JPS59142971A - Package of electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a package for electronic components such as "ceramic capacitors".

For example, when transporting electronic components such as ceramic capacitors that have lead wires running in the same direction, the lower ends of the lead wires of many electronic components are fixed to a band-shaped support at regular intervals, and this support plate is placed inside the case as appropriate. Store and transport as a package.

The transported electronic components are removed from the package and placed on a printed circuit board, etc., but in the case of automatic assembly, the electronic components attached to the support must be lined up in the same orderly manner at regular intervals as before transportation. .

However, during transportation, there are various iΦs in the package.
Each time an impact is applied, the internal electronic components move, causing travel that can cause the band-shaped support to bend, the lead wires of the electronic components to slant, and adjacent electronic components to become entangled.

This invention was made in order to solve the above-mentioned problem of conventional electronic component packaging.
The purpose of the present invention is to provide a package for electronic components in which the internal electronic components maintain a fixed position even when various shocks are applied to the package, and the electronic components can be taken out of the package after transportation and immediately placed on an automatic assembly machine. shall be.

The structure of the present invention is that a band-shaped support on which a large number of electronic components are fixed at regular intervals is bent in a zigzag pattern and housed in a case, and each electronic component on the support is perpendicular to the support. A spacing member is provided on the lower surface of the lid that closes the upper opening of the case so as to be aligned in the same direction as above, and that fits between each electronic component and prevents movement of the electronic component. The distance retaining member stabilizes the electronic component once it is attached to the holder, and prevents the electronic component from moving against various shocks during transportation.

Embodiments of the package of the present invention will be described below with reference to the accompanying drawings.

Reference numeral 1 denotes a case made of corrugated paper or the like, and N2 made of the same material is attached to the side wall of the case through the folds, and a flap 3 is provided on the outside of the lid 2 through the folds.

, 4 is a strip-shaped support made of base paper or the like, and b is an electronic component such as a reramic capacitor.

A large number of electronic components 5 are arranged at regular intervals on the support 4 by attaching the lower ends of the lead wires 6 of the electronic components 5 to the support 4 and pasting adhesive tape 7 thereon. .

Band-shaped support 4 to which a large number of electronic components 5 are attached as described above
As shown in FIG. 4, it is folded in a zigzag manner, that is, folded back in alternating directions in opposite directions by the folding parts 8 and 9, and then stored in the case 1 with the electronic component 5 facing upward.

When the support body 4 is alternately folded back to a certain length in a zigzag pattern and stored in the case 1 as described above, each electronic component 5 is arranged vertically and horizontally as shown in the plan view of FIG. As shown in FIG. 4, a cushioning material 10 such as a sponge is inserted into one side of the inner part, and the both ends 11 are pressed with a flat plate 12 made of a material such as corrugated paper. Note that when taking out the electronic component from the package, it is preferable to take it out from the side where the flat plate 12 is provided.

After storing the support 4 supporting the electronic components 5 in the case 1 as described above, the opening on the case 1 is closed with the lid 2, but when the case 1 is closed with the inner surface of the lid 2, that is, with the lid 2. A plurality of spacing members 13 are fixed to the lower surface.

This spacing member 13 is connected to the electronic component 5 fixed to the support 4.
It is fixed to the tray 2 at the same pitch as the lid 2, and is attached in a direction perpendicular to the band-shaped support 4 inside the case 1, so when the opening of the case 1 is closed with the lid 2, each support member 13 becomes as shown in FIG. It enters between the electronic components 5 and prevents the electronic components 5 from moving from side to side.

Thereafter, the flaps 3 are stacked on the inside or outside of the side wall of the case 1 and pasted using adhesive tape, and both sides of N2 are also pasted using adhesive tape or the like.

The above example shows the case where the spacing member 13 is directly fixed to N2, but in addition, as shown in FIG.
Spacing members 13 are provided at regular intervals on the lower surface of this top plate 14, and as shown in FIG. 5, the spacing members 13 are interposed between electronic components. In some cases, the lid 2 is placed on the lid 2 and fixed with adhesive tape in the same manner as in the above example.

Since this invention has the above configuration, it has the following effects.

The wire saw 6 of each electronic FSIS product 5 stored in the Kusco is fixed to a support 4 at its lower part, and this support 4 is bent in a zigzag shape inside the case so that the front and rear parts 5 are in contact with each other. Because of this, it does not move forward or backward.

In the horizontal and vertical directions, since the spacing member 13 is interposed between the electronic components 5, movement of each electronic component 5 in the left-right direction is also prevented.

Therefore, even if the package is subjected to various shocks during transportation, the electronic components inside will not move much. Therefore, problems such as adjacent electronic components 5 becoming entangled or bending of lead wires 6 during transportation are almost eliminated, and electronic components taken out of packages can be immediately transferred to automatic machines. be.

[Brief explanation of drawings]

FIG. 1 is a partially cutaway perspective view of an electronic component packaged in the package of the present invention, FIG. 2 is a longitudinal sectional front view of the package of the present invention, FIG. 3 is a partially longitudinal sectional side view of the same, and FIG. Similarly, FIG. 5 is a plan view with a portion of the lid cut away, and FIG. 5 is a partially longitudinal front view showing an embodiment of the lid. 1... Case 2... Lid 4... Support 5.
・・Electronic components 6・Leet wire 13・Spacing member patent applicant Murata Manufacturing Co., Ltd.

Claims (3)

[Claims] (1) In a case where a band-shaped support on which a large number of electronic components are fixed at regular intervals is bent in a zigzag pattern and stored in a case, each electronic component on the support is aligned in a direction perpendicular to the support. Under the lid that closes the upper opening of the case, a spacing member (to prevent movement of the electronic components) is provided in parallel between each of the electronic components arranged as described above. An electronic component package characterized by: (2) The electronic component package as set forth in claim 1, characterized in that an electronic component spacing member is integrally provided on the lower surface of the lid that closes the upper opening of the case. (3) Claim 1, characterized in that another plate is applied to the lower surface of the lid that closes the upper opening of the case, and a spacing member for electronic components is integrally provided on the lower surface of this plate. Package of electronic components listed in .