two short pieces vertically parallel to the stud outer ring are provided in advance. Pressure welding characterized in that sets of through grooves are formed in at least three locations, and the pressure member is locked in a compressed state by pushing out the space between the two through grooves to the inside of the stud outer ring. type semiconductor device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10911982U JPS5914336U (en) | 1982-07-19 | 1982-07-19 | Pressure contact type semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10911982U JPS5914336U (en) | 1982-07-19 | 1982-07-19 | Pressure contact type semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5914336U true JPS5914336U (en) | 1984-01-28 |
Family
ID=30254315
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10911982U Pending JPS5914336U (en) | 1982-07-19 | 1982-07-19 | Pressure contact type semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5914336U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02293123A (en) * | 1989-05-08 | 1990-12-04 | Takuma Co Ltd | Manufacture of antibacterial resin molding |
-
1982
- 1982-07-19 JP JP10911982U patent/JPS5914336U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02293123A (en) * | 1989-05-08 | 1990-12-04 | Takuma Co Ltd | Manufacture of antibacterial resin molding |
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