JPS5914336U - Pressure contact type semiconductor device - Google Patents

Pressure contact type semiconductor device

Info

Publication number
JPS5914336U
JPS5914336U JP10911982U JP10911982U JPS5914336U JP S5914336 U JPS5914336 U JP S5914336U JP 10911982 U JP10911982 U JP 10911982U JP 10911982 U JP10911982 U JP 10911982U JP S5914336 U JPS5914336 U JP S5914336U
Authority
JP
Japan
Prior art keywords
semiconductor device
type semiconductor
contact type
pressure contact
outer ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10911982U
Other languages
Japanese (ja)
Inventor
義夫 大塚
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP10911982U priority Critical patent/JPS5914336U/en
Publication of JPS5914336U publication Critical patent/JPS5914336U/en
Pending legal-status Critical Current

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  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の圧接型半導体装置の断面図、第2図a、
  b、  cは本考案の一実施例に係る圧接型半導体
装置の組立手順を説明するためのスタッド外周リングの
部分側面図a1上面図b1部分断面図Cである。 1・・・・・・スタッド、1a、11a・・・・・・ス
タッド外周リング、2・・・・・・絶縁リング、3・・
・・・・半導体素子、4・・・・・・カソード端子、5
・・・・・・絶縁板、6・・・・・・平ワツシヤ、7・
・・・・・皿ばね、15.25・・・・・・係止爪、1
6・・・・・・貫通溝。
Figure 1 is a cross-sectional view of a conventional pressure contact type semiconductor device, Figure 2a,
b and c are a partial side view a1 a top view b1 a partial sectional view C of a stud outer ring for explaining the assembly procedure of a pressure contact type semiconductor device according to an embodiment of the present invention; 1...Stud, 1a, 11a...Stud outer ring, 2...Insulation ring, 3...
... Semiconductor element, 4 ... Cathode terminal, 5
...Insulating plate, 6...Flat washers, 7.
... Disc spring, 15.25 ... Locking claw, 1
6......through groove.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] スタッド外周リング内側に半導体素子を収容し加圧部材
を介して前記半導体素子をスタッド台部に圧接固定した
圧接型半導体装置において、前記スタッド外周リングに
予じめ縦方向に平行する2個の短い貫通溝の組を少くと
も3個所に形成しておき、この2個の貫通溝の間を前記
スタッド外周リング内側に押し出すことにより前記加圧
部材を圧縮状態で係止したことを特徴とする圧接型半導
体装置。
In a press-contact type semiconductor device in which a semiconductor element is housed inside a stud outer ring and the semiconductor element is press-fitted to a stud base via a pressure member, two short pieces vertically parallel to the stud outer ring are provided in advance. Pressure welding characterized in that sets of through grooves are formed in at least three locations, and the pressure member is locked in a compressed state by pushing out the space between the two through grooves to the inside of the stud outer ring. type semiconductor device.
JP10911982U 1982-07-19 1982-07-19 Pressure contact type semiconductor device Pending JPS5914336U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10911982U JPS5914336U (en) 1982-07-19 1982-07-19 Pressure contact type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10911982U JPS5914336U (en) 1982-07-19 1982-07-19 Pressure contact type semiconductor device

Publications (1)

Publication Number Publication Date
JPS5914336U true JPS5914336U (en) 1984-01-28

Family

ID=30254315

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10911982U Pending JPS5914336U (en) 1982-07-19 1982-07-19 Pressure contact type semiconductor device

Country Status (1)

Country Link
JP (1) JPS5914336U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02293123A (en) * 1989-05-08 1990-12-04 Takuma Co Ltd Manufacture of antibacterial resin molding

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02293123A (en) * 1989-05-08 1990-12-04 Takuma Co Ltd Manufacture of antibacterial resin molding

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