JPS59136950U - 管継手 - Google Patents
管継手Info
- Publication number
- JPS59136950U JPS59136950U JP2961883U JP2961883U JPS59136950U JP S59136950 U JPS59136950 U JP S59136950U JP 2961883 U JP2961883 U JP 2961883U JP 2961883 U JP2961883 U JP 2961883U JP S59136950 U JPS59136950 U JP S59136950U
- Authority
- JP
- Japan
- Prior art keywords
- space
- pipe joint
- pipe
- sub
- cylindrical body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 238000005192 partition Methods 0.000 claims description 2
- 239000007921 spray Substances 0.000 claims description 2
Landscapes
- Quick-Acting Or Multi-Walled Pipe Joints (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2961883U JPS59136950U (ja) | 1983-02-28 | 1983-02-28 | 管継手 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2961883U JPS59136950U (ja) | 1983-02-28 | 1983-02-28 | 管継手 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59136950U true JPS59136950U (ja) | 1984-09-12 |
| JPH0212866Y2 JPH0212866Y2 (enExample) | 1990-04-10 |
Family
ID=30160479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2961883U Granted JPS59136950U (ja) | 1983-02-28 | 1983-02-28 | 管継手 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59136950U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7144805B2 (en) | 1998-02-04 | 2006-12-05 | Semitool, Inc. | Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current density |
-
1983
- 1983-02-28 JP JP2961883U patent/JPS59136950U/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7144805B2 (en) | 1998-02-04 | 2006-12-05 | Semitool, Inc. | Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current density |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0212866Y2 (enExample) | 1990-04-10 |
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